International organisation for standardisation organisation internationale de normalisation



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10.7Work plan and time line


The following documents were approved


14201

MPEG Standards

14202

Table of unpublished FDISs

14203

Work plan

14204

Time line



11Administrative matters

11.1Schedule of future MPEG meetings


The following meeting schedule was approved


#

City

Country

yy

mm-mm

dd-dd

107

San José

US

14

01

13-17

108

Valencia

ES

14

03-04

31-04

109

Sapporo

JP

14

07

07-11

110

Strasbourg

FR

14

10

20-24

111

Geneva?

CH?

15

02

16-20

112

Warsaw

PL

15

06

22-26

113

Geneva?

CH

15

10

19-23

114

?




16

02

22-26

115

Geneva

CH

16

5-6

30-03



11.2Promotional activities


The following documents were approved


14187

White paper on MPEG-V

14306

White paper on File Format

14188

Guideline for uploading technical articles in MPEG Home page

14275

Draft of “In progress” white paper on Free viewpoint TV

14114

San José press release



12Resolutions of this meeting


These were approved

13A.O.B.


There was no other business

14Closing


Meeting closed at 2014/01/17T20:20


  1. Attendance list

First Name

Last Name

Organization

Country

Massimiliano

Agostinelli

Trellis Management Co. Ltd

UK

Elena

Alshina

Samsung Electronics

KR

Jose

Alvarez

oViCs

US

Peter

Amon

Siemens AG

DE

Kenneth

Andersson

Ericsson

SE

Pierre

Andrivon

Technicolor

FR

Shuichi

Aoki

NHK

JP

Jun

Arai

NHK (Japan Broadcasting Corporation)

JP

Alessandro

Artusi

Trellis Managment Co Ltd

UK

Cheung

Auyeung

Sony Electronics Inc.

US

Gero

Baese

Siemens AG

DE

Giovanni

Ballocca

Sisvel Technology srl

IT

Gun

Bang

ETRI

KR

Vittorio

Baroncini

Fondazione Ugo Bordoni

IT

Guillaume

Barroux

Fujitsu Laboratories Ltd.

JP

Andrea

Basso

Sisvel Technology srl

IT

Frank

Baumgarte

Apple Inc.

US

Ali

Begen

Cisco

CA

Abdellatif

Benjelloun Touimi

Huawei Technologies (UK) Co., Ltd.

UK

Lazar

Bivolarsky

LZ Associates

US

Semyon

Blinstein

Vanguard Video, LLC.

US

Miroslaw

Bober

University of Surrey

UK

Johannes

Boehm

Technicolor

DE

Frank

Bossen

NTT DOCOMO

CH

Imed

Bouazizi

Samsung Research America

US

Jill

Boyce

Vidyo

US

Benjamin

Bross

Fraunhofer HHI

DE

Tyrome

Brown

Dolby Laboratories, Inc.

US

Tim

Bruylants

Vrije Universiteit Brussel - iMinds

BE

Madhukar

Budagavi

Texas Instruments Inc.

US

Done

Bugdayci Sansli

Tampere University of Technology / Nokia

FI

Hyung Gi

Byun

Kangwon National University

KR

Beerend

Ceulemans

Vrije Universiteit Brussel - ETRO

BE

Eric

Chai

Real Communications, Inc.

US

Alan

Chalmers

University of Warwick

UK

Mary-Luc

Champel

Technicolor

FR

Yulin

Chang

MediaTek Inc.

US

Chun-Chi

Chen

NCTU/ITRI International

TW

Jianle

Chen

Qualcomm Incorporated

US

Jie

Chen

Peking University

SG

Peisong

Chen

Broadcom Corporation

US

Xu

CHEN

HiSilicon Co.,Ltd.

CN

Ying

Chen

Qualcomm Inc.

US

Spencer

Cheng

Morphbius Technology

CA

Jae Sook

Cheong

ETRI

KR

Leonardo

Chiariglione

CEDEO.net

IT

Toru

Chinen

Sony Corporation

JP

Yoonsik

Choe

Yonsei University

KR

Byeongdoo

Choi

Samsung Electronics Co., Ltd.

KR

Haechul

Choi

Hanbat National University

KR

Jangwon

Choi

Yonsei University

KR

Kiho

Choi

Hanyang University

KR

Miran

Choi

ETRI

KR

sang Bae

Chon

Samsung Electronics

KR

Fersch

Christof

Dolby Germany GmbH

DE

Takeshi

Chujoh

Toshiba Corporation

JP

Sorin

Cismas

oViCs

US

Robert

Cohen

Mitsubishi Electric

US

Cyril

Concolato

Telecom ParisTech

FR

Giovanni

Cordara

Huawei Technologies Duesseldorf GmbH

DE

Jonathan

Courtney

Cable Television Laboratories

US

Werner

de Bruijn

Philips

NL

Franck

Denoual

CANON Research Centre France SAS

FR

Jwalant

Desai

Ittiam Systems

US

Sachin

Deshpande

Sharp Corporation

US

Lingyu

DUAN

Peking University

CN

Xavier

Ducloux

Thomson Video Networks

FR

Alberto

Duenas

NGCodec Inc

US

Touradj

Ebrahimi

EPFL

CH

Yuqun

Fan

Huawei Technologies

CN

Esmaeil

Faramarzi

Samsung Electronics

US

Felix

Fernandes

Samsung

US

Gerard

Fernando

Intoclip

US

Davide

Ferri

Sisvel Technology srl

IT

Siegfried

Foessel

Fraunhofer IIS

DE

Chad

Fogg

Harmonic

US

Simone

Fontana

Huawei Technologies Düsseldorf GmbH

DE

Gianluca

Francini

Telecom Italia

IT

Edouard

Francois

Technicolor

FR

Per

Fröjdh

Ericsson

SE

Arild

Fuldseth

Cisco

NO

Wen

Gao

Harmonic

US

Diego

Gibellino

Telecom Italia

IT

Alex

Giladi

InterDigital Communications

US

Mukta

Gore

Nvidia

US

Rocco

Goris

Philips

NL

Jonathan

Griffiths

Qualcomm

US

Dan

Grois

Fraunhofer HHI - Heinrich Hertz Institute

DE

Karsten

Grüneberg

Fraunhofer HHI

DE

Qunshan

Gu

Google Inc.

US

Marc

Guez Vucher

SCPP

FR

Xin

Guo

Vixs Systems

CA

Xun

Guo

Microsoft

CN

Raj

Gupta

ViXS Systems Inc

CA

Samir

Gupta

Qualcomm

US

Wassim

Hamidouche

IETR/INSA de Rennes

FR

Jong-Ki

Han

Sejong University

KR

Woo-Jin

Han

Gachon University

KR

Miska

Hannuksela

Nokia

FI

Ryoji

Hashimoto

Renesas Electronics Corporation

JP

Shinobu

Hattori

Sony

JP

YONG

HE

InterDigital

US

James

Helman

MovieLabs

US

FNU

Hendry

Qualcomm Incorporated

US

Arianne

Hinds

Cable Television Laboratories

US

Mitsuhiro

Hirabayashi

SONY Corporation

JP

Dzung

Hoang

Zenverge

US

Ingo

Hofmann

Fraunhofer IIS

DE

Remi

Houdaille

Technicolor

FR

Yang

Hu

Cisco Systems

US

Cheng

Huang

ZTE Corporation

CN

Qi

Huang

Dolby

CN

Tiejun

Huang

Peking University

CN

Yu-Wen

Huang

MediaTek Inc.

TW

Kilroy

Hughes

Microsoft

US

Jae-Doo

Huh

ETRI

KR

Sunghee

Hwang

Samsung Electronics

KR

Atsuro

Ichigaya

NHK

JP

Tomohiro

Ikai

Sharp Corporation

JP

Fabian

Jaeger

RWTH Aachen University

DE

Euee Seon

Jang

Hanyang University

KR

In-Su

Jang

ETRI

KR

Yeon-Kyeong

Jeong

Sejong University

KR

Sang Hyun

Joo

ETRI

KR

YongSoo

Joo

Myongji University

KR

Rajan

Joshi

Qualcomm

US

Bojan

Joveski

Institut Mines-Telecom, Telecom SudParis

FR

Joel

Jung

Orange Labs

FR

Jung Won

Kang

ETRI

KR

Kyeongok

KANG

ETRI

KR

Mukta

Kar

Cable Television Laboratories

US

Marta

Karczewicz

Qualcomm

US

Kei

Kawamura

KDDI Inc. (KDDI R&D Labs., Inc.)

JP

Kimihiko

Kazui

Fujitsu Laboratories Ltd.

JP

Erh-Chung

Ke

ITRI

TW

Joachim

Keinert

Fraunhofer IIS

DE

Louis

Kerofsky

Interdigital

US

Sylvain

Kervadec

Orange Labs

FR

Changki

Kim

ETRI

KR

DaeYeon

Kim

Chipsnmedia

KR

Geun-Hyung

Kim

Dong-Eui University

KR

Hae kwang

Kim

Sejong Univ.

KR

Hui Yong

Kim

ETRI

KR

Hyungyu

Kim

Hanyang University

KR

Jae-Gon

Kim

Korea Aerospace University

KR

Kyuheon

Kim

Kyunghee Univ.

KR

Min-Uk

Kim

Konkuk University

KR

MinWoo

Kim

Myongji University

KR

Sang-Kyun

Kim

Myongji University

KR

Suah

Kim

Korea University (Multimedia Security Lab)

KR

Yong Han

Kim

The University of Seoul

KR

Krasimir

Kolarov

Apple

US

Jacek

Konieczny

Huawei Technologies Duesseldorf GmbH

DE

Panagiotis

Koudoumakis

Queen Mary University of London

UK

Michael

Kratschmer

Fraunhofer IIS

DE

B. Anil

Kumar

Microsoft

US

Achim

Kuntz

Fraunhofer IIS

DE

PoLin

LAI

MediaTek USA

US

Jani

Lainema

Nokia

FI

Guillaume

Laroche

CANON Research Centre France SAS

FR

Sébastien

Lasserre

Technicolor

FR

Thorsten

Laude

Institut fuer Informationsverarbeitung

DE

Traian

Lavric

Institut Mines-Télécom

FR

Jean

Le Feuvre

Telecom ParisTech

FR

Hahyun

Lee

ETRI

KR

Jae Yung

Lee

Sejong University

KR

Jin Young

Lee

ETRI

KR

Jin Young

Lee

Samsung Electronics

KR

Keundong

LEE

ETRI

KR

Seung Wook

Lee

ETRI

KR

Seung-Jae

Lee

LG Electronics

KR

Seungjae

Lee

ETRI

KR

Sunil

Lee

Samsung Electronics

KR

Taejin

LEE

ETRI

KR

Shawmin

Lei

MediaTek

TW

Skjalg

Lepsoy

Telecom Italia

IT

Vladimir

Levantovsky

Monotype

US

Billy

Li

ViXS Systems Inc.

CA

Ming

LI

ZTE Corporation

CN

Xiang

Li

Qualcomm Technologies, Inc

US

Zhu

Li

Samsung Research America

US

Chris

Lilley

W3C

FR

ChongSoon

Lim

Panasonic R&D Centre Singapore

SG

Joo-Hwee

LIM

Institute for Infocomm Research

SG

Seong Yong

Lim

ETRI

KR

Taebeom

Lim

KETI

KR

Youngkwon

Lim

Samsung

US

Ching-Chieh

Lin

ITRI

TW

Jian-Liang

Lin

MediaTek Inc.

TW

Tao

Lin

Tongji University

CN

Yongbing

Lin

Huawei Technologies

CN

Lingzhi

Liu

Intel

US

Shan

Liu

MediaTek USA Inc.

US

Yongliang

Liu

Huawei Technologies Co., Ltd

CN

Zongxian

LIU

Panasonic R&D Center Singapore

SG

Ning

Lu

Samsung Electronics

US

Peng

Lu

Zhejiang University

CN

Taoran

Lu

Dolby Laboratories

US

Ajay

Luthra

Arris

US

Zhan

Ma

Huawei Technologies

US

Vinod Kumar

Malamal Vadakital

Nokia Corporation

FI

Gaelle

Martin-Cocher

BlackBerry

CA

Shohei

Matsuo

NTT Corporation

JP

Marco

Mattavelli

EPFL / SCI-STI-MM

CH

Ken

McCann

Samsung / Zetacast

UK

Rufail

Mekuria

Centrum Wiskunde Informatica

NL

Philipp

Merkle

Fraunhofer HHI

DE

Sabino

Metta

RAI RadioTelevisione Italiana

IT

Koohyar

Minoo

Arris

US

Richard

Mitic

Ericsson

SE

Kazuyuki

Miyazawa

Mitsubishi Electric Corporation

JP

Jaewon

Moon

KETI

KR

Martin

Morrell

Qualcomm

US

Luntian

Mou

Peking University

CN

Karsten

Mueller

Fraunhofer HHI

DE

Tokumichi

Murakami

Mitsubishi Electric Corporation

JP

Yeshwant

Muthusamy

Samsung Research Americas - Dallas

US

Sang-il

Na

ETRI

KR

Takayuki

Nakachi

NTT

JP

Ohji

Nakagami

Sony corporation

JP

Sam

Narasimhan

Arris

US

Ambarish

Natu

Department of Communications

AU

Max

Neuendorf

Fraunhofer IIS

DE

Didier

NICHOLSON

VITEC Multimédia

FR

Takahiro

Nishi

Panasonic

JP

Masayuki

Nishiguchi

Sony Corporation

JP

ByungTae

Oh

Korea Aerospace University

KR

Henney

Oh

WILUS Institute

KR

JungYup

Oh

Myongji University

KR

Sejin

Oh

LG Electronics

KR

Jens-Rainer

Ohm

RWTH Aachen

DE

Patrice

ONNO

CANON Research Centre France SAS

FR

Werner

Oomen

Philips

NL

Joern

Ostermann

Leibniz Universitaet Hannover

DE

Ozgur

Oyman

Intel Corporation

US

Peshala

Pahalawatta

DDD USA Inc

US

Gregory

Pallone

Orange

FR

Clemens

Par

Swissaudec

US

Chanyul

Park

Samsung Electronics Co., Ltd.

KR

Hochong

Park

Kwangwoon University

KR

Kyungmo

Park

Samsung Electronics Co., Ltd.

KR

Min Woo

Park

Samsung Electronics

KR

Sang Hyo

Park

Hanyang University

KR

Stavros

Paschalakis

Visual Atoms

UK

Sairus

Patel

Adobe

US

Sassan

Pejhan

Directv

US

Wen-Hsiao

PENG

ITRI International/NCTU

TW

Michelle

Perham

Microsoft

US

Nils

Peters

Qualcomm technologies inc

US

Pierrick

Philippe

Orange

FR

Jan

Plogsties

Fraunhofer IIS

DE

Marius

Preda

Institut MINES TELECOM

FR

Hyeoncheol

Pu

Samsung Electronics

KR

Wei

Pu

Qualcomm

US

Schuyler

Quackenbush

Audio Research Labs

US

Mohamad

Raad

RaadTech Consulting

AU

Adarsh Krishnan

Ramasubramonian

Qualcomm Incorporated

US

Mickael

Raulet

IETR/INSA

FR

Justin

Ridge

Nokia

FI

Chris

Rosewarne

Canon

AU

David

Rudin

Microsoft

US

Dmytro

Rusanovskyy

LG Electronics USA

US

Intae

Ryoo

Kyung Hee University

KR

Jesus

Sampedro

Polycom

US

Jonatan

Samuelsson

Ericsson

SE

Yago

Sanchez de la Fuente

Fraunhofer HHI

DE

Sridhar

Sankuratri

Microsoft

US

Hisao

Sasai

Panasonic

JP

Kazushi

Sato

Sony Corp

JP

Nicholas

Saunders

Sony Europe Ltd.

UK

Peter

Schelkens

Vrije Universiteit Brussel - iMinds

BE

Thomas

Schierl

Fraunhofer HHI

DE

Shun-ichi

Sekiguchi

Mitsubishi Electric Corporation

JP

Deep

Sen

Qualcomm

US

Takanori

Senoh

NICT

JP

Jeongil

SEO

ETRI

KR

Kwang-deok

Seo

Yonsei University

KR

Panji

Setiawan

Huawei Technologies

DE

Karl

Sharman

Sony Europe Ltd

UK

Masato

Shima

Canon Inc.

JP

Shinya

Shimizu

NTT Corporation

JP

Avraham

Shimor

SanDisk Corporation

IL

Jae-Seob

SHIN

Pixtree Inc.

KR

David

Singer

Apple Inc.

US

Rickard

Sjoberg

Ericsson

SE

Robert

Skupin

Fraunhofer Heinrich Hertz Institute

DE

Youngwan

So

Samsung Electronics

KR

Iraj

Sodagar

Microsoft

US

Joel

Sole

Qualcomm

US

Thomas

Sporer

Fraunhofer IDMT

DE

Olgierd

Stankiewicz

Poznan University of Technology

PL

Nikolce

Stefanoski

Disney Research Zurich

CH

Thomas

Stockhammer

Qualcomm Incorporated

DE

Dale

Stolitzka

Samsung Display

US

Kevin

Streeter

Adobe Systems

US

Shiori

Sugimoto

NTT

JP

Takehiro

Sugimoto

NHK

JP

Doug Young

Suh

Kyunghee University

KR

Jong-Yeul

Suh

LG Electronics

KR

Gary

Sullivan

Microsoft

US

Viswanathan (Vishy)

Swaminathan

Adobe Systems Inc.

US

Maxim

Sychev

Huawei

RU

Yasser

Syed

Comcast Labs

US

Vivienne

Sze

Massachusetts Institute of Technology

US

Ali

Tabatabai

Sony Electronics Inc.

US

TK

Tan

NTT DOCOMO, Inc

JP

Naoya

Tanaka

Panasonic

JP

Masayuki

Tanimoto

Nagoya Industrial Science Research Institute

JP

Kenji

Tashiro

Sony USRC

US

Gerhard

Tech

Fraunhofer HHI

DE

Andrew

Tescher

Microsoft

US

Herbert

Thoma

Fraunhofer IIS / AME

DE

Emmanuel

Thomas

TNO

NL

Dong

Tian

Mitsubishi Electric Research Labs

US

Christian

Timmerer

Alpen-Adria-Universität Klagenfurt

AT

Yoshihide

Tonomura

NTT Labs

JP

Pankaj

Topiwala

FastVDO

US

Alexandros

Tourapis

Apple Inc

US

Cong Thang

Truong

University of Aizu

JP

Christian

Tulvan

Mines Telecom - Telecom SudParis

FR

Yi-Shin

Tung

MStar Semiconductor, Inc

TW

Kemal

Ugur

Nokia

TR

Sebastiaan

Van Leuven

Ghent University - iMinds - Multimedia Lab

BE

Glenn

Van Wallendael

Ghent University - iMinds - Multimedia Lab

BE

Thijs

Vermeir

Barco NV

BE

Anthony

Vetro

Mitsubishi Electric

US

Jean-Ronan

Vigouroux

technicolor

FR

Zubair

Visharam

Apple, Inc

US

Wade

Wan

Broadcom Corporation

US

Ronggang

Wang

Peking University Shenzhen Graduate School

CN

Wei

Wang

Huawei Technologies

US

Xian

Wang

Huawei Technologies

US

Xin

Wang

Huawei Technologies

US

Ye-Kui

Wang

Qualcomm

US

Yi-Chu

Wang

Intel Corporation

US

Hitoshi

Watanabe

Harmonic Inc.

US

Shuichi

Watanabe

Sharp Corporation

JP

Krzysztof

Wegner

Poznan University of Technology

PL

Sheng

Wei

Adobe

US

James

Welch

IneoQuest Technologies

US

Aaron

Wells

Ambarella

US

Hocheon

Wey

Samsung Electronics

KR

Mathias

Wien

RWTH Aachen University

DE

Menno

Wildeboer

Philips Research

NL

In Su

Won

INHA University, Korea

KR

Hsi-Jung

Wu

Apple Inc

US

Ping

Wu

ZTE (UK) Ltd

UK

Oliver

Wuebbolt

Technicolor

DE

Pei

Xiang

Qualcomm, Inc.

US

Jizheng

Xu

Microsoft Corp.

CN

Jun

Xu

Sony Electronics Inc

US

Meng

Xu

Huawei Technologies (USA)

US

Xiaozhong

Xu

MediaTek

US

Tomoyuki

Yamamoto

SHARP Corporation

JP

Yuki

Yamamoto

Sony Corporation

JP

JING

YE

Mediatek

US

Yan

Ye

InterDigital Communications

US

Sehoon

Yea

LG Electronics

KR

Peng

Yin

Dolby Laboratories, Inc.

US

Jeong Ju

YOO

ETRI

KR

Kyoungro

Yoon

Konkuk University

KR

Haoping

Yu

Huawei Technologies (USA)

US

Lu

Yu

Zhejiang University

CN

Jae-Kwan

Yun

ETRI

KR

Weimin

Zeng

Real Communications Inc.

US

Li

Zhang

Qualcomm Inc.

US

Louis

Zhang

AMD

CA

Yichen

Zhang

Zhejiang University

CN

Wilf

Zhao

ViXS Systems Inc.

CA

Jianhua

Zheng

HiSilicon Technologies Co. Ltd.

CN

Xiaozhen

Zheng

Huawei Technologies

CN

Minhua

Zhou

Broadcom

US

Xiaosong

Zhou

Apple Inc.

US

Ye

Zhou

Marvell Semiconductor

US

You

Zhou

Microsoft

US

Jianqing

Zhu

Fujitsu R&D Center Co.,Ltd.

CN

Michael

Zink

Technicolor

US

Bill

Zou

DTS

US

Feng

Zou

Qualcomm

US

Richard

Allen

Altera

UK

Yong Jin

Cho

Samsung Electronics

KR

Keiichi

Chono

NEC

JP

Zhouye

Gu

Santa Clara University

US

James

Holland

Intel Corporation

US

Michael

Horowitz

eBrisk Video, Inc.

CA

Cheng-Teh, Ted

Hsieh

Qualcomm

US

Russell

James

Altera

UK

Hosung

Kim

Samsung Electronics

KR

Seung-Hwan

Kim

Sharp Labs of America

US

Thomas

Kunlin

STMicroelectronics

FR

Jung Hyun

Kwon

Chips&Media

KR

Philippe

Laffont

STMicroelectronics

FR

Bae-Keun

Lee

KT

KR

Gwo Giun (Chris)

Lee

NCKU/ITRI

US

Hongbin

Liu

Qualcomm wireless communication technology (China)

US

Dimitrie

Margarit

Sigma Designs, Inc.

US

Kiran

Misra

Sharp Labs of America

US

Matteo

Naccari

Bbc R&d

UK

Junghak

Nam

LG Electronics

KR

Tung

Nguyen

Fraunhofer HHI

DE

Chao

Pang

Qualcomm

US

Krishnakanth

Rapaka

Qualcomm Technologies Inc.

US

Vadim

Seregin

Qualcomm

US

Huifang

Sun

Mitsubishi Electric Research Labs

US

Teruhiko

Suzuki

Sony Corp.

JP

Stephan

Wenger

Vidyo. Inc.

US

Xiaoyu

Xiu

InterDigital Communications Inc.

US

Lihua

Zhu

Microsoft

US

Shangfeng

Zhu

Cisco Systems Inc.

US

Toshiaki

Fujii

Nagoya University

JP

Youngsu

Heo

KHU

KR

Miok

Kim

Santa Clara University

US

Sunmi

Yoo

LG Electronics

KR

Harald

Alvestrand

Google

SE

Vijay Ramaseshan

Chandrasekhar

Institute for Infocomm Research

SG

Bumsuk

Choi

ETRI

KR

Cristina

Gomila

Technicolor R&D France

FR

David

Hoffman

Samsung Display Americas Lab

US

Walt

Husak

Dolby

US

Takaaki

Ishikawa

Waseda University

JP

Wenhui

Jia

Dolby Labs

US

Cheong Ghil

Kim

Namseoul University

KR

Youngseop

Kim

Dankook University

KR

Gauthier

Lafruit

University of Hasselt

BE

Taegyu

Lee

Yonsei University

KR

Yong-Hwan

Lee

Dankook University

KR

Gerard

Madec

Telecom Bretagne

FR

Massimo

Mattelliano

Sisvel Technology

IT

Ajit

Ninan

Dolby

US

Shigetaka

Ogawa

ICT-Link

JP

Arkady

Ten

Dolby Labs

US

Akio

Yamada

NEC Corp.

JP


  1. Agenda


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