International organisation for standardisation organisation internationale de normalisation



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10.7IPR management


The following document was approved


11310

Standards under development for which a call for patent statements is issued



11Administrative matters

11.1Schedule of future MPEG meetings


The following meeting schedule was approved


#

City

Country

yy

mm

dd-dd

92

Dresden

DE

10

04

19-23

93

Geneva

CH

10

07

26-30

94

Guangzhou

CN

10

10

11-15

95

?

KR

11

01

24-28

96

Geneva

CH

11

03

21-25

97

Torino

IT

11

07

18-22

98

Geneva

CH

11

11-12

28-02

99

?

?

12

01

??-??

100

Geneva

CH

12

04-05

30-04

101

?

SE

12

07

16-20

102

Suzhou?

CN?

12

10

15-19



11.2Promotional activities


The following documents were approved


11283

Storyboard for MPEG-U promotion video

11245

Dresden press release



12Resolutions of this meeting


These were approved

13A.O.B.


There was no other business

14Closing


The meeting closed on2 010/04/23T20:45

  1. Attendance list

Last name

First name

Company

Country

Amon

Peter

Siemens AG

Germany

AMONOU

Isabelle

Orange Labs

FRANCE

Andersson

Kenneth

Ericsson AB

Sweden

Aoki

Hirofumi

NEC

Japan

Asai

Kohtaro

Mitsubishi Electric Corporation

Japan

Auyeung

Cheung

Sony Electronics Inc.

USA

Bando

Yukihiro

NTT

Japan

Bang

Gun

ETRI

Republic of Korea

Barbarien

Joeri

Vrije Universiteit Brussel

Belgium

Baroncini

Vittorio

FUB

Italy

Bãse

Gero

Siemens

Germany

Biber

Michael

Dolby Laboratories, Inc.

United States of America

Bivolarski

Lazar

Skype

USA

Bjontegaard

Gisle

Tandberg

Norway

Bosse

Sebastian

Fraunhofer HHI

Germany

Bossen

Frank

DOCOMO USA Labs

United States of America

Brasnett

Paul

Mitsubishi Electric R&D Centre Europe

United Kingdom

Bross

Benjamin

Fraunhofer HHI

Germany

Budagavi

Madhukar

Texas Instruments Inc.

United States of America

Chen

Peisong

Qualcomm

USA

Chen

weizhong

Huawei technologies CO.,LTD

China

Chen

Yi-Wen

NCTU/ITRI

Taiwan, R.O.C

Chiariglione

Leonardo

CEDEO.net

Italy

Chinen

Toru

Sony Corporation

Japan

Chiu

Yi-Jen

Intel Corporation

United States

Choe

Yoonsik

Yonsei University

Republic of Korea

Choi

Miran

ETRI

Korea

Choi

Jin Soo

Electronics and Telecommunications Research Institute

Republic of Korea

Choi

Kiho

Hanyang University

South Korea

Chono

Keiichi

NEC Corp.

Japan

Chujoh

Takeshi

Toshiba Corporation

Japan

Cohen

Robert

Mitsubishi Electric

United States

Cordara

Giovanni

Telecom Italia

Italy

Davies

Thomas

BBC

United Kingdom

De Cock

Jan

Ghent University - IBBT

Belgium

De Petris

Gianciuca







Demircin

Mehmet Umut

Texas Instruments

United States of America

Doehla

Stefan







Domanski

Marck




Poland

Drugeon

Virginie




Germany

Dueking

Sven

MainConcept GmbH

Germany

Duenas

Alberto

Cavium Networks

United States

Dufourd

Jean-Claude







edouard

francois

Technicolor

France

Eleftheriadis

Alex

Vidyo, Inc.

USA

Esche

Marko

Technische UniversitŠt Berlin

Germany

Fernandes

Felix

Samsung

United States of America

Fu

Chih-Ming

MediaTek Inc.

Taiwan

Fujibayashi

Akira

NTT DOCOMO,Inc.

Japan

Fujii

Toshiaki

Tokyo Institute of Technology

Japan

Fukushima

Shigeru

JVC KENWOOD Holdings, Inc.

Japan

Fuldseth

Arild

Tandberg

Norway

Gabriellini

Andrea

BBC

United Kingdom

Geiger

Ralf

Fraunhofer IIS

Germany

Giladi

Alexander

Avail-TVN

USA

Glantz

Alexander

Technische UniversitŠt Berlin

Deutschland

Grafl

Michael

Klagenfurt University

Austria

Grill

Bernhard

Fraunhofer Institut fr Integrierte Schaltungen

Germany

GUEZ VUCHER

Marc

SCPP

France

Guo

Xun

MediaTek (Beijing) Inc.

P.R. China

Han

Jong Ki

Sejong University

Korea

Han

Woo-Jin

Samsung Electronics

Republic of Korea

Harada

Noboru

NTT

Japan

He

Dake

Research In Motion

Canada

Helle

Philipp




Germany

Hellmuth

Oliver

Fraunhofer IIS

Germany

Herre

Juergen

Fraunhofer IIS

Germany

Hinz

Tobias

Fraunhofer HHI

Germany

Hofmann

Ingo







Hong

Sung-Wook

Sejong Unversity

Republic of Korea

Huang

Yu-Wen

MediaTek Inc.

Taiwan

HUH

KANG SUK

LG Electronics

Republic of Korea

Husak

Walt







Hwang

Neungjoo

Kwangwoon Univ.

Republic of Korea

Ichigaya

Atsuro

NHK

Japan

Iwata

Kenichi

Renesas Technology Corp.

Japan

Jacobs

Marc

Vrije Universiteit Brussel

Belgium

Jang

Myoung Hun

Sejong University

Korea

Jeon

ByeongMoon

LG Electronics

Korea

Jeon

Byeungwoo




Korea

Jeong

Seyoon

ETRI

Republic of Korea

Ji

Xiangyang

Tsinghua University

China

Jo

Hyunho

Kwangwoon University

Republic of Korea

Joshi

Rajan L

Qualcomm

United States

Joveski

Bojan







Jung

Seunghoon

Galaxia Communications

Republic of Korea

Jung

Tae-young

Hanyang University

Korea, Republic of.

Jung

Joel




France

Kamp

Steffen

RWTH Aachen University

Germany

Kang

Jung Won

ETRI

Republic of Korea

Kanumuri

Sandeep

DOCOMO Communications Laboratories USA, Inc.

United States

Karczewicz

Marta




USA

Karwowski

Damian




Poland

Kaup

AndrŽ

UniversitŠt Erlangen-NŸrnberg

Deutschland

Kazui

Kimihiko

FUJITSU LABORATORIES LTD

JAPAN

Kim

Jeong-Pil

sejong university

Republic of korea

KIM

SEONG HOON

GalaxiaCommunications

Republic of KOREA

Kim

Inkwon

Galaxia Communications Co., Ltd.

South Korea

Kim

Min Jae

Sejong University

Korea

KIM

IL KOO

Samsung Electronics Co., Ltd.

Republic of Korea

Kim

Yong-Hwan

KETI

South Korea

KIM

Hae Kwang

Sejong univ.

Korea

KIM

Hui Yong

ETRI

Korea, Republic of

Kim

Jinpil

LG Electronics

Republic of Korea

Kim

Jae-Gon

KAU

Republic Of Korea

Kim










Kim

Jungsun

LG electronics

Republic of Korea

Kirchhoffer

Heiner




Germany

Kitamura

Masatsugu

For more conveninet AV life

Japan

Klomp

Sven

Leibniz Universitãt Hannover

Germany

Kondo

Kenji




Japan

Konieczny

Jacek




Poland

Korodi

Gergely

Research In Motion Limited

Canada

Kouadio

Adi

EBU

switzerland

Koyama

Jumpei

FUJITSU LABORATORIES LTD.

Japan

Krämer

Ferenc







Krutz

Andreas

Technische UniversitŠt Berlin

Germany

Kurutepe

Engin

TU Berlin

Germany

Kwon

Yongil

KyungHee UNIV.

South Korea

Lai

Changcai




China

Lainema

Jani

Nokia

Finland

Lakshman

Haricharan

Fraunhofer HHI

Germany

LAROCHE

Guillaume

CANON RESEARCH CENTRE FRANCE SAS

FRANCE

Le Feuvre

Jean

Telecom ParisTech

France

Lee

Yung-Lyul

Sejong University

South Korea

Lee

Hyuk

Hanyang University

Korea

Lee

Ju Ock

Sejong University

Korea

Lee

Hyunkook

LG Electronics

SOUTH KOREA

LEE

SINWOOK

Hanyang University

South Korea

Lei

Shawmin

MediaTek

Taiwan

Li

Shujun

University of Konstanz

Germany

Liebchen

Tilman

LG Electronics

Germany

Lim

Jeongyeon

SK Telecom

Korea (ROK)

Lim

ChongSoon

Panasonic Singapore Laboratories

Singapore

Lim

Sung-Chang

ETRI

Republic of Korea

Lim

Young Kwon







Lin

Yongbing

Huawei Technologies Co., Ltd.

P.R. China

List

Peter

Deutsche Telekom, Laboratories

Deutschland

Liu

Yu

Hong Kong Applied Science and Technology Research Institute

Hong Kong

Liu

Lingzhi

Huawei Technologies USA

United States of American

Liu

Yingjia

Huawei Technologies Co Ltd

P.R.China

Luo

Zhong

Huawei Technologies,Co.Ltd

P.R. China

Ma

Siwei

Peking University

China

Marpe

Detlev

Fraunhofer HHI

Germany

Marshal

Iain James







Martin-Cocher

Gaelle

Research In Motion Ltd

Canada

Matone

Sergio

CEDEO.net

Italy

Matsuo

Shohei

NTT corporation

Japan

Mattavelli

Marco

EPFL

Switzerland

McCann

Ken

ZetaCast representing Samsung

United Kingdom

Merkle

Philipp

Fraunhofer HHI

Germany

Mochizuki

Seiji

Renesas Technology Corp.

Japan

Moghe

Dhawal

CableLabs

United States of America

Moon

Joo Hee




Korea

Moriya

Takehiro

NTT

JAPAN

Multrus

Markus

Fraunhofer Institut IIS

Germany

Munderloh

Marco

Leibniz Universitãt Hannover

Germany

Murakami

Tokumichi

Mitsubishi Electric Corporation

Japan

Mueller

Karsten

Fraunhofer HHI

Germany

Nakamura

Katsuyuki

Hitachi Ltd.

Japan

Neuendorf

Max

Fraunhofer IIS

Germany

Nishi

Takahiro

Panasonic

Japan

Nishiguchi

Masayuki

Sony Corporation

Japan

Ohm

Jens-Rainer

RWTH Aachen University

Germany

Onno

Patrice

CANON RESEARCH CENTRE FRANCE SAS

FRANCE

Oomen

Werner

Philips Applied Technologies

Netherlands

Ostermann

Joern

Leibniz University HannoverInst. für Informationsverarbeitung"

Germany

Oudin

Simon

Fraunhofer HHI

Germany

Pallone

Gregory

Orange Labs

France

Panusopone

Krit

Motorola

United States

Park

Jung Ah

KyungHee Univ.

South Korea

Park

Hyoungmee

Sejong University

Korea

Park

Kyungmo

Samsung Electronics Co., Ltd.

Republic of Korea

Park

Seungwook

LG Electronics

Korea

Park

Joonyoung

LG electronics

Korea

PATEUX

Stâphane

Orange Labs

France

PENG

WEN-HSIAO

NCTU/ITRI International

TAIWAN

Philippe

Pierrick

Orange Labs

France

Preda

Marius







Preiss

Matthias

Fraunhofer HHI

Germany

Priddle

Clinton

Ericsson

Sweden

Purnhagen

Heiko







Quackenbush

Schuyler

Audio Research Labs

USA

Raad

Mohamad

RaadTech Consulting

Australia

Raulet

Mickael

IETR/INSA Rennes

France

Reznik

Yuriy

Qualcomm Inc.

USA

Ridge

Justin

Nokia

United States

Robilliard

Julien

Fraunhofer Institut IIS

Germany

Rusanovskyy

Dmytro

Tampere University of Technology

Finland

Sakazume

Satoru

JVC KENWOOD Holdings, Inc.

Japan

Sampedro

Jesus




Spain

Schierl

Thomas




Germany

Schwarz

Heiko

Fraunhofer HHI

Germany

Segall

Andrew




United States of America

Sekiguchi

Shun-ichi

Mitsubishi Electric Corporation

JAPAN

SÊnchez de la Fuente

Aritz

Fraunhofer Heinrich-Hertz-Institut

Germany

Seo

Chan Won

Sejong University

Korea

Shen

BZ (Bazhong)

Broadcom, Corp

USA

Shima

Masato

Canon Inc.

Japan

Shimizu

Shinya

NTT

Japan

SHIN

ILHONG




SOUTH KOREA

Shishikui

Yoshiaki

NHK

Japan

Siekmann

Mischa

Fraunhofer HHI

Germany

Sikora

Thomas

TU Berlin, FG NachrichtenÜbertragung

Germany

Sjšberg

Rickard

Ericsson

Sweden

Sodagar

Iraj

0D513973RL532144V

kenzler@kcmweb.de

Sole

Joel

Technicolor

United States of America

Song

Jaeyeon

Samsung electronics

South Korea

Song

Jeongook

Yonsei Univ.

Republic of Korea

Suehring

Karsten

Fraunhofer HHI

Deutschland

Sugimoto

Kazuo

Mitsubishi Electric Corporation

Japan

Suh

Doug Young

KyungHee Univ.

South Korea

Suh

Jung Suk

Samsung Electronics Co., Ltd.

Korea

Sullivan

Gary J

Microsoft Corp.

United States of America

Sun

Huifang

Mitsubishi Electric Research Labs

USA

Sung

Jaewon

LG Electronics

Korea

Suzuki

Teruhiko

Sony Corporation

Japan

Suzuki

Yoshinori

NTT DOCOMO, INC.

Japan

Taddei

Herve

Huawei Technologies

Germany

Takamura

Seishi

NTT Corporation

Japan

Tan

TK

NTT DOCOMO, Inc.

Japan

TANIZAWA

AKIYUKI

TOSHIBA CORPORATION

JAPAN

Tech

Gerhard

Fraunhofer HHI

Germany

Terentiev

Leonid

Fraunhofer Institut IIS

Germany

Thoma

Herbert

Fraunhofer IIs

Germany

Timmerer

Christian

Klagenfurt University

Austria

Tonomura

Yoshihide

NTT

Japan

Tsai

Chun-Jen

NCTU/ITRI

Taiwan

Ugur

Kemal

Nokia

Finland

Wang

Xianglin

Qualcomm

United States

Wang

Tse-Wei

NCTU/ITRI

Taiwan

Wang

Dong

ZTE Corporation

People's Republic of China

Wang

Xin

Huawei Technologies

USA

Wedi

Thomas

Panasonic

Germany

Wegner

Krzysztof




Poland

WEN

XING

HONG KONG UNIV of SCIENCE & TECH

HONG KONG

Wiegand

Thomas

Fraunhofer HHI

Germany

Wien

Mathias

RWTH Aachen University

Germany

Winken

Martin

Fraunhofer HHI

Germany

Wischhöfer

Cord







Wittmann

Steffen

Panasonic

Germany

Won

Suwon

SungKyunKwan University




Wu

Ping

Mitsubishi Electric Research Centre Europe

United Kingdom

WŸbbolt

Oliver

Technicolor

Germany

Xu

Jizheng

Microsoft Research Asia

China

Yamakage

Tomoo

TOSHIBA Corporation

Japan

Yamamoto

Tomoyuki

Sharp Corporation

Japan

Yang

Haitao




Hong Kong

Yang

Mingyuan

HUAWEI TECHNOLOGIES CO., LTD

People Republic of China

Yang

Jungyoup

Sungkyunkwan University

Republic of Korea

Yea

Sehoon

LG Electronics

South Korea

Yeo

Chuo Hao

Institute for Infocomm Research

Singapore

YI

JOO YOUNG

Korea Eletronics Technology Institute

Korea

Yin

Peng

Technicolor

United States of America

Yu

Lu

Zhejiang University

China

YU

Haoping

Huawei Technologies, USA

USA

YU

WEI-LING

National Chiao Tung University

Taiwan

Zhang

Cixun

Tampere University of Technology

Finland

Zhang

Li

Peking University

China

Zheng

Jianhua

Huawei Technologies Co. Ltd

P.R. China

ZHENG

Xiaozhen

HUAWEI Technologies Co., Ltd

P.R.China

Zhou

Minhua

Texas Instruments Inc.

United States

Zia

Waqar

LG Electronics

Germany

Zou

Bill

DTS

USA

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