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Annex B to JCT-VC report: List of meeting participants



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Annex B to JCT-VC report:
List of meeting participants


The participants of the eleventh meeting of the JCT-VC, according to badge pick-up records produced by the ITU staff (approximately 262 in total), were as follows:


  1. Zineb Agyo (ATEME)

  2. Sangsoo Ahn (KAIST)

  3. Yongjo Ahn (Kwangwoon University (KWU))

  4. Elena Alshina (Samsung electronics)

  5. Peter Amon (Siemens AG)

  6. Kenneth Andersson (LM Ericsson)

  7. Pierre Andrivon (Technicolor)

  8. Marco Arena (RAI)

  9. Cheung Auyeung (Sony Electronics Inc.)

  10. Giovanni Ballocca (Sisvel Technology srl)

  11. Vittorio Baroncini (Fondazione Ugo Bordoni)

  12. Andrea Basso (Sisuel Tech)

  13. Lazar Bivolarski (Skype)

  14. Gisle Bjøntegaard (Cisco Systems Norway)

  15. Frank Bossen (DOCOMO Innovations)

  16. Stephen Botzko (Polycom)

  17. Jill Boyce (Vidyo)

  18. Benjamin Bross (Fraunhofer HHI)

  19. Heribert Brust (Fraunhofer HHI)

  20. Madhukar Budagavi (Texas Instruments Inc.)

  21. Done Bugdayci (Nokia)

  22. Sungmin Cha (Intellectual Discovery)

  23. Eric (chi W.) Chai (Real Communications)

  24. Yu-Lin Chang (MediaTek USA Inc.)

  25. Chun-Chi Chen (ITRI International/NCTU)

  26. Chun-Fu Chen (NCKU/ITRI)

  27. Jianle Chen (Qualcomm Incorporated)

  28. Peisong Chen (Broadcom Corporation)

  29. Weizhong Chen (Huawei technologies CO.,LTD)

  30. Ying Chen (Qualcomm Inc.)

  31. Yi-Jen Chiu (Intel Corp.)

  32. Yongjin Cho (Samsung Electronics Co., Ltd)

  33. Byeongdoo Choi (Samsung Electronics Co. Ltd.)

  34. Jangwon Choi (Yonsei University)

  35. Kiho Choi (Hanyang University)

  36. Kwanghyun Choi (Sejong University)

  37. Keiichi Chono (NEC)

  38. Tzu-Der Chuang (MediaTek USA Inc.)

  39. Takeshi Chujoh (Toshiba Corporation)

  40. Robert Cohen (Mitsubishi Electric Research Laboratories)

  41. Paolo D'amato (Sisvel Technology)

  42. Thomas Davies (Cisco Systems (Tandberg))

  43. Olivier Déforges (Insa Rennes)

  44. Franck Denoual (Canon Research Centre France)

  45. Sachin Deshpande (Sharp)

  46. Erwan Di Vita (Allegro DVT)

  47. Alexey Dolgoborodov (Vanguard Software Solution)

  48. Jie Dong (InterDigital Communications, LLC)

  49. Xavier Ducloux (THOMSON VIDEO NETWORKS)

  50. Alberto Duenas (NGCodec Inc)

  51. Myungjin Eom (Samsung Electronics)

  52. Semih Esenlik (Panasonic R&D Center Germany)

  53. Christian Feldmann (RWTH Aachen University)

  54. Felix Fernandes (Samsung)

  55. Davide Ferri (Sisvel Technology)

  56. David Flynn (Research In Motion Limited)

  57. Chad Fogg (Harmonic Inc.)

  58. Remy Foray (Allegro DVT)

  59. Edouard Francois (Canon)

  60. Per Fröjdh (Ericsson)

  61. Arild Fuldseth (Cisco Systems, Norway)

  62. John Funnell (Parabola Research Limited)

  63. Wen Gao (Huawei Technologies)

  64. Patrick Gendron (Thomson Video Networks)

  65. Christophe Gisquet (Canon)

  66. Zhouye Gu (Santa Clara University)

  67. Liwei Guo (Qualcomm Technologies, Inc.)

  68. Mei Guo (MediaTek USA Inc.)

  69. Ajit Gupte (Texas Instruments India Private Limited)

  70. Woo-Jin Han (Gachon University)

  71. Miska Hannuksela (Nokia Corporation)

  72. Munsi Haque (Sony Corporation)

  73. Ryoji Hashimoto (Renesas Electronics Corporation)

  74. Shinobu Hattori (Sony Corp)

  75. Dake He (Research In Motion Ltd.)

  76. Yong He (InterDigital Communication)

  77. Hendry Hendry (LG Electronics)

  78. Félix Henry (Orange Labs)

  79. Arianne Hinds (Cable Television Laboratories)

  80. Dzung Hoang (Zenverge, Inc.)

  81. Soongi Hong (Yonsei University)

  82. Sung-Wook Hong (Sejong University)

  83. Hideyoshi Horimai (3Dragons)

  84. Hideo Hoshuyama (NIKON CORPORATION)

  85. Yu-Wen Huang (MediaTek USA Inc.)

  86. Tan Hui Li (Institute for Infocomm Research)

  87. Walt Husak (Dolby Labs)

  88. Atsuro Ichigaya (Japan Broadcasting Corporation (NHK))

  89. Ando Ichiro (Nikon Corporation)

  90. Tomohiro Ikai (Sharp Corporation)

  91. Masaru Ikeda (Sony Electronics Inc.)

  92. Faisal Ishtiaq (Motorola Mobility)

  93. Fabian Jaeger (RWTH Aachen University)

  94. Wonkap Jang (Vidyo Inc.)

  95. Byeongmoon Jeon (LG Electronics)

  96. Byeungwoo Jeon (Sungkyunkwan University)

  97. Xu Jizheng (Microsoft Corporation)

  98. Koyama Jumpei (FUJITSU LABORATORIES LTD.)

  99. Joel Jung (Orange Labs)

  100. Tae-Young Jung (Chips&Media)

  101. Jung Won Kang (ETRI)

  102. Mukta L. Kar (Cable Television Laboratories)

  103. Marta Karczewicz (Qualcomm)

  104. Kei Kawamura (KDDI Corporation)

  105. Kimihiko Kazui (FUJITSU LABORATORIES LTD.)

  106. Chanyul Kim (Samsung Electronics)

  107. Chulkeun Kim (LG Electronics)

  108. Daehoon Kim (Chips&Media)

  109. Hyunmi Kim (ETRI)

  110. Jae-Gon Kim (Korea Aerospace University)

  111. Jungsun Kim (LG Electronics)

  112. Kyeonghye Kim (Kwangwoon University)

  113. Kyung Yong Kim (KyungHee University)

  114. Munchurl Kim (KAIST)

  115. Volodymyr Kolesnikov (Canon Information Systems Research Australia Pty Ltd/Canon Inc)

  116. Anand Meher Kotra (IETR-INSA)

  117. Hideyasu Kuniba (Nikon Corporation)

  118. Eugene Kuznetsov (Intel)

  119. Do-Kyoung Kwon (Texas Instruments)

  120. Jani Lainema (Nokia)

  121. Indra Laksono (Standards Council of Canada)

  122. Guillaume Laroche (Canon Research Centre France (on behalf of CANON INC (Japan)))

  123. Thorsten Laude (Institut fuer Informationsverarbeitung, Leibniz Universitaet Hannover)

  124. Gwo Giun (chris) Lee (NCKU/ITRI)

  125. Hahyun Lee (ETRI)

  126. Hoyoung Lee (Sungkyunkwan Univ.)

  127. Jae Yung Lee (Sejong University)

  128. Jinho Lee (ETRI)

  129. Min-Ho Lee (Sejong university)

  130. Sunil Lee (Samsung Electronics)

  131. Sunyoung Lee (Pantech)

  132. Yung-Lyul Lee (Sejong University)

  133. Shawmin Lei (MediaTek USA Inc.)

  134. Bin Li (University of Science and Technology of China)

  135. Chong Soon Lim (Panasonic Corporation)

  136. Sung-Chang Lim (Electronics and Telecommunications Research Institute (ETRI))

  137. Woong Lim (Kwangwoon University)

  138. Jian-Liang Lin (MediaTek USA Inc.)

  139. Tao Lin (Tongji University)

  140. Yongbing Lin (Huawei Technologies Co., Ltd.)

  141. Peter List (Deutsche Telekom, Labs)

  142. Lukasz Litwic (Ericsson Television Limited)

  143. Hongbin Liu (LG Electronics (China) R&D Center Co.LTD)

  144. Shan Liu (MediaTek USA Inc.)

  145. Patrick Lopez (Technicolor)

  146. Shuo Lu (Sony corporation)

  147. Ajay Luthra (Motorola Mobility)

  148. Siwei Ma (Peking University)

  149. Zhan Ma (Samsung Electronics)

  150. Gaelle Martin-Cocher (Research in motion)

  151. Masaaki Matsumura (NTT corporation)

  152. Shohei Matsuo (NTT Corporation)

  153. Ken Mccann (Samsung/ZetaCast)

  154. Assaf Menachem (CSR)

  155. Philipp Merkle (Fraunhofer HHI)

  156. Akira Minezawa (Mitsubishi Electric Corporation)

  157. Mikhail Mishurovskiy (Samsung Moscow Research Center)

  158. Kiran Misra (Sharp Corporation)

  159. Naotaka Morita (NTT)

  160. Marta Mrak (BBC R&D)

  161. Tokumichi Murakami (Mitsubishi Electric Corporation)

  162. Matteo Naccari (British Broadcasting Corporation)

  163. Sue Naing (Panasonic R&D Center Singapore)

  164. Takayuki Nakachi (NTT)

  165. Ohji Nakagami (Sony corporation)

  166. Hiroya Nakamura (JVC Kenwood Corporation)

  167. Matthias Narroschke (Paanasonic R&D Center Germany)

  168. Panos Nasiopoulos (University of British Columbia)

  169. Nguyen Nguyen (Research in Motion Ltd.)

  170. Tung Nguyen (Fraunhofer HHI)

  171. Takahiro Nishi (Panasonic)

  172. Andrey Norkin (Ericsson)

  173. Jens-Rainer Ohm (RWTH Aachen University)

  174. Stankiewicz Olgierd (Poznan University of Technology)

  175. Patrice Onno (Canon Research Centre France)

  176. Joonyoung Park (LG electronics)

  177. Min-Woo Park (Samsung Electronics Co., Ltd.)

  178. Nicolas Pellerin (ST Microelectronics)

  179. Wen-Hsiao Peng (ITRI International/NCTU)

  180. Mohamad Raad (RaadTech Consulting)

  181. Adarsh Krishnan Ramasubramonian (Qualcomm Technologies Incorporated)

  182. Krishnakanth Rapaka (Qualcomm Technologies Inc)

  183. Shevach Riabtsev (CSR plc group)

  184. Justin Ridge (Nokia Oyj)

  185. Christopher Rosewarne (CiSRA / Canon Inc)

  186. Damian Ruiz (UNIVERSIDAD POLITECNICA DE VALENCIA)

  187. Dmytro Rusanovskyy (Nokia)

  188. Thomas Rusert (Ericsson)

  189. Jesus Sampedro (Polycom Inc.)

  190. Jonatan Samuelsson (Telefonaktiebolaget LM Ericsson)

  191. Hisao Sasai (Panasonic Corporation)

  192. Kazushi Sato (Sony Corp.)

  193. Nicholas Saunders (Broadcast & Professional Research Labs, Sony Europe Ltd)

  194. Ankur Saxena (Samsung)

  195. Thomas Schierl (Fraunhofer HHI)

  196. Klaas Schueuer (Dolby Germany GmbH)

  197. Andrew Segall (Sharp Corporation)

  198. Vadim Seregin (Qualcomm)

  199. Cho Seunghyun (ETRI)

  200. Karl Sharman (Broadcast & Professional Research Labs, Sony Europe Ltd)

  201. Masato Shima (Canon Inc.)

  202. Shinya Shimizu (NTT Corporation)

  203. Rickard Sjöberg (Ericsson AB)

  204. Robert Skupin (Fraunhofer HHI)

  205. Joel Sole (Qualcomm)

  206. Niko Stefanoski (Disney Research Zurich)

  207. Karsten Suehring (Fraunhofer HHI)

  208. Kazuo Sugimoto (Mitsubishi Electric Corporation)

  209. Shiori Sugimoto (NTT)

  210. Yasuko Sugito (NHK (Japan Broadcasting Corporation))

  211. Gary Sullivan (Microsoft Corporation)

  212. Huifang Sun (Mitsubishi Electric Research Labs)

  213. Teruhiko Suzuki (Sony Corp.)

  214. Yasser Syed (Comcast Labs)

  215. Vivienne Sze (Texas Instruments)

  216. Ali Tabatabai (Sony Electronics Inc.)

  217. Seishi Takamura (NTT Media Intelligence Laboratories, NTT Corporation)

  218. Mahsa Talebpourazad (TELUS Communications & University of British Columbia)

  219. Thiow Keng Tan (NTT DOCOMO, Inc.)

  220. Yih Han Tan (Institute for Infocomm Research)

  221. Akiyuki Tanizawa (TOSHIBA Corporation)

  222. Jean-Marc Thiesse (ATEME)

  223. Herbert Thoma (Fraunhofer IIS)

  224. Pankaj Topiwala (FastVDO LLC)

  225. Alexandros Tourapis (Apple Inc)

  226. Cong-Thang Truong (University of Aizu)

  227. Yi-Shin Tung (ITRI USA / MStar Semiconductor, Inc.)

  228. Kemal Ugur (Nokia)

  229. Geert Van Der Auwera (Qualcomm Technologies Inc.)

  230. Sebastiaan Van Leuven (Ghent University - iMinds)

  231. Glenn Van Wallendael (Ghent University - iMinds)

  232. Anthony Vetro (Mitsubishi Electric Research Labs)

  233. Wade Wan (Broadcom Corporation)

  234. Ye-Kui Wang (Qualcomm Technologies Inc.)

  235. Thomas Wedi (Panasonic)

  236. Rajitha Weerakkody (BBC Research & Development)

  237. Stephan Wenger (Vidyo, Inc.)

  238. Thomas Wiegand (Fraunhofer HHI)

  239. Mathias Wien (RWTH Aachen University)

  240. Ping Wu (ZTE (UK) Ltd)

  241. Tomoo Yamakage (Toshiba Corporation)

  242. Tomoyuki Yamamoto (SHARP Corporation)

  243. Haitao Yang (Huawei Technologies)

  244. Xiaofeng Yang (Huawei Technologies Co., Ltd.)

  245. Yan Ye (InterDigital Communications LLC)

  246. Sehoon Yea (LG Electronics)

  247. Chuohao Yeo (Institute for Infocomm Research)

  248. Peng Yin (Dolby Laboratories, Inc.)

  249. Jonghun Yoo (Kwangwoon University (KWU))

  250. Haoping Yu (Huawei Technologies (USA))

  251. Yong Yu (Broadcom Corp)

  252. Jinwen Zan (Huawei Technologies)

  253. Dazhong Zhang (Apple)

  254. Li Zhang (Qualcomm Incorporated)

  255. Louis Zhang (AMD)

  256. Wenhao Zhang (Intel Corporation)

  257. Yichen Zhang (Zhejiang University)

  258. Yin Zhao (Zhejiang University)

  259. Zhijie Zhao (Leibniz Universitaet Hannover)

  260. Jianhua Zheng (Huawei Technologies)

  261. Xiaozhen Zheng (Huawei Technologies)

  262. Wenjing Zhu (Hong Kong University of Science and Technology)

JCT-3V report

Source: Jens Ohm and Gary Sullivan, Chairs

Summary

The Joint Collaborative Team on 3D Video Coding Extension Development (JCT-3V) of ITU-T WP3/16 and ISO/IEC JTC 1/ SC 29/ WG 11 held its third meeting during 17–23 Jan 2013 at the ITU-T premises in Geneva, CH. The JCT-3V meeting was held under the chairmanship of Dr Jens-Rainer Ohm (RWTH Aachen/Germany) and Dr Gary Sullivan (Microsoft/USA). For rapid access to particular topics in this report, a subject categorization is found (with hyperlinks) in section 1.13 of this document.

The meeting was mainly held in a “single track” fashion, with few breakout activities (as documented in this report) held in parallel. Several plenary sessions were chaired by Dr Anthony Vetro, particularly in cases when neither of the two chairs was able to attend due to commitments in other groups or joint meetings. It was usually avoided to make decisions which might cause objections in such cases.

The JCT-3V meeting sessions began at approximately 0900 hours on Thursday 17 Jan 2013. Meeting sessions were held on all days until the meeting was closed at approximately 1300 hours on Wednesday 23 Jan. Approximately 200 people attended the JCT-3V meeting, and approximately 220 input documents were discussed. The meeting took place in a collocated fashion with a meeting of ITU-T SG16 – one of the two parent bodies of the JCT-VC. The subject matter of the JCT-3V meeting activities consisted of work on 3D extensions of the Advanced Video Coding (AVC) and the High Efficiency Video Coding (HEVC) standards.

The primary goals of the meeting were to review the work that was performed in the interim period since the first JCT-3V meeting in producing


  • The 5th version of specification Draft of the MVC extension by depth maps (which had been issued as an ISO/IEC Study of DAM document);

  • The 4th version of specification Draft of the AVC 3D extension framework (3D-AVC, which had been issued as an ISO/IEC Proposed Draft Amendment document);

  • The 4th test model of the AVC 3D extension framework (3D-AVC), and associated software;

  • The 2nd version of draft text of the Multiview HEVC extension (MV-HEVC);

  • The 2nd test model of the HEVC 3D extension framework (3D-HEVC) and associated software;

  • The Draft of MVC plus depth conformance specification.

Furthermore, the JCT-3V reviewed the results from the interim Core Experiments (CE); reviewed technical input documents; produced updated versions of the draft texts, framework descriptions and software implementations of the items above; and planned a new set of Core Experiments (CEs) for further investigation of proposed technology.

The JCT-3V produced 8 particularly important output documents from the meeting:



  • MVC Extension for Inclusion of Depth Maps Draft Text 6 (ISO/IEC 14496-10:2012/FDAM2, also submitted to SG16 for AAP consent)

  • Draft Text 5 of 3D-AVC (Study of ISO/IEC 14496-10:2012/PDAM2)

  • Test Model 5 of 3D-AVC, and associated software

  • Draft Text 3 of MV-HEVC (ISO/IEC 23008-2:200X/PDAM2)

  • Test Model 3 of 3D-HEVC (includes MV-HEVC as subset), and associated software

  • Draft 2 of MVC plus Depth Conformance (ISO/IEC 14496-4:2004/PDAM41)

  • Draft 2 of Multi-resolution Frame Compatible Stereo (ISO/IEC 14496-10:2012/PDAM5)

  • Common Test Conditions of 3DV Core Experiments

Moreover, plans were established to conduct 7 future CEs in the interim period until the next meeting.

For the organization and planning of its future work, the JCT-3V established 14 "Ad Hoc Groups" (AHGs) to progress the work on particular subject areas. The next five JCT-3V meetings are planned for 20–26 April 2013 under WG 11 auspices in Incheon, KR, 27 July – 02 Aug 2013 under WG 11 auspices in Vienna, AT, 26 Oct– 1 Nov. 2013 under ITU-T auspices in Geneva, CH, 11–17 Jan. 2014 under WG 11 auspices in San Jose, US, and 29 March – 4 April 2014 under WG 11 auspices in Valencia, ES.

The document distribution site http://phenix.it-sudparis.eu/jct3v/ was used for distribution of all documents.

The reflector to be used for discussions by the JCT-3V and all of its AHGs is jct-3v@lists.rwth-aachen.de.



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