From Nano to Micro Power Electronics



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From Nano to Micro Power Electronics

and Packaging Workshop

October the 16th, 2014

Tours, France
P R O G R A M M E POWER 2014

Technical Committee: Stéphane BELLENGER, IPDIA, CHAIRMAN

Christophe SERRE, ST MICROELECTRONICS, CHAIRMAN

Daniel ALQUIER, GREMAN

Cyril BUTTAY, LABORATOIRE AMPERE

Jean-Luc DIOT, NOVAPACK

Yves OUSTEN, LABORATOIRE IMS

Philippe PONS, AIRBUS OPERATIONS SAS

Juergen SCHUDERER, ABB SCHWEIZ AG
9 h 00Welcome
9 h 30 KEYNOTE: “The electric vehicle revolution and its challenge for power semiconductors”– Jean-Benoit Moreau,ST Microelectronics, Paris.
10 h 15 Coffee break / Table Top Exhibition
10 h 40 Session 1: Technology and application
10 h 40Power management for transportation and industrial systems – Alain Croset, ADETEL Group, Ecully – France
11 h 05Challenges and perspectives of SiC and GaN based power components–Cinzia Marcellino, ST Microelectronics, Catania, Italy
11 h 30Power Electronics Packages with Embedded Components: Technology and Applications–Lars Boettcher, Fraunhofer Institute for Reliability and Micro-integration (IZM), Technical University of Berlin, Germany
11 h 55System in Package Technology for Power Application – Bradford J. Factor, ASE Europe
12 h 20 Table Top Exhibition visit
12 h 45 Lunch
14 h 00 Session 2: Packaging and Assembly Processes
14 h 00 Multiplate: a novel Plating Concept for Cu Termination on Power components – Gerhard Steinberger, Atotech Deutschland GmbH, Germany
14 h 25Advanced Wafer Level Packaging Technology by Layer Transfer Engineering - Thomas Signamarcheix–CEA Leti, Grenoble, France
14 h 50 Advanced die attach joining using nano-crystalline silver layers – Liliana I. Duarte, ABB Switzerland Ltd., Corporate Research, Baden-Daettwil, Switzerland
15 h 15Bonding Large-area Power Devices by Pressure-free, Low-temperature Sintering of Nanosilver Paste – Professor Guo-Quan Lu, Department of Materials Science and Engineering and the Bradley Department ofElectrical and Computer Engineering, Virginia Tech Blacksburg, USA

15 h 40 Session 3:Characterization and Modelling


15 h 40 3D packaging structures – Cyril Buttay, INSA Lyon, France
16 h 05Multi-physic modelling of Ni/Au thin layer in power module – Toni Youssef, IMS Laboratory, University of Bordeaux, France
16 h 30 Microstructure and thermo-mechanical behaviour of thin layers of porous nanocrystalline silver – S. Zabihzadeh, NXMM Laboratory and Simulation, NUM/ASQ, Paul Scherrer Institute, Villigen, Switzerland
16 h 55 End of session

Next to the workshop sessions, 3 optional events will be organized for which you need to register if you wish to attend:

  • On ThursdayOctober the 16th from 17:45 a visit of the castle of Langeais will be organized

  • On Thursday October the 16th from 19h30 a dinner in a restaurant close to castle is proposed

  • On Friday October the 17th , from 9h to 12h a visit of the CERTeM-GREMAN laboratories located close to the ST premises is proposed





Sponsors:

International Microelectronics And Packaging Society – France

49 rue Lamartine 78035 Versailles. Phone: +33 (0)1 39 67 17 73

E-mail : imaps.france@imapsfrance.org

Registration Form

Final registration October the 1st, 2014


COMPANY:

NAME: FIRSTNAME:

ADDRESS:

TEL: E-MAIL:

Send back to Florence Vireton Fax : +33 (0)1 39 02 71 93



E-mail:imaps.france@imapsfrance.org
FEES (include lunch, breaks& events)

Conferences on free access on website www.imapsfrance.org after the event.

��IMAPS MEMBER 180 € VAT excluding-215.28 € TTC

��Non IMAPS MEMBER 210 € HT - 251.16 € TTC

��SPEAKERS/CHAIRS 150 € HT - 179.40 € TTC

��Table Top 300 € HT - 358, 80 € TTC (1 table, chairs, panel, conferences attendance, coffee

breaks, lunch).For foreign companies, VAT is excluded


Do not forget to tick boxes if you want to participate

- Visit of castle of Langeais (Thursday evening) ��yes ��no



- Dinner after the castle visit (Thursday evening) ��yes ��no

- Visit of the CERTEM-GREMAN laboratories (Friday morning) ��yes ��no
��On line Payment and Registration available on www.france.imapseurope.org
TRAINING AGREEMENT

INTERCONEX is recognized as approved training centre (Training agreement number 11780608378). Ifyou would like atraining agreement,check the following box ��.A certificate of attendancewill be givenduring training


PAYMENT AND INTERCONEX BANK REFERENCES

Credit card accepted, as well as payment by cheque, cash or wire transfer.BNP PARIBAS VERSAILLES ETATS GENERAUX, 36 rue des Etats Généraux 78002 Versailles. Bank code 30004 Account number n°00010022786 Key Rib 63, Agency 00859 IBAN FR 76 3000 4008 5900 0100 2278663 BIC BNPAFRPPVRS.





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