International organisation for standardisation organisation internationale de normalisation



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11.1.2Guide to meetinh hosts


The following document was approved


12634

Guidelines for prospective WG 11 meeting hosts



11.2Promotional activities


The following documents were approved


12693

Short descriptions

12631

Geneva press release



11.3Resolutions of this meeting


These were approved

12A.O.B.

13Closing


Meeting closed at 2012/05/04T19:00



  1. Attendance list

Last name

First name

Company

Country

Raad

Mohamad

RaadTech Consulting

Australia

Timmerer

Christian

Alpen-Adria-Universität Klagenfurt

Austria

De Cock

Jan

Ghent University - IBBT

Belgium

Hanca

Jan

VUB

Belgium

Sechelea

Andrei

VUB

Belgium

Van Leuven

Sebastiaan

Ghent University - IBBT

Belgium

Van Wallendael

Glenn

Ghent University - IBBT

Belgium

Gournay

Philippe

VoiceAge Corporation

Canada

Martin-Cocher

Gaëlle




Canada

Nasiopoulos

Panos

UBC

Canada

Pourazad

Mahsa

TELUS

Canada

Ridel

Jean-Francois

SENSIO

Canada

Chen

Weizhong

Huawei Technologies

China

Chen

Jie

Institue of Digital Media

China

Duan

Lingyu

Institue of Digital Media

China

He

Yun

Tsinghua University

China

Hong

Yingjie

ZTE

China

Huang

Cheng

ZTE Corporation

China

Huang

Tiejun

Peking University

China

Lin

Hongbin

LG Electronics

China

Lin

Yongbing

Huawei

China

Liu

Zheng

Huawei Technologies Co

China

Lu

Peng




China

Wang

Lu

ASTRI

China

Yu

Lu

Zhejiang University

China

Yue

Peiyu

huawei

China

Zhao

Yu

ZTE

China

Zhao

Yin




China

Zheng

Xiaozhen

Huawei

China

Zheng

Jianhua

Huawei Technologies

China

Chang

Yulin

MediaTek Inc.

China

Chen

Fang-Chu

ITRI

China

Chen

Chun-Chi

ITRI International/NCTU

China

Lee

Gwo Giun (Chris)

National Cheng Kung University

China

Tung

Yi-Shin

MStar Semiconductor, Inc

China

Bici

Oguz




Finland

Hannuksela

Miska

Nokia

Finland

Rusanovskyy

Dmytro

Nokia

Finland

Andrivon

Pierre

Technicolor

France

Boucachard

Philippe

Canon Research Centre France

France

Champel

Mary-Luc




France

Dufourd

Jean-Claude

Telecom ParisTech

France

Francoise

Francoise

MINES ParisTech

France

Gendron

Patrick

Thomson Video Networks

France

Guez Vucher

Marc

SCPP

France

Guionnet

Thomas

INRIA

France

Jung

Joel

Orange Labs

France

Kervadec

Sylvain

Orange Labs

France

Lavric

Traian

TELECOM SudParis

France

Mitrea

Mihai

Institut Telecom

France

Nassor

Eric

Canon Research Centre France

France

Noblet

Ludovic

Dolby Laboratories Inc

France

Pallone

Gregory

Orange Labs

France

Perey

Christine

Institut Telecom

France

Philippe

Pierrick

Orange Labs

France

Preda

Marius

Institut TELECOM

France

Racape

Fabien




France

Raulet

Mickael

IETR/INSA Rennes

France

Sébastien

LASSERRE

Canon Research Centre France

France

Tulvan

Christian

Institut Telecom

France

Bäse

Gero

Siemens

Germany

Boehm

Johannes

Technicolor

Germany

Bouazizi

Imed

Huawei Technologies Düsseldorf GmbH

Germany

Cordara

Giovanni

Huawei Technologies

Germany

Esenlik

Semih

Panasonic

Germany

Fischer

Daniel

Fraunhofer IIS

Germany

Grill

Bernhard

Fraunhofer IIS

Germany

Hellge

Cornelius

Fraunhofer HHI

Germany

Herre

Juergen

Fraunhofer Institut

Germany

Jaeger

Fabian

RWTH Aachen University

Germany

Kamp

Steffen

Panasonic R&D Center Germany

Germany

Kraemer

Ferenc

Dolby Germany GmbH

Germany

Merkle

Philipp

Fraunhofer HHI

Germany

Müller

Karsten

Fraunhofer HHI

Germany

Narroschke

Matthias

Panasonic

Germany

Neuendorf

Max

Fraunhofer IIS

Germany

Ohm

Jens-Rainer

RWTH Aachen

Germany

Ostermann

Jörn

Leibniz Universität Hannover

Germany

Robilliard

Julien




Germany

Sanchez de la Fuente

Yago

Fraunhofer HHI

Germany

Schierl

Thomas

Fraunhofer HHI

Germany

Schueuer

Klaas

Dolby Berlin GmbH

Germany

Schwarz

Heiko

Fraunhofer HHI

Germany

Skupin

Robert

Fraunhofer HHI

Germany

Sporer

Thomas

Fraunhofer IDMT

Germany

Stockhammer

Thomas

Qualcomm Incorporated

Germany

Tech

Gerhard

Fraunhofer HHI

Germany

Terentiv

Leon

Fraunhofer

Germany

Virette

David

Huawei Technologies

Germany

Wedi

Thomas

Panasonic

Germany

Wübbolt

Oliver

Technicolor

Germany

Zhao

Zhijie

Leibniz Universitaet Hannover

Germany

Arumugam

Jawahar

Sharp

India

Farkash

Eyal

NDS

Israel

Shimor

Avraham

SanDisk

Israel

Anselmo

Tea

STMicroelectronics

Italy

Boch

Laurent

RAI - Radiotelevisione Italiana

Italy

Bruna

Arcangelo

STMicroelectronics

Italy

Chiariglione

Leonardo

CEDEO.net

Italy

Cucca

Maria Giovanna

Rai

Italy

D'Amato

Paolo

Sisvel Technology srl

Italy

Difino

Angelo

CEDEO.net

Italy

Ferri

Davide

Sisvel Technology srl

Italy

Francini

Gianluca

Telecomm Italia

Italy

Gibellino

Diego

Telecom Italia

Italy

Giovanni

Ballocca

Sisvel Technology srl

Italy

Giovara

Vittorio

Sisvel Technology srl

Italy

Hofmann

Ingo

Fraunhofer IIS

Italy

Lepsoy

Skjalg




Italy

Mattelliano

Massimo

Sisvel Technology srl

Italy

Messina

Alberto




Italy

Mosca

Alessandra

Sisvel Technology srl

Italy

Pau

Danilo

STMicroelectronics

Italy

Ando

Akio

NHK

Japan

Aoki

Shuichi

Japan Broadcasting Corporation

Japan

Asai

Kohtaro

Mitsubishi Electric Corporation

Japan

Chinen

Toru

Sony Corporation

Japan

Chono

Keiichi

NEC

Japan

Chujoh

Takeshi

Toshiba Corporation

Japan

Harada

Noboru

NTT

Japan

Hattori

Shinobu

Sony

Japan

Hirabayashi

Mitsuhiro

SONY Corp.

Japan

Ichigaya

Atsuro




Japan

Iwamoto

Kota

NEC

Japan

Kaneko

Itaru

Tokyo Polytechnic

Japan

Kawamura

Kei




Japan

Kazui

Kimihiko

FUJITSU LABORATORIES LTD.

Japan

Kodama

Tomoya

TOSHIBA Corporation

Japan

Koyama

Jumpei




Japan

Mase

Ryota

NEC Corporation

Japan

Matsumura

Masaaki

NTT Corporation

Japan

Matsuo

Shohei

NTT corporation

Japan

Murakami

Tokumichi

Mitsubishi Electric Corporation

Japan

Nakachi

Takayuki

NTT

Japan

Nakagami

Ohji

Sony corporation

Japan

Nakamura

Hiroya

JVC KENWOOD Corporation

Japan

Nishi

Takahiro

Panasonic

Japan

Norimatsu

Takeshi

Panasonic Corporation

Japan

Senoh

Takanori

NICT

Japan

Shimada

Satoshi

FUJITSU LABORATORIES LTD.

Japan

Shimizu

Shinya

NTT Corporation

Japan

Sugimoto

Kazuo

Mitsubishi Electric Corporation

Japan

Sugio

Toshiyasu

Panasonic

Japan

Sugito

Yasuko

NHK

Japan

Suzuki

Teruhiko

Sony Corp.

Japan

Suzuki

Kazuyoshi




Japan

Suzuki

Yoshinori

NTT DOCOMO, Inc.

Japan

Takahashi

Yoshitomo

Sony Corporation

Japan

Takamura

Seishi

NTT Corporation

Japan

Tanimoto

Masayuki




Japan

Tanizawa

Akiyuki

Toshiba corporation

Japan

Tokumo

Yasuaki




Japan

Uchiumi

Tadashi

Sharp Corporation

Japan

Watanabe

Shuichi

Sharp Corporation

Japan

Yamakage

Tomoo

Toshiba Corporation

Japan

Yamamoto

Tomoyuki

Sharp

Japan

Yamamoto

Yuki

Sony corporation

Japan

Bruls

Fons

Philips

Netherlands

Oomen

Werner

Philips

Netherlands

Domanski

Marek

Poznan University of Technology

Poland

Stankiewicz

Olgierd

Poznan University of Technology

Poland

Wegner

Krzysztof

Poznan University of Technology

Poland

Nunes

Paulo

Instituto de Telecomunicações

Portugal

Ahn

Minsu

Samsung Electronics

Rep. of Korea

Bae

Seong Jun

ETRI

Rep. of Korea

Bang

Gun

ETRI

Rep. of Korea

Byun

Hyung Gi

Kangwon National University

Rep. of Korea

Cha

Jihun

ETRI

Rep. of Korea

Cho

Yongju

ETRI

Rep. of Korea

Cho

Yong-Sang

KATS/KSA

Rep. of Korea

Choi

Kiho




Rep. of Korea

Choi

Hyomin




Rep. of Korea

Choi

Byeongdoo

Samsung

Rep. of Korea

Choi

Miran

ETRI

Rep. of Korea

Choi

Brian

ETRI

Rep. of Korea

Cui

Li

Hanyang University

Rep. of Korea

Han

Seungju

Samsung Electronics

Rep. of Korea

Han

Jae Joon

samsung electronics

Rep. of Korea

Hendry

Hendry

LG Electronics

Rep. of Korea

Heo

Jin




Rep. of Korea

Ho

Yo Sung

GIST

Rep. of Korea

Hwang

Sung Oh

Samsung Electronics

Rep. of Korea

Hwang

Sunghee

University of Seoul

Rep. of Korea

Jang

Euee




Rep. of Korea

Jang

In-Su

ETRI

Rep. of Korea

Jeon

ByeongMoon

LG Electronics

Rep. of Korea

Jeong

Sangoh




Rep. of Korea

Joo

Sanghyun

ETRI

Rep. of Korea

Kang

Kyeongok

ETRI

Rep. of Korea

Kang

Jung Won

ETRI

Rep. of Korea

Kang

DongNam

Nextreaming

Rep. of Korea

Kim

Hyunguy




Rep. of Korea

Kim

Sowon




Rep. of Korea

Kim

Kyung Yong

Kyunghee University

Rep. of Korea

Kim

Sung Hei

ETRI

Rep. of Korea

Kim

Jungsun

LG Electronics

Rep. of Korea

Kim

Sang-Kyun

Myongji University

Rep. of Korea

Kim

Chang Ki

ETRI

Rep. of Korea

Kim

Yong Han

University of Seoul

Rep. of Korea

Kim

Jae Hyun

Samsung Electronics

Rep. of Korea

Kim

Jeong-Do

Hoseo University

Rep. of Korea

Kim

Kyunzon

Kyung Hee University

Rep. of Korea

Kwon

SoonYoung

ETRI

Rep. of Korea

Kwon

Sun Hyoung




Rep. of Korea

Lee

Sinwook

Hanyang University

Rep. of Korea

Lee

Jaejoon

Samsung Electronics

Rep. of Korea

Lee

Jin Young




Rep. of Korea

Lee

Seung Wook

ETRI

Rep. of Korea

Lee

Junwoo

INHA Univ.

Rep. of Korea

Lee

Yonghun

Kyung Hee University

Rep. of Korea

Lee

Jin

ETRI

Rep. of Korea

Lee

Hae Ryong

ETRI

Rep. of Korea

Lee

EunJung

Samsung Mobile

Rep. of Korea

Lee

Byoung-Dai

Kyonggi University

Rep. of Korea

Lim

Seong Yong

ETRI

Rep. of Korea

Na

Sangil

ETRI

Rep. of Korea

Nam

Junghak

Kwangwoon University

Rep. of Korea

Oh

Seoungjun

Kwangwoon University

Rep. of Korea

Oh

Kwan-Jung

Samsung Electronics

Rep. of Korea

Oh

Eunmi

Samsung Electronics

Rep. of Korea

Park

Kyungmo

Samsung Electronics Co., Ltd.

Rep. of Korea

Rhyu

Sungryeul

Samsung Electronics

Rep. of Korea

Seo

Jeongil

ETRI

Rep. of Korea

Seo

Kwang-deok




Rep. of Korea

Sim

Donggyu

Kwangwoon University

Rep. of Korea

Song

Yunseok

GIST

Rep. of Korea

Song

Jeongook




Rep. of Korea

Song

Joeyeon

Samsung Electronics

Rep. of Korea

Yang

Hyun-Koo

Samsung Electronics

Rep. of Korea

Yea

Sehoon




Rep. of Korea

Yoo

Sunmi

Kwangwoon University

Rep. of Korea

Yoon

Kyoungrof

Konkuk University

Rep. of Korea

Fartukov

Alexey

LLC SMRC

Russia

Mishurovskiy

Mikhail

LLC SMRC

Russia

Silchev

Maxim

Huawei

Russia

Anantharaman

Kaushik

Panasonic Singapore Laboratories

Singapore

Chan

Ti Eu




Singapore

Lim

Chong Soon

Panasonic R&D Singapore

Singapore

Tan

Thiow Keng

NTT DOCOMO, Inc. Japan

Singapore

Zhu

Yongwei

Institute for Infocomm Research

Singapore

Carballeira

Pablo

Universidad Politecnica de Madrid

Spain

Delgado

Jaime

UPC

Spain

Juarez

Eduardo

Universidad Politecnica de Madrid

Spain

Llorente

Silvia

UPC

Spain

Morán Burgos

Francisco

Universidad Politécnica de Madrid

Spain

Fröjdh

Per

Ericsson

Sweden

Norkin

Andrey

Ericsson

Sweden

Rusert

Thomas

Ericsson AB

Sweden

Ebrahimi

Touradj

EPFL

Switzerland

Jean-Pierre

Evain

EBU

Switzerland

Kernen

Thomas

Cisco

Switzerland

Kouadio

Adi

EBU

Switzerland

Mattavelli

Marco

EPFL

Switzerland

Par

Clemens

swissaudec GmbH

Switzerland

Stefanoski

Nikolce

Disney Research Zurich

Switzerland

Takacs

Gabriel

EBU

Switzerland

Benjelloun Touimi

Abdellatif

Huawei Technologies

United Kingdom

Bober

Miroslaw

University of Surrey

United Kingdom

Fernando

Gerard

ZTE Corporation

United Kingdom

Huggett

Anthony

Aptina UK Limited

United Kingdom

Kudumakis

Panos

Queen Mary University of London

United Kingdom

McCann

Ken




United Kingdom

Murray

Kevin

NDS

United Kingdom

Paschalakis

Stavros




United Kingdom

Wu

Ping

ZTE (UK) Ltd

United Kingdom

Bivolarsky

Lazar

Skype

United States

Bossen

Frank

DOCOMO Innovations

United States

Boyce

Jill

Vidyo

United States

Chandrasekhar

Vijay

Stanford University

United States

Chang

Wo

NIST

United States

Chen

Ying

Qualcomm Inc.

United States

Chen

Jianwen

Tsinghua University

United States

Chiu

Yi-Jen

Intel Corp.

United States

Dolan

Michael




United States

Fernandes

Felix




United States

Gao

Wen

Huawei Technologies

United States

Giladi

Alex

Huawei

United States

Gupta

Shalini

Nvidia

United States

Haque

Munsi

Sony Electronics, Inc.

United States

He

onardo

InterDigital Communications

United States

Hinds

Arianne

Cable Television Laboratories

United States

Hughes

Kilroy

Microsoft

United States

Hughes

Gary

Motorola Mobility

United States

Husak

Walt

Dolby Labs

United States

Kar

Mukta

CableLabs

United States

Kolarov

Krasimir

Apple Inc.

United States

Lai

PoLin

Samsung

United States

Leontaris

Athanasios




United States

Levantovsky

Vladimir

Monotype imaging

United States

Li

Xiang

Qualcomm Inc.

United States

Lim

Youngkwon




United States

Luthra

Ajay

Motorola Mobility

United States

Ma

Zhan

Samsung

United States

Narasimhan

Mandayam

Motorola

United States

Quackenbush

Schuyler

Audio Research Labs

United States

Reznik

Yuriy

Inter Digital

United States

Rodriguez

Arturo

Cisco

United States

Saxena

Ankur

Samsung

United States

Sen

Deep

Qualcomm

United States

Sharma

Suman

Intel Corporation

United States

Singer

David

Apple

United States

Sodagar

Iraj

Microsoft

United States

Stachurski

Jacek

Texas Instruments

United States

Streeter

Kevin

Adobe Systems, Inc

United States

Sullivan

Gary

Microsoft

United States

Syed

Yasser

comcast

United States

Tescher

Andrew

Microsft

United States

Tian

Dong

Mitsubishi Electric Research Labs

United States

van der Auwera

Xin

Huawei Technologies

United States

Van der Auwera

Geert

Qualcomm Inc.

United States

Vetro

Anthony

Mitsubishi Electric

United States

Wan

Wade




United States

Wang

Ye-Kui

Qualcomm

United States

Xiasong

Zhou

Apple Inc.

United States

Xie

Minjie

ZTE Corporation

United States

Yu

Haoping

Huawei Technologies

United States

Zhang

Li

Qualcomm Inc.

United States

Zink

Michael

Technicolor

United States

Zou

Bill

DTS

United States


  1. Agenda

#

#

#

Item

1





Opening

2





Roll call of participants

3





Approval of agenda

4





Allocation of contributions

5





Communications from Convenor

6





Report of previous meeting

7





Processing of NB Position Papers

8





Work plan management



1



Media coding





1

Frame Packing Arrangement Signalling in MPEG-2 Video





2

Frame Packing Arrangement Signalling for Quincunx Pattern





3

New SEI message on MVC view and additional signaling in frame packing SEI signaling





4

Multi-resolution 3D mesh coding





5

Composite Font Representation





6

OFF Additional script and language tags





7

Web Video Coding





8

Contract Expression Language





9

CAL Extensions





10

Reconfigurable Media Coding





11

Media Context and Control – Control Information





12

Media Context and Control – Sensory Information





13

Media Context and Control – Virtual World Object Characteristics





14

Media Context and Control – Data Formats for Interaction Devices





15

Media Context and Control – Common Types and Tools





16

High-Efficiency Video Coding





17

3D Audio





18

3D Video Coding





19

Internet Video Coding





20

Multimedia Preservation





21

Codec independent media description



2



Composition coding





1

Scene Description Based Collaborative Applications





2

Advanced User Interaction



3



Description coding





1

Audio-visual description profile





2

Compact Descriptors for Visual Search





3

Social Metadata





4

AVDP Profiles





5

User Description



4



Systems support





1

Audio Systems Interaction



5



IPMP





1

Common Encryption Format for ISO Base Media File Format



6



Digital Item





1

Digital Item Linking



7



Transport and File formats





1

MPEG-2 Systems DASH support





2

Simplified carriage of MPEG-4 over MPEG-2 TS





3

Various enhancements including support for large metadata





4

MPEG-DASH Implementation Guidelines





5

MPEG Media Transport



8



Multimedia architecture





1

MPEG-M Architecture





2

MXM API





3

MPEG-M Elementary Services





4

MPEG-M Service Aggregation





5

MPEG-M Usage guidelines





6

MPEG-V Architecture



9



Application formats





1

Surveillance Application Format





2

Professional Archival Application Format





3

Stereoscopic Video AF DASH support





4

Augmented Reality AF



10



Reference implementation





1

Efficient representation of 3D meshes with multiple attributes Reference Software





2

Reference software multi-resolution 3D mesh compression





3

Audio-visual Description Profile Reference Software





4

DASH Reference Software





5

Video Tool Library Reference Software





6

SAOC Reference Software





7

USAC Reference Software





8

USAC Reference Software





9

MPEG-DASH Reference Software





10

MPEG-M Reference Software





11

MPEG-V – Reference Software



11



Conformance





1

3D Efficient representation of 3D meshes with multiple attributes Conformance





2

Multiresolution 3D mesh coding Conformance





3

Video Tool Library Conformance





4

SAOC Conformance





5

USAC Conformance





6

MPEG-DASH Conformance





7

MPEG-M Conformance





8

MPEG-V – Conformance



12



Maintenance





1

Systems coding standards





2

Video coding standards





3

Audio coding standards





4

3DG coding standards





5

Systems description coding standards





6

Visual description coding standards





7

Audio description coding standards





8

MPEG-21 standards





9

MPEG-A standards

9






Organisation of this meeting



1



Tasks for subgroups



2



Joint meetings

10





WG management



1



Terms of reference



2



Officers



3



Editors



4



Liaisons



5



Responses to National Bodies



6



Work item assignment



7



Ad hoc groups



8



Asset management





1

Reference software





2

Conformance





3

Test material





4

URI



9



IPR management



10



Work plan and time line

11





Administrative matters



1



Schedule of future MPEG meetings



2



Promotional activities

11





Administrative matters



1



Schedule of future MPEG meetings



2



Promotional activities

12





Resolutions of this meeting

13





A.O.B.

14





Closing



  1. Input contributions





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