Ep optima synopsis

Participants

LEP (F), EPI (UK), Daimler-Benz (D), Thomson-CSF (F), GMMT (UK), Ferdinand Braun Institut (D), Freiberger (D), Picogiga (F), Siemens (D), Thomson LCR (F), FhG (D), Forth (GR).
Contact Point Duration

J-P Andre 21 months from 01.05.96

Laboratoires d'Electronique Philips

22 avenue Descartes - BP 15

94453 Limeil Brévannes Cedex (France)
tel: [phone]

fax: [phone]

E-mail: [e-mail]

EP 23229 BETA

Bipolar Epitaxial Si/SiGe Technologies for RF Applications
Summary

The aim of the project is to establish the added value of bipolar SiGe ICs with respect to Si-based and III-V solutions by both developing the required process technology and by demonstrating the manufacturability in application specific designs.

Objectives

• 
  Several application specific circuits based on the bipolar SiGe technology (time division multiplexer, divider, broad-band amplifier, LNA). These circuits will be state-of-the-art in terms of complexity (design and technology) and performance.
  
• 
  Establish the technological targets which are expected to be necessary to realise these circuits.
  
• 
  A technical and economical benchmark of the SiGe based circuitry as compared with Si-based and III-V based equivalents.
  
• 
  A process technology available for selected key customers.
  

Participants

Philips (NL), Siemens (D), Temic (D), Ericsson (S).
Contact Point Duration

Carel J. van der Poel 36 months from 01.01.96

Philips Research

Prof. Holstlaan 4 (WAG14)

5656 AA EINDHOVEN (The Netherlands)
tel: [phone]

fax: [phone]

e-mail: [e-mail]


Microsystems

EP 20342 DEEMO

Dry-Etching, Electroplating and Moulding
Summary

A LIGA-like microsystem process to produce 3-dimensional microstructures with high aspect ratios will be developed. The development is based on an inexpensive fabrication process for microstructuring of different materials using high aspect ratio dry etching and reproduction in plastic microstructures with IC tolerances. Microassembly of the structures will also form part of the project. The technology will be suited for economical fast prototyping as well as production of certain products.

Objectives

· Development of fast and versatile fabrication processes for mould inserts by means of high aspect ratio dry etching of silicon and metals. The silicon moulds can be used for an electroplating process, resulting in metal mould inserts for production of microstructures by means of moulding and embossing. The aspect ratios to be expected are 10 to 20 typically at diameters in the range of microns with profile control for releasing the structures.

· Development of a rapid prototyping process for microstructures with IC accuracy by means of e-beam lithography, dry etching and embossing.
· Demonstration of the process by selecting a pilot customer and fabricating the customer specific microstructures. Within this pilot production, a reduction of assembly costs and time will be demonstrated.
Participants__Microparts_(D);'>Participants

Microparts (D); Micro*Montage (D); MESA (NL).
Contact Point Duration

Dr. K. Kadel 30 months from 01.11.95

Microparts

Hauert 7

44227 Dortmund (Germany)
tel: [phone]

fax: [phone]

E-mail: kadel@microparts .de

EP 20360 MAGIC

Magnetic Integrated Circuits for Industrial Switch and Sensor Applications
Summary

The goal of the project is to deliver packaged and tested evaluation samples of several specific CMOS integrated magnetic microsystems for a variety of attractive high volume applications as well as high-end safety products. The main objective is to elaborate, consolidate and to transfer to the industrial environment the know-how for mass production of versatile integrated microsystems based on magnetic sensors. The common ground is the design and test of CMOS based magnetic sensor and interface circuit prototypes by ETH Zürich and the University of Pavia, and their manufacturing by AMS.

Objectives

The work is centred around four demonstrators:

· Magnetic microswitch based on magnetic integrated circuits for automotive applications, to be exploited mainly by SAIA. The need to introduce a new technology for low current applications is dictated by SAIA's customers in view of potential Far Eastern and North American competition.
· Programmable rotary switch based on integrated magnetic sensors for consumer applications, to be exploited mainly by Seuffer. By mid 1996, a demand for engineering samples of electronic switchboards is anticipated, in order to replace the present electromechanical products.
· Current monitor based on integrated magnetic sensors for high-voltage power supplies and commercial vehicles, to be exploited mainly by CAEN and Seuffer.
· Three-dimensional magnetic badge to record exposure to magnetic fields based on integrated magnetic vector sensors, to be exploited primarily by CAEN. The targeted high-end product might be favoured by legislation in the medium term.
Participants__CP_Clare_(B);'>Participants

CAEN SpA (I), AMS (A), ETH Zürich (CH), SAIA (CH), Seuffer (D), Pavia Univ. (I)
Contact Point Duration

Fabrizio Catarsi 36 months from 01.01.96

CAEN S.p.A.

Via Vetraia 11

55049 VIAREGGIO (Italy)
tel: [phone]

fax: [phone]

E-mail: [e-mail] or [e-mail]

EP 20679 MIRS

Micromachined Integrated Relay System
Summary

A cost-effective micromachined integrated relay is to be developed. The new feature of this relay is that it combines a hard-metal contact, electromagnetic actuation, as well as electronic circuitry on the same silicon substrate. The relay will be manufactured in a batch process in a way similar to IC fabrication. The feasibility of electromagnetic principles that are commonly employed in conventional reed relays for actuation of the relay will be investigated. Furthermore, special attention will be given to the development of reliable electrical contacts and of a suitable packaging technology. The actuator (e.g. a coil), the electrical contacts and the moving mechanical parts will be fabricated in an integrated process sequence using micromachining technologies.

Objectives

· Development of a novel, low-cost, high quality switching technology, which combines the switching advantages of solid-state relays with those of hard-metal-contact relays where added value electronics can be implemented on a single silicon substrate.

· The microrelay must be small, display a low and stable contact resistance, a high off-resistance and be low-cost.

· Development of a cost-effective fabrication process based on micromachining technologies for hard-contact relays with integrated electronic circuitry.

· Development of a contact technology that guarantees the required contact characteristics for life and which is fully compatible and integrated with the actuator technology and movable mechanical parts.

· Development of a low-cost packaging technology.

· Operative microrelays demonstrating the tools, features and technologies developed are to be produced. These will undergo full reliability testing in real user applications.

Participants

CP Clare (B); CSEM (CH); IMEC (B); Aritech (NL); SPEA (I).
Contact Point Duration

Harrie A. C. Tilmans 29 months from 15.11.95

CP Clare Corporation

Overhaamlaan 40

B-3700 Tongeren, (Belgium)
tel: [phone]

fax: [phone]

E-mail: [e-mail]

EP 21458 Si-GYRO

Silicon Surface Micromachined Gyroscope for Mass Market Applications
Summary

A surface micromachined one-axis gyroscope mainly for automotive applications with strong market penetration is to be developed based on Thick Polysilicon Surface Micromachining (TPSM) technology. The basic process will be improved to meet the stringent requirements of the gyroscope application with respect to critical material and process parameters (control of active polysilicon layer stress and stress gradients, surface roughness, inclusion of a buried polysilicon contact layer, accuracy and aspect ratio of the microstructuring process, sacrificial etching techniques, housing and vacuum encapsulation of the sensor elements). Driving and evaluation circuitry will be realised on a separate chip and combined with the sensing device by hybrid mounting.

Objectives

· Installation of a club of (automotive) end users to agree on a broadly based specification.

· Development of a surface micromachined gyroscope device for automotive applications with high resolution angular rotation (0.5 °/sec) and offset stability (0.1...1°/sec), based on the TPSM process.

· Reduction of thick polysilicon stress, stress gradients and surface roughness to extend the application of the TPSM process to the gyroscope.

· Introduction of a buried polysilicon layer with low electrical resistivity into the TPSM process. This layer is needed for capacitor fields underneath the moving gyroscope structures which provide the sensor signal, and for electrical contacting.

· Improvement of the high density plasma etching process. This is the key process for silicon surface micromachining and determines the quality of the sensor structures.

· Development of electronic circuitry to drive the sensor oscillation and detect the yaw rate signal. A breadboard version of the evaluation electronics will be debugged and optimised, serving as the basis for a monolithically integrated circuit chip.

· Fabrication of a demonstrator with sensor element and electronic circuit chip mounted together in a metal housing which will be evacuated and hermetically sealed.

Participants___R'>Participants

Robert Bosch GmbH (D), STS Ltd. (UK), CNM (E), Volvo (S)
Contact Point Duration

Franz Laermer 36 months from 01.03.96

Robert Bosch GmbH, FV/FLD
Postfach 10 60 50

70049 Stuttgart (Germany)
tel: [phone]

fax: [phone]

E-mail: [e-mail]

EP 21796 IRMA

Integrated Resonant Accelerometer Microsystems for Automotive Applications
Summary

A family of accelerometer microsystems will be developed for automotive applications based upon the following two types accelerometers;

· Crash sensors for frontal impacts and airbag applications range around 50g

· Crash sensors for side impacts and airbag applications range around 500g.

The project will focus on the development of key process technologies including assembly and testing, product designs and manufacture and test of functional prototypes in coordination with the establishment of high volume production capabilities.
Objectives

· Development of a 50g accelerometer sensor based on a bulk micromachined silicon resonator.

· Development of a 500g accelerometer sensor based on a bulk micromachined silicon resonator.

· Development of accompanying ASICs for integration with 50g accelerometer in a hybrid integrated microsystem for frontal impact airbag applications.

· Development of accompanying ASICs for integration with 500g accelerometer in a hybrid integrated microsystem for side impact airbag applications.

· Test and demonstration of the microsystems in the airbag application by Autoliv.

· Development and installation of the mass fabrication of silicon microsystems, glass-silicon-glass bonding, assembly and test.
Participants

SensoNor (N), Autoliv (D), Sintef (N)
Contact Point Duration

Per Ohlckers 24 months from 01.01.96

SensoNor

Knutsrodveien 7

Horten, Vestfold County

N-1392 (Norway)
tel: [phone]

fax: [phone]

E-mail: [e-mail]

EP 22889 OLMO

On-Vehicle Laser Microsystem

For Obstacle Detection
Summary

A functional prototype of a compact laser-based system for obstacle detection on-vehicles is to be developed. New microsystem technologies are to be used to address the requirements of reliability, detection performance in adverse visibility, eye safety, and cost effectiveness.

The key technologies are an eye-safe microchip laser at 1,5 m wavelength, and a beam-scanning system based on micromachined lenses and flexure structures for actuation. Original signal processing circuits will be developed, where time-of-flight and correlation techniques are integrated, aiming to improve the operation in bad atmospheric conditions. A technical evaluation, including real-field tests, and an overall assessment of the solution will be performed.

The system for obstacle detection will be the core component for driver support functions, with an high impact on safety, traffic efficiency and driving comfort. New application areas are also anticipated such as instrumentation, industrial automation and security systems.

Objectives

• 
  To demonstrate the feasibility of a miniaturized and integrated obstacle detection system based on laser technology, to be used for automotive applications, particularly Intelligent Cruise Control and Anticollision.
  
• 
  To develop and make available the technology of small,eye-safe, solid-state microchip lasers with fast risetime and high peak power.
  
• 
  To develop solutions for efficient laser beam scanning, which can withstand vibrations and guarantee long lifetime, integrating microoptics and micromechanics.
  
• 
  To support the industrial evaluation of technologies for driver support functions, by a comparative assessment of the developed solution, and a review of application trends.
  

Participants

C.R.F. (Centro Ricerche Fiat) (I), LETI (CEA- Direction des Technologies Avancees) (F), Jenoptik Laserdiode (D), Magneti Marelli (I), Renault (F), CSEM (Centre Suisse d’Electronique et de Microtechnique) (CH).

Contact Point Giancarlo Alessandretti Fiat Research Center Strada Torino 50 - 10043 Orbassano (TO) (Italy)	Duration 21 months from 01.11.96
tel: [phone] fax: [phone] E-mail: [e-mail]

EP 22966 AWARE

Anti-Collision Warning and Avoidance

Radar Equipment



Summary
The AWARE project will specify and develop a 77 GHz scanning radar Collision Warning and Avoidance (CW/A) vehicle system. The CW/A system is intended to be applicable in motor- and highway traffic. (Dense city traffic and lateral manoeuvres are not covered at this stage). Moving and stationary obstacles in front of the vehicle are detected by the CW/A radar. Post-processing modules analyse the radar data, and when necessary the driver is alerted. In critical situations (when driver reaction is too slow) the brakes can automatically be applied.
The starting point is to consolidate experiences and developed technologies regarding Adaptive Cruise Control vehicle systems (a system adapting speed and distance to the preceding vehicle). The stricter requirements by the users (drivers), the automotive manufacturers and the market on the CW/A system regarding among others functionality, reliability and cost, will be met through a MMIC based radar front-end, advanced antenna and signal processing for horizontal and vertical resolution, modules for evaluation of risk of collision, and strategies for informing the driver and braking the vehicle. Prototypes of CW/A radar and vehicle systems will be realised for evaluation and “marketing” of results. Plans for exploitation of the developed CW/A system are included.
Project Objectives

• 
  Requirements and specifications on 77 GHz radar sensor for automotive CW/A applications, feasible w.r.t. users/drivers needs and expectation on function and price.
  

• 
  Technology, components, complete prototypes of radar sensor and vehicle system proven feasible w.r.t. requirements, functionality and volume production.
  

• 
  Evaluation results of prototype CW/A radar and system. Plans and results (functional, technological, collaborative) for industrialisation and commercial marketing of the developed CW/A radar.
  

Participants:

AB Volvo (S), CelsiusTech Electronics (S), Centro Ricerche Fiat (I) United Monolithic Semiconductors (F).
Contact Point Duration

Ulf Palmquist 30 months from 01.07.1997

AB Volvo, Tech. Dev.

Chalmers Science Park

S-412 88 Göteborg, (Sweden)
tel: + 46 708 44 46 09

fax: + 46 31 772 40 86

E-mail: [e-mail]

EP 25190 INTACT

Intelligent Automotive Actuator Control & Communication Techniques

Summary

INTACT will develop an intelligent vehicle rear light system capable of automatically controlling its brightness dependent on the environmental conditions and the state of the rear light lens which will also be fault tolerant related to lamp failures by incorporating dual role functions in each light source. This new generation of rear lights will be based on LED illumination technology with the intelligence an control being achieved by utilizing the latest integrated micro-systems combination with CAN communication as well as new innovations in the miniaturization of existing weather sensors.

Objectives

• 
  Design of an intelligent rear light that can be marketed at an acceptable price to be fitted into a production car within a few years.
  
• 
  Utilising existing applications of microprocessor control, CAN communication and MOSFET technology to enable the control and intelligence requirements.
  
• 
  Research and model the characteristics of the physical weather variants that exist around the rear light which includes rain, fog, mist sunlight and dirt.
  
• 
  Miniaturisation of existing weather visibility sensors to enable them to be integrated into a final prototype rear light system.
  
• 
  Intelligent environmental sensor fusion including self-diagnosis of fault conditions.
  
• 
  High volume assembly of LEDs, sensors and microprocessor components into the rear light cluster.
  
• 
  LED light performance twice that of a conventional filament bulb to allow automatic brightness control.
  

Participants

REITTER&SCHEFENACKER (G), STEINBEIS STA (G), PRESSAC (UK), JL-AUTOMATION (UK), JENOPTIK (G), UNIVERSITY OF DUNDEE (UK)

Contact Point Duration

Helmut Haf 30 months from 01.09.1997

Reitter&Schefenacker GmbH & Co.KG

Advanced Development

Eckenerstr. 2

73730 Esslingen (Germany)
tel: + 49 711 3154 166

fax: + 49 711 3154 256

e-mail: [e-mail]
EP 20848 PARFUM

Process control and Air cleaner applications with Recognition of gases and Flavours Using a smart Microsystem
Summary

The objective of the project is to demonstrate and implement smart microsystems for gas analysis and odour recognition based on state-of-the-art sensor technologies, data processing and analysis techniques.

The project will be strongly application driven and address two areas:

· domestic appliances (air cleaner) for gas detection (CO, NO_x, SO₂, HCHO)

· process and quality control in food industry applications (detection of off-flavours and volatile based raw material defects and product classification).
Objectives

· Design and development of thin-film semiconductor oxide gas sensors on a silicon substrate. Miniaturisation and high integration techniques will be used to achieve low production cost, large number of sensors per wafer and performance reproducibility.

· Specific development of a new generation of gas sensors by integrating them on the same chip, resulting in a monolithic multisensor array.

· Unique combination of expertise in process knowledge, sensor technology and data analysis for implementation of smart gas-odour detection microsystems.

· Advanced neural network algorithms for adaptivity, robustness of measurements and error-free analysis.

· Application of such gas detection microsystems into the next generation of domestic air cleaners of the Product Division of Philips DAP.

· Application of the odour recognition system to process (or quality) monitoring in the field of off-flavour and contaminant detection related to packaging.
Participants

LEP (F); DAP (NL); Nestec Ltd (CH); Microsens (CH); CSEM (CH); Neotronics Scientific (UK); IPC (D).
Contact Point Duration

Serge Gourrier 36 months from 01.12.95

Laboratoires d'Electronique PHILIPS S.A.S.

22 av. Descartes, BP 15,

F-94453 Limeil-Brevannes (France)
tel: [phone]

fax: [phone]

E-mail: [e-mail]

EP 21428 SMOG

Smart Air Pollution Monitoring Network
Summary

A miniaturised air quality monitoring station for use in urban environments, capable of detecting a range of important air pollutant species (e.g. CO, NO_x, O₃), produced by road traffic, will be developed using a novel system architecture. The heart of the SMOG demonstrator will be an array of miniaturised silicon-integrated metal-oxide gas sensors that will allow a drastic reduction in volume and power consumption of the monitoring station. Selective detection of the individual target gases will be enabled by state-of-the-art pattern recognition techniques. To reduce dead volumes, the development of a miniaturised actuator system will constitute an important goal of the project.

Objectives

· Substrate heater elements characterised by low power consumption, improved thermal and mechanical stability; membranes made of either amorphous or crystalline silicon carbide, or porous silicon, will be the core of the new advanced substrates.

· Miniaturised and silicon-integrated gas sensor integrated into a system of actuator components; the sensor arrays will consist of micromachined gas sensor elements which incorporate advanced metal-oxide-semiconductor films as gas sensitive materials.
· Gas handling system with integrated silicon microactuators and sensor components; the basic and most innovative devices of the gas handling system will be microvalves and micropumps realised by silicon micromachining (extended feasibility study).
· Advanced techniques for sensor control, signal conditioning and pattern recognition; in particular, they will include sophisticated approaches for sensor calibration and signal evaluation; the latter will be performed using artificial neural networks and logic techniques.
· Miniaturised gas monitoring station characterised by small dimension, reduced power consumption, low investment cost, easy exchange of subsystem components, self calibration and testing of sensor units, long service-free operational periods.