International organisation for standardisation organisation internationale de normalisation


Closing Audio Plenary and meeting deliverables



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Closing Audio Plenary and meeting deliverables

  1. Plenary discussions



    1. Responses to Liaison and NB comments


Liaison statement and NB comment responses generated by Audio were presented and approved.
    1. Recommendations for final plenary


The Audio recommendations were presented and approved.
    1. Establishment of Ad-hoc Groups


The ad-hoc groups shown in the following table were established by the Audio subgroup.

No.

Title

Mtg

14499

AHG on 3D Audio and Audio Maintenance

YES (see below)

14500

AHG on Responding to Industry Needs on Adoption of MPEG Audio

No

The AHG on 3D Audio and Audio Maintenance will have the following meetings:



  • Monday 1300-1800 and Tuesday 0900-1800, June 2 and 3, 2014, at a Europan, location to be announced by April 25, 2014

  • Sat Jul 5, 1000 – 1800, Sun Jul 6, 1000 - 1800, at the 109th MPEG meeting venue.
    1. Approval of output documents


All output documents, shown in Annex C, were presented in Audio plenary and were approved.
    1. Press statement


The Audio contribution to the press statement was reviewed and approved.
    1. Agenda for next meeting


The agenda for the next MPEG meeting is shown in Annex F.
    1. All other business


There was none.
    1. Closing of the meeting


The 108th Audio Subgroup meeting was adjourned Friday at 14:01 hrs.

  1. Participants


There were 32 participants in the Audio subgroup meeting, as shown in the following table.

First

Last

Country

Affiliation

Email

Johannes

Boehm

DE

Technicolor

Johannes.Boehm@technicolor.com

Toru

Chinen

JP

Sony

Toru.Chinen@jp.sony.com

Sang

Chon

KR

Samsung Electronics

sb.chon@samsung.com

Jürgen

Herre

DE

Int'l Audio Labs Erlangen / Fraunhofer

hrr@iis.fraunhofer.de

Kyeong Ok

Kang

Korea

ETRI

kokang@etri.re.kr

Max

Neuendorf

DE

Fraunhofer IIS

max.neuendorf@iis.fraunhofer.de

Masayuki

Nishiguchi

JP

Sony

Masayuki.Nishiguchi@jp.sony.com

Werner

Oomen

NL

Philips

werner.oomen@philips.com

Gregory

Pallone

FR

Orange

gregory.pallone@orange.com

Takehiro

Sugimoto

Japan

NHK

sugimoto.t-fg@nhk.or.jp

Stephan

Schreiner

Germany

Fraunhofer IIS

stephan.schreiner@iis.fraunhofer.de

Naoya

Tanaka

JP

Panasonic

tanaka.naoya@jp.panasonic.com

Oliver

Wuebbolt

DE

Technicolor

oliver.wuebbolt@technicolor.com

Tomasz

Zernicki

PL

Zylia

tomasz.zernicki@zylia.pl

Clemens

Par

Switzerland

Swissaudec

mail@swissaudec.com

Bill

Zou

USA

DTS

bill.zou@dts.com

Deep

Sen

USA

Qualcomm

dsen@ieee.org

Thomas

Sporer

Germany

Fraunhofer IDMT

spo@idmt.fhg.de

Jan

Plogsties

Germany

Fraunhofer IIS

jan.plogsties@iis.fraunhofer.de

Yeshwant

Muthusamy

USA

Samsung

y.muthusamy@samsung.com

Taegyu

Lee

KR

Yonsei University

tglee@dsp.yonsei.ac.kr

Frank

Baumgarte

USA

Apple Inc.

fb@apple.com

Werner

De Bruijn

NL

Philips

werner.de.bruijn@philips.com

Panji

Setiawan

Germany

Huawei Technologies

panji.setiawan@huawei.com

Nils

Peters

US

Qualcomm

npeters@qti.qualcomm.com

Zongxian

Liu

Singapore

Panasonic R&D Center Singapore

zongxian.liu@sg.panasonic.com

Richard

Furse

UK

Blue Ripple Sound Limited

richard@blueripplesound.com

Fabian

Kuech

Germany

Fraunhofer IIS

fabian.kuech@iis.fraunhofer.de

Achim

Kuntz

Germany

Fraunhofer IIS

achim.kuntz@iis.fraunhofer.de

Simone

Fontana

Italy

Huawei Technologies

simone.fontana@huawei.com

Lukasz

Januszkiewicz

Poland

Zylia Sp. z o.o.

lukasz.januszkiewicz@zylia.pl

Michael

Meier

DE

Institut fuer Rundfunktechnik

meier@irt.de



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