International organisation for standardisation organisation internationale de normalisation

Annex B to JCT-VC report:
List of meeting participants

The participants of the fifteenth meeting of the JCT-VC, according to a sign-in sheet circulated during the meeting (approximately 195 people in total), were as follows:

1. 
   Zineb Agyo (Ateme)
   
2. 
   Elena Alshina (Samsung Electronics)
   
3. 
   Peter Amon (Siemens AG)
   
4. 
   Kenneth Andersson (LM Ericsson)
   
5. 
   Jun Arai (NHK (Japan Broadcasting Corporation))
   
6. 
   Cheung Auyeung (Sony)
   
7. 
   Giovanni Ballocca (Sisvel Tech)
   
8. 
   Gun Bang (ETRI)
   
9. 
   Guillaume Barroux (Fujitsu)
   
10. 
    Andrea Basso (Sisvel Tech)
    
11. 
    Lazar Bivolarski (LZ Associates)
    
12. 
    Gisle Bjøntegaard (Cisco Systems Norway)
    
13. 
    Philippe Bordes (Technicolor)
    
14. 
    Frank Bossen (NTT Docomo)
    
15. 
    Jill Boyce (Vidyo)
    
16. 
    Benjamin Bross (Fraunhofer HHI)
    
17. 
    Done Bugdayci Sansli (Tampere University of Technology)
    
18. 
    Yulin Chang (MediaTek Inc.)
    
19. 
    Jianle Chen (Qualcomm)
    
20. 
    Weizhong Chen (Huawei)
    
21. 
    Xu Chen (Huawei Technologies)
    
22. 
    Ying Chen (Qualcomm)
    
23. 
    Hsin-Ta Chiao (ITRI)
    
24. 
    Yongjin Cho (Samsung Electronics)
    
25. 
    Byeongdoo Choi (Samsung Electronics)
    
26. 
    Jangwon Choi (Yonsei University)
    
27. 
    Keiichi Chono (NEC)
    
28. 
    Takeshi Chujoh (Toshiba)
    
29. 
    Robert Cohen (Mitsubishi Electric Res. Labs)
    
30. 
    David Daniels (BSkyB)
    
31. 
    Jan De Cock (Ghent University - iMinds)
    
32. 
    Franck Denoual (Canon Research Centre France)
    
33. 
    Sachin Deshpande (Sharp)
    
34. 
    Xavier Ducloux (Thomson Video Networks)
    
35. 
    Alberto Duenas (NGCodec)
    
36. 
    Christian Feldmann (RWTH Aachen University)
    
37. 
    Felix Fernandes (Samsung Telecom. America)
    
38. 
    David Flynn (Blackberry)
    
39. 
    Chad Fogg (Harmonic)
    
40. 
    Edouard François (Technicolor)
    
41. 
    Per Fröjdh (Ericsson AB)
    
42. 
    Arild Fuldseth (Cisco Systems Norway)
    
43. 
    Christophe Gisquet (Canon Research France)
    
44. 
    Liwei Guo (Qualcomm Technologies)
    
45. 
    Xun Guo (Microsoft Research Asia)
    
46. 
    Miska Hannuksela (Nokia)
    
47. 
    Ryoji Hashimoto (Renesas Electronics)
    
48. 
    Shinobu Hattori (Sony)
    
49. 
    Dake He (Blackberry)
    
50. 
    Yong He (InterDigital Commun.)
    
51. 
    James Helman (MovieLabs)
    
52. 
    Fnu Hendry (Qualcomm)
    
53. 
    Jin Heo (LG Electronics)
    
54. 
    Sung-Wook Hong (Sejong Univ.)
    
55. 
    Yu-Wen Huang (MediaTek USA Inc.)
    
56. 
    Walt Husak (Dolby Labs)
    
57. 
    Atsuro Ichigaya (Japan Broadcasting Corporation (NHK))
    
58. 
    Tomohiro Ikai (Sharp)
    
59. 
    Fabian Jäger (RWTH Aachen Univ.)
    
60. 
    Byeungwoo Jeon (Sungkyunkwan Univ. (SKKU))
    
61. 
    Hyunho Jo (KWU (Kwangwoon university))
    
62. 
    Rajan Joshi (Qualcomm Technologies)
    
63. 
    Joël Jung (Orange Labs)
    
64. 
    Jung Won Kang (ETRI (Electronics and Telecommunications Research Institute))
    
65. 
    Mukta L. Kar (Cable Television Labs)
    
66. 
    Marta Karczewicz (Qualcomm Technologies)
    
67. 
    Kei Kawamura (KDDI)
    
68. 
    Kimihiko Kazui (Fujitsu Labs)
    
69. 
    Chanyul Kim (Samsung Electronics)
    
70. 
    Taesup Kim (LG Electronics)
    
71. 
    Woo-Shik Kim (Qualcomm)
    
72. 
    Do-Kyoung Kwon (Texas Instruments)
    
73. 
    PoLin (Wang) Lai (Mediatek USA)
    
74. 
    Jani Lainema (Nokia)
    
75. 
    Bae-Keun Lee (KT)
    
76. 
    Chak Joo Lee (Singapore Rep)
    
77. 
    Hahyun Lee (Electronics and Telecommunications Research Institue (ETRI))
    
78. 
    Jae Yung Lee (Sejong Univ.)
    
79. 
    Jin Young Lee (Samsung)
    
80. 
    Jinho Lee (Electronics and Telecommunications Research Institue (ETRI))
    
81. 
    Ming Li (ZTE)
    
82. 
    Xiang Li (Qualcomm Technologies)
    
83. 
    Zhu Li (Samsung Research America)
    
84. 
    Chong Soon Lim (Panasonic)
    
85. 
    Sung-Chang Lim (Electronics and Telecommunications Research Institute (ETRI))
    
86. 
    Woong Lim (KWU (Kwangwoon Univ.)
    
87. 
    Ching-Chieh Lin (ITRI International)
    
88. 
    Jian-Liang Lin (MediaTek Inc.)
    
89. 
    Tao Lin (Tongji University)
    
90. 
    Yongbing Lin (Huawei Technologies)
    
91. 
    Peter List (Deutsche Telekom Labs)
    
92. 
    Hongbin Liu (Qualcomm Wireless China)
    
93. 
    Shan Liu (MediaTek USA)
    
94. 
    Zheng Liu (Huawei Software Technologies Co., Ltd.)
    
95. 
    Peng Lu (Zhejiang University)
    
96. 
    Ajay Luthra (Arris)
    
97. 
    Vinod Kumar Malamal Vadakital (Nokia)
    
98. 
    Detlev Marpe (Fraunhofer HHI)
    
99. 
    Gaëlle Martin-Cocher (Blackberry)
    
100. 
     Shohei Matsuo (NTT)
     
101. 
     Ken McCann (Zetacast / Samsung)
     
102. 
     Philipp Merkle (Fraunhofer HHI)
     
103. 
     Akira Minezawa (Mitsubishi Electric)
     
104. 
     Koohyar Minoo (Arris)
     
105. 
     Marta Mrak (BBC R&D)
     
106. 
     Tokumichi Murakami (Mitsubishi Electric)
     
107. 
     Matteo Naccari (BBC R&D)
     
108. 
     Takayuki Nakachi (NTT)
     
109. 
     Ohji Nakagami (Sony corporation)
     
110. 
     Hiroya Nakamura (JVC Kenwood)
     
111. 
     Junghak Nam (LG Electronics)
     
112. 
     Panos Nasiopoulos (University of British Columbia)
     
113. 
     Arion Neddens (Dolby Germany GmbH)
     
114. 
     Tung Nguyen (Fraunhofer HHI)
     
115. 
     Didier Nicholson (VITEC)
     
116. 
     Takahiro Nishi (Panasonic)
     
117. 
     Andrey Norkin (Ericsson AB)
     
118. 
     Jens-Rainer Ohm (RWTH Aachen Univ.)
     
119. 
     Patrice Onno (Canon Research Centre France)
     
120. 
     Chanyul Park (Samsung Electronics)
     
121. 
     Min Woo Park (Samsung Electronics)
     
122. 
     Sang-Hyo Park (Hanyang Univ.)
     
123. 
     Wen-Hsiao Peng (ITRI International/NCTU)
     
124. 
     Mahsa Pourazad (TELUS Communications & UBC)
     
125. 
     Adarsh Krishnan Ramasubramonian (Qualcomm Technologies)
     
126. 
     Krishnakanth Rapaka (Qualcomm Technologies)
     
127. 
     Justin Ridge (Nokia Oyj)
     
128. 
     Christopher Rosewarne (CiSRA / Canon Inc)
     
129. 
     Jiwoo Ryu (Kwangwoon Univ.)
     
130. 
     Jesus Sampedro (Polycom)
     
131. 
     Jonatan Samuelsson (LM Ericsson)
     
132. 
     Kazushi Sato (Sony)
     
133. 
     Nicholas Saunders (Sony Europe Broad. & Prof. Res. Labs)
     
134. 
     Ankur Saxena (Samsung Telecom. America)
     
135. 
     Thomas Schierl (Fraunhofer HHI)
     
136. 
     Klaas Schueuer (Dolby Germany GmbH)
     
137. 
     Takanori Senoh (National Institute of Information and Communications technology)
     
138. 
     Vadim Seregin (Qualcomm)
     
139. 
     Kim Seung-Hwan (Sharp Laboratories of America (SLA))
     
140. 
     Karl Sharman (Sony Europe Broad. & Prof. Res. Labs)
     
141. 
     Masato Shima (Canon)
     
142. 
     Shinya Shimizu (NTT)
     
143. 
     Rickard Sjöberg (Ericsson AB)
     
144. 
     Robert Skupin (Fraunhofer Heinrich-Hertz-Institute)
     
145. 
     Joel Sole (Qualcomm Technologies)
     
146. 
     Olgierd Stankiewicz (Poznań Univ. Tech.)
     
147. 
     Nikolce Stefanoski (Disney Research Zurich)
     
148. 
     Shiori Sugimoto (NTT)
     
149. 
     Karsten Sühring (Fraunhofer HHI)
     
150. 
     Gary Sullivan (Microsoft)
     
151. 
     Huifang Sun (Mitsubishi Electric Res. Labs)
     
152. 
     Teruhiko Suzuki (Sony)
     
153. 
     Maxim Sychev (Huawei Technologies Co.)
     
154. 
     Yasser Syed (Comcast Labs)
     
155. 
     Ali Tabatabai (Sony)
     
156. 
     Thiow Keng Tan (NTT Docomo)
     
157. 
     Yih Han Tan (Inst. Infocomm Res. (I2R))
     
158. 
     Masayuki Tanimoto (Nagoya Industrial Science Research Institute)
     
159. 
     Gerhard Tech (Fraunhofer HHI)
     
160. 
     Herbert Thoma (Fraunhofer IIS)
     
161. 
     Pankaj Topiwala (FastVDO)
     
162. 
     Alexandros Tourapis (Apple)
     
163. 
     Cong-Thang Truong (Univ. Aizu)
     
164. 
     Yi-Shin Tung (ITRI USA / MStar Semiconductor)
     
165. 
     Kemal Ugur (Nokia)
     
166. 
     Glenn Van Wallendael (Ghent University - iMinds)
     
167. 
     Thijs Vermeir (Barco N.V.)
     
168. 
     Anthony Vetro (Mitsubishi Electric Res. Labs)
     
169. 
     Wade Wan (Broadcom)
     
170. 
     Ye-Kui Wang (Qualcomm Technologies)
     
171. 
     Krzysztof Wegner (Poznań Univ. Tech.)
     
172. 
     Stephan Wenger (Vidyo)
     
173. 
     Ho-Cheon Wey (Samsung Electronics)
     
174. 
     Thomas Wiegand (Fraunhofer HHI)
     
175. 
     Mathias Wien (RWTH Aachen Univ.)
     
176. 
     Stewart Worrall (Ericsson)
     
177. 
     Ping Wu (ZTE UK)
     
178. 
     Xiaoyu Xiu (InterDigital Commun.)
     
179. 
     Jizheng Xu (Microsoft)
     
180. 
     Tomoyuki Yamamoto (Sharp)
     
181. 
     Haitao Yang (Huawei Technologies)
     
182. 
     Jar-Ferr (Kevin) Yang (ITRI International)
     
183. 
     Yan Ye (InterDigital Commun.)
     
184. 
     Sehoon Yea (LG Electronics)
     
185. 
     Peng Yin (Dolby Labs)
     
186. 
     Haoping Yu (Huawei USA)
     
187. 
     Peiyu Yue (Huawei Software Technologies)
     
188. 
     Jiefu Zhai (Apple Inc.)
     
189. 
     Kai Zhang (Mediatek Inc.)
     
190. 
     Li Zhang (Qualcomm Technologies)
     
191. 
     Wenhao Zhang (Intel)
     
192. 
     Yichen Zhang (Zhejiang Univ.)
     
193. 
     Jianhua Zheng (Huawei Technologies)
     
194. 
     Xiaozhen Zheng (Huawei Technologies)
     
195. 
     Minhua Zhou (Broadcom)
     

9. 
   – JCT-3V report
   

Source: Jens Ohm and Gary Sullivan, Chairs
Summary

The Joint Collaborative Team on 3D Video Coding Extension Development (JCT-3V) of ITU-T WP3/16 and ISO/IEC JTC 1/ SC 29/ WG 11 held its sixth meeting during 25 Oct. – 1 Nov. 2013 at the headquarters of the World Meteorological Organization (for the first day) and at the ITU-T premises in Geneva, CH. The JCT-3V meeting was held under the chairmanship of Dr Jens-Rainer Ohm (RWTH Aachen/Germany) and Dr Gary Sullivan (Microsoft/USA). For rapid access to particular topics in this report, a subject categorization is found (with hyperlinks) in section 1.14 of this document.

The meeting was mainly held in a “single track” fashion, with few breakout activities (as documented in this report) held in parallel. Several plenary sessions were chaired by Dr Anthony Vetro, particularly in cases when neither of the two chairs was able to attend due to commitments in other groups or joint meetings. It was usually avoided to make decisions which might cause objections in such cases.

The JCT-3V meeting sessions began at approximately 1415 hours on Friday 25 Oct. 2013. Meeting sessions were held on all days until the meeting was closed at approximately 12 hours on Friday 1 Nov. Approximately 157 people attended the JCT-3V meeting, and approximately 250 input documents were discussed. The meeting took place in a collocated fashion with a meeting of ITU-T SG16 – one of the two parent bodies of the JCT-3V. The subject matter of the JCT-3V meeting activities consisted of work on 3D extensions of the Advanced Video Coding (AVC) and the High Efficiency Video Coding (HEVC) standards.

The AHG on 3D High-level Syntax (AHG7) had met the 2 days before the JCT-3V meeting (23-24 Oct.), to discuss HEVC HLS input contributions jointly with JCT-VC experts. The outcome of this joint meeting, which continued after the beginning of the JCT-3V meeting, is documented in the JCT-VC report JCTVC-O1000.

The primary goals of the meeting were to review the work that was performed in the interim period since the fifth JCT-3V meeting in producing

• 
  the seventh version of specification Draft of the AVC 3D extension framework (3D-AVC, which had been issued as ISO/IEC DAM study document);
  
• 
  the seventh test model of the AVC 3D extension framework (3D-AVC), and associated software;
  
• 
  the fifth version of draft text of the Multiview HEVC extension (MV-HEVC), which had been issued as an ISO/IEC 23008-2/PDAM2 study document;
  
• 
  the fifth test model of the HEVC 3D extension framework (3D-HEVC) and associated software;
  
• 
  the first Draft of 3D-HEVC text specification;
  
• 
  the fourth Draft of MVC plus depth conformance specification, which had been issued as an ISO/IEC 14496-4:2004/DAM41 study document;
  
• 
  the second draft of the MVC plus depth reference software specification, which had been issued as an ISO/IEC 14496-5:2001/PDAM33 study document;
  
• 
  the second draft for 3D-AVC conformance specification;
  
• 
  the first Draft of Multi-resolution Frame Compatible Stereo (MFC) conformance specification, which had been issued as ISO/IEC 14496-4:2004/PDAM34;
  
• 
  the first draft of MFC reference software specification, which had been issued as an ISO/IEC 14496-5:2001/PDAM34;
  
• 
  the second test model of MFC;
  
• 
  the 3D Video Subjective Quality Assessment Test plan.
  

Furthermore, the JCT-3V reviewed the results from the interim Core Experiments (CE); reviewed technical input documents; produced updated versions of the draft texts, framework descriptions and software implementations of the items above; and planned a new set of Core Experiments (CEs) for further investigation of proposed technology.

The JCT-3V produced 13 particularly important output documents from the meeting:

• 
  Draft Text 8 of 3D-AVC (ISO/IEC 14496-10:2012/FDAM3 – to be integrated and balloted in new edition)
  
• 
  Test Model 8 of 3D-AVC
  
• 
  Draft 1 of 3D-AVC reference software (ISO/IEC 14496-5:2001/PDAM 35 –for ballot)
  
• 
  Draft Text 6 of MV-HEVC (Study of ISO/IEC 23008-2:200X/DAM 2)
  
• 
  Test Model 6 of 3D-HEVC and MV-HEVC, and associated software
  
• 
  Draft 2 of 3D-HEVC text specification
  
• 
  Draft 5 of MVC plus Depth Conformance (Study of ISO/IEC 14496-4:2004/DAM 41 – not for ballot)
  
• 
  Draft 3 of MVC plus Depth Reference Software (ISO/IEC 14496-5:2001/DAM 33 –for ballot)
  
• 
  Draft 3 of 3D-AVC Conformance (ISO/IEC 14496-4:2004/PDAM 43 –for ballot)
  
• 
  Draft 2 of MFC Conformance (ISO/IEC 14496-4:2004/DAM 42 – for ballot)
  
• 
  Draft 2 of MFC Reference Software (ISO/IEC 14496-5:2001/DAM 34 –for ballot)
  
• 
  3D Video Subjective Quality Assessment Test plan v2
  
• 
  Common Test Conditions of 3DV Core Experiments
  

Moreover, plans were established to conduct 5 future CEs in the interim period until the next meeting.

For the organization and planning of its future work, the JCT-3V established 13 "Ad Hoc Groups" (AHGs) to progress the work on particular subject areas. The next four JCT-3V meetings are planned for 11–17 Jan. 2014 under WG 11 auspices in San Jose, US, 29 March – 4 April 2014 under WG 11 auspices in Valencia, ES, 3 – 9 July 2014 under ITU-T auspices in Sapporo, JP, and 18 – 24 Oct. 2014 under WG 11 auspices in Strasbourg, FR.

The document distribution site http://phenix.it-sudparis.eu/jct3v/ was used for distribution of all documents.

The reflector to be used for discussions by the JCT-3V and all of its AHGs is [e-mail].

12.