Joint Collaborative Team on d video Coding Extension Development of itu-t sg 16 wp and iso/iec jtc 1/sc 29/wg 11



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JCT3V-G0167

m32154

2014-01-04 14:18:58

2014-01-06 07:57:16

2014-01-09 20:49:04

3D-CE4: Crosscheck of Results on improved advanced residual prediction (JCT3V-G0064)

T. Ikai (Sharp)




JCT3V-G0168

m32155

2014-01-04 14:19:20

2014-01-06 07:57:41

2014-01-06 07:57:41

3D-AHG5: Crosscheck of On complexity reduction of bi-prediction for advanced residual prediction (JCT3V-G0057)

T. Ikai (Sharp)




JCT3V-G0169

m32156

2014-01-04 14:19:35

2014-01-06 07:58:09

2014-01-09 20:58:50

3D-CE3 related: Crosscheck of Simplification on NBDV derivation in 3D-HEVC (JCT3V-G0050)

T. Ikai (Sharp)




JCT3V-G0170

m32157

2014-01-04 14:19:48

2014-01-06 07:58:31

2014-01-06 07:58:31

3D-CE2 related: Crosscheck of Simplification of DV Derivation for Depth Coding (JCT3V-G0074)

T. Ikai (Sharp)




JCT3V-G0171

m32158

2014-01-04 14:20:14

2014-01-06 07:59:01

2014-01-06 07:59:01

3D-CE3 related: Crosscheck of Adaptive Disabling Temporal Inter-View Candidates (JCT3V-G0078)

T. Ikai (Sharp)




JCT3V-G0172

m32159

2014-01-04 14:20:28

2014-01-06 07:59:24

2014-01-08 07:29:11

3D-CE3 related: Crosscheck of Simplification of 3D Merge list construction (JCT3V-G0099)

T. Ikai (Sharp)




JCT3V-G0173

m32160

2014-01-04 14:20:43

2014-01-06 08:00:20

2014-01-06 08:00:20

3D-CE5 related: Crosscheck of Conditional zero residual for segment-wise depth inter mode coding (JCT3V-G0058)

T. Ikai (Sharp)




JCT3V-G0174

m32169

2014-01-04 22:16:38

2014-01-04 22:26:13

2014-01-04 22:26:13

On MV-HEVC+D encoder parameters

A. Norkin, U. Hakeem, R. Sjöberg (Ericsson)




JCT3V-G0175

m32177

2014-01-05 11:59:08

2014-01-05 12:13:56

2014-01-05 12:13:56

CE5-related: Cross Check of Unification of delta DC coding and signaling for inter SDC and intra SDC in 3D-HEVC (JCT3V-G0130)

F. Jäger (RWTH Aachen University)




JCT3V-G0176

m32178

2014-01-05 12:01:00

2014-01-05 12:19:03

2014-01-05 12:19:03

CE3: Cross Check of AMVP candidate list construction for DCP blocks (JCT3V-G0065)

F. Jäger (RWTH Aachen University)




JCT3V-G0177

m32191

2014-01-06 03:36:46

2014-01-06 03:40:55

2014-01-06 03:40:55

CE3 related: Cross-check results on limitation of the Range of NBDV (JCT3V-G0082)

M. LI, P. WU(ZTE)




JCT3V-G0178

m32192

2014-01-06 03:44:19

2014-01-09 02:57:41

2014-01-09 02:57:41

CE5 related: Crosscheck of Delta DC coding for SDC and DMM modes (JCT3V-G0124)

J. Nam, J. Heo, S. Yea (LGE)




JCT3V-G0179

m32205

2014-01-06 07:51:43

2014-01-08 09:27:09

2014-01-08 09:27:09

Crosscheck on VSP depth access simplification (JCT3V-G0035)

Y.-W. Chen, J.-L. Lin (MediaTek)




JCT3V-G0180

m32206

2014-01-06 07:52:11

2014-01-08 09:27:34

2014-01-08 09:27:34

Crosscheck on Simplified VSP subblock decision (JCT3V-G0036)

Y.-W. Chen, J.-L. Lin (MediaTek)




JCT3V-G0181

m32208

2014-01-06 07:56:07

2014-01-08 09:28:05

2014-01-08 09:28:05

CE5: Crosscheck on simplification on SDC planar coding (JCT3V-G0113)

Y.-W. Chen, J.-L. Lin (MediaTek)




JCT3V-G0182

m32210

2014-01-06 08:00:21

2014-01-08 09:28:31

2014-01-08 09:28:31

3D-CE5 related: Crosscheck on Depth quantization in intra residual domain (JCT3V-G0103)

Y.-W. Chen, J.-L. Lin (MediaTek)




JCT3V-G0183

m32211

2014-01-06 08:01:55

2014-01-11 09:44:10

2014-01-11 09:44:10

Crosscheck of Improvement on Do-NBDV derivation (JCT3V-G0080)

T. Ikai (Sharp)




JCT3V-G0184

m32228

2014-01-06 11:59:46

2014-01-06 12:03:05

2014-01-06 12:03:05

CE5: Cross check of generic SDC for all Intra modes (JCT3V-G0122)

P. Merkle (HHI)




JCT3V-G0185

m32231

2014-01-06 12:48:58

2014-01-09 18:53:42

2014-01-09 18:53:42

3D-CE1 related: Crosscheck on VSP combining inter-view ARP (JCT3V-G0059)

S. Shimizu, S. Sugimoto (NTT)




JCT3V-G0186

m32232

2014-01-06 12:49:24

2014-01-11 18:48:37

2014-01-11 18:48:37

3D-CE3 related: Crosscheck on Simplification on DV-MCP searching process (JCT3V-G0049)

S. Shimizu, S. Sugimoto (NTT)




JCT3V-G0187

m32349

2014-01-07 02:39:23

2014-01-07 03:10:57

2014-01-07 03:10:57

3D-CE4.h related: Crosscheck on an alternative disparity vector derivation method for ARP (JCT3V-G0095)

G. G. Lee, B.-S. Li, C.-F. Chen, Z.-H. Yu, C.-H. Huang (NCKU)




JCT3V-G0188

m32352

2014-01-07 04:30:23

2014-01-09 18:36:33

2014-01-09 18:36:33

CE5 related: Crosscheck on MediaTek's proposal "Removal of neighbouring sample filtering for depth intra prediction (JCT3V-G0052)"

X. Zheng (HiSilicon)




JCT3V-G0189

m32353

2014-01-07 04:31:46

2014-01-09 18:37:02

2014-01-09 18:37:02

CE5 related: Crosscheck on MediaTek's proposal "Simplified Intra Prediction for Depth Coding in 3D-HEVC (JCT3V-G0054)"

X. Zheng (HiSilicon)




JCT3V-G0190

m32354

2014-01-07 04:33:06

2014-01-10 03:46:28

2014-01-10 03:46:28

CE5: Crosscheck on MediaTek's proposal "Results on bin reduction for inter SDC residual coding (JCT3V-G0056)"

X. Zheng (HiSilicon)




JCT3V-G0191

m32355

2014-01-07 04:34:06

2014-01-11 20:56:49

2014-01-11 20:56:49

AHG8: Crosscheck on MediaTek's proposal "Simplification on CABAC contexts for IC and ARP Flags (JCT3V-G0061)"

X. Zheng (HiSilicon)




JCT3V-G0192

m32356

2014-01-07 04:35:42

2014-01-10 23:49:19

2014-01-10 23:49:19

AHG8 related: Crosscheck on MediaTek's proposal "A simplified method on DMM mode coding in 3D-HEVC (JCT3V-G0062)"

X. Zheng (HiSilicon)




JCT3V-G0193

m32357

2014-01-07 04:37:13

2014-01-11 19:21:24

2014-01-11 19:21:24

CE5 related: Crosscheck on Qualcomm and PKU's proposal "Simplification of 64x64 Intra SDC mode in 3D-HEVC (JCT3V-G0123)"

X. Zheng (HiSilicon)




JCT3V-G0194

m32358

2014-01-07 05:34:50

2014-01-09 19:03:29

2014-01-09 19:03:29

CE3 related: Crosscheck on Qualcomm and PKU's proposal "Motion storage optimization in 3D-HEVC (JCT3V-G0128)"

X. Zheng (HiSilicon)




JCT3V-G0195

m32364

2014-01-07 08:11:18

2014-01-07 08:15:53

2014-01-07 08:15:53

3D-CE2: Cross check of additional merging candidates for depth coding (JCT3V-G0063)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0196

m32365

2014-01-07 08:11:33

2014-01-07 08:17:38

2014-01-07 08:17:38

3D-CE2 related: Cross check of simplification on interview motion prediction for depth coding (JCT3V-G0047)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0197

m32366

2014-01-07 08:11:45

2014-01-07 08:19:07

2014-01-07 08:19:07

3D-CE2 related: Cross check of simplification of merge candidate list in depth coding (JCT3V-G0127)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0198

m32367

2014-01-07 08:11:53

2014-01-07 08:20:32

2014-01-07 08:20:32

3D-CE3 related: Cross check of worst case complexity reduction for merge candidate construction (JCT3V-G0034)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0199

m32368

2014-01-07 08:12:01

2014-01-07 08:22:16

2014-01-07 08:22:16

3D-CE5: Cross check of simplification of DMM pattern generation and signaling (JCT3V-G0112)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0200

m32369

2014-01-07 08:12:09

2014-01-07 08:24:10

2014-01-07 08:24:10

3D-CE5 related: Cross check of removal of boundary filters for depth intra prediction (JCT3V-G0051)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0201

m32370

2014-01-07 08:12:19

2014-01-07 08:25:51

2014-01-07 08:25:51

3D-AHG8: Cross check of simplification on CABAC contexts for the syntax related to inter SDC, intra SDC and DMM (JCT3V-G0060)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0202

m32371

2014-01-07 08:12:27

2014-01-07 08:27:40

2014-01-07 08:27:40

Cross check of removal of quad-tree limitation for depth maps (JCT3V-G0071)

J. Y. Lee, C. Kim (Samsung)




JCT3V-G0203

m32376

2014-01-07 08:54:10

2014-01-09 02:45:14

2014-01-09 02:45:14

3D-CE1: Crosschecking for qualcomm's simplification for sub-PU level inter-view motion prediction

J. An, K. Zhang (MediaTek)




JCT3V-G0204

m32377

2014-01-07 08:54:51

2014-01-07 09:42:21

2014-01-07 09:42:21

CE4: Crosscheck for Qualcomm's JCT3V-G0121

K. Zhang, J. An, X. Zhang (MediaTek)




JCT3V-G0205

m32378

2014-01-07 08:55:51

2014-01-09 08:04:25

2014-01-09 08:04:25

CE5 Related:Crosschecking for hisilicon's Implicit split process for intra SDC JCT3V-G0111

X. Zhang, K. Zhang, J. An (MediaTek)




JCT3V-G0206

m32379

2014-01-07 08:56:29

2014-01-09 08:05:32

2014-01-09 08:05:32

CE5 related: Crosschecking for hisilicon's neighbouring reference pixel selection for depth intra coding, JCT3V-G0143

X. Zhang, K. Zhang, J. An (MediaTek)




JCT3V-G0207

m32380

2014-01-07 08:57:06

2014-01-07 09:42:55

2014-01-07 09:42:55

Crosscheck for HiSilicon's JCT3V-G0079

K. Zhang, J. An, X. Zhang (MediaTek)




JCT3V-G0208

m32383

2014-01-07 09:14:24

2014-01-07 09:33:26

2014-01-13 22:15:48

AHG10: Complexity assessment of motion compensation process

T. Ikai (Sharp)




JCT3V-G0209

m32389

2014-01-07 10:37:27

2014-01-09 19:08:51

2014-01-09 19:08:51

CE5: Crosscheck for Qualcomm's JCT3V-G0122 (3)

X. Chen (HiSilicon)




JCT3V-G0210

m32393

2014-01-07 11:17:26

2014-01-09 19:16:00

2014-01-09 19:16:00

3D-CE2 related: Cross-check of JCT3V-G0055: a texture-partition-dependent depth partition for 3D-HEVC

J. Jung (Orange Labs)




JCT3V-G0211

m32398

2014-01-07 16:27:22

2014-01-11 03:27:05

2014-01-11 03:27:05

Crosschecking for hisilicon's VSD bugfix and improvement, JCT3V-G0163

X. Zhang, K. Zhang, J. An (MediaTek)




JCT3V-G0212

m32403

2014-01-07 17:31:03

2014-01-07 17:34:50

2014-01-07 17:34:50

Cross check of: CE2: Sub-PU based MPI (JCT3V-G0119)

G. Tech(HHI)




JCT3V-G0213

m32430

2014-01-08 02:33:36

2014-01-08 06:09:04

2014-01-08 06:09:04

CE5 related: Crosscheck on DMM1 signaling based on intra direction (JCT3V-G0108)

H. Liu (Qualcomm)




JCT3V-G0214

m32431

2014-01-08 02:35:38

2014-01-08 06:11:07

2014-01-08 06:11:07

CE1 related: Crosscheck on Modifications to motion hole filling in sub-PU level inter-view motion prediction (JCT3V-G0084)

H. Liu (Qualcomm)




JCT3V-G0215

m32432

2014-01-08 02:36:47

2014-01-08 06:13:06

2014-01-08 06:13:06

Crosscheck on Improvement on NBDV derivation (JCT3V-G0081)

H. Liu (Qualcomm)




JCT3V-G0216

m32433

2014-01-08 02:37:37

2014-01-08 06:14:50

2014-01-08 06:14:50

CE5: Crosscheck on Segment-wise depth inter mode coding (JCT3V-G0101)

H. Liu (Qualcomm)




JCT3V-G0217

m32434

2014-01-08 02:38:34

2014-01-08 06:17:16

2014-01-08 06:17:16

CE5 related: Crosscheck on Segment-wise depth intra mode coding (JCT3V-G0102)

H. Liu (Qualcomm)




JCT3V-G0218

m32435

2014-01-08 02:39:29

2014-01-08 06:18:53

2014-01-08 06:18:53

CE1: Crosscheck on Motion parameters stored for VSP-coded blocks (JCT3V-G0148)

H. Liu (Qualcomm)




JCT3V-G0219

m32436

2014-01-08 02:42:13

2014-01-08 06:20:04

2014-01-08 06:20:04

CE1 related: Crosscheck on Simplification of sub-PU level temporal interview motion prediction (JCT3V-G0147)

H. Liu (Qualcomm)




JCT3V-G0220

m32437

2014-01-08 03:05:50

2014-01-08 03:08:17

2014-01-08 03:08:17

3D-CE4: Cross check of Further improvements on advanced residual prediction (JCT3V-G0121)

M. W. Park, C. Kim (Samsung)




JCT3V-G0221

m32442

2014-01-08 04:26:10

2014-01-08 04:31:38

2014-01-08 04:31:38

3D-CE3: Cross-check on additional depth-based DV candidate (JCT3V-G0100)

J.-L. Lin, Y.-W. Chen (MediaTek)




JCT3V-G0222

m32444

2014-01-08 05:54:11

2014-01-09 07:52:35

2014-01-09 07:52:35

3D-CE4: Cross check of Improved advanced residual prediction (JCT3V-G0064)

L. Zhang(Qualcomm)




JCT3V-G0223

m32446

2014-01-08 06:28:27

2014-01-11 09:11:34

2014-01-18 19:19:47

3D-CE4: Cross check of Simplification of inter-view ARP (JCT3V-G0158)

L. Zhang(Qualcomm)




JCT3V-G0224

m32479

2014-01-08 22:52:10

2014-01-18 03:40:43

2014-01-18 03:40:43

MV-HEVC/SHVC HLS: Additional information on the POC design in JCTVC-P0041/JCT3V-G0031

A. K. Ramasubramonian, Hendry, Y.-K. Wang (Qualcomm)




JCT3V-G0225

m32481

2014-01-09 00:01:44

2014-01-09 00:04:10

2014-01-09 00:04:10

Crosscheck results on clean ups of VSP merging candidates (Method 1 & 2 in JCT3V-G0104)

M. LI, P. WU(ZTE)




JCT3V-G0226

m32483

2014-01-09 00:58:53

2014-01-09 01:03:30

2014-01-09 01:03:30

CE4: Crosscheck for Qualcomm's JCT3V-G0121

J. Heo, J. Nam (LGE)




JCT3V-G0227

m32527

2014-01-09 18:34:43

2014-01-09 18:40:24

2014-01-09 18:40:24

3D-CE2 related: Cross-check on performance evaluation on depth Merge mode candidate (JCT3V-G0098)

Y.-L. Chang (MediaTek)




JCT3V-G0228

m32528

2014-01-09 18:35:15

2014-01-09 18:40:56

2014-01-09 18:40:56

3D-CE3 related: Cross-check of Simplification of DV Derivation and Default DV Improvement (JCT3V-G0073)

Y.-L. Chang (MediaTek)




JCT3V-G0229

m32531

2014-01-09 18:51:24

2014-01-14 15:59:51

2014-01-14 15:59:51

CE5 related: Crosscheck on Advanced boundary chain (ABC) coding for depth intra coding (JCT3V-G0094)

S. Shimizu, S. Sugimoto (NTT)




JCT3V-G0230

m32534

2014-01-09 20:32:17

2014-01-11 20:11:13

2014-01-11 20:11:13

CE3 related: Crosscheck on ZJU's proposal

X. Zheng, Xu Chen (HiSilicon)




JCT3V-G0231

m32554

2014-01-11 03:43:43

2014-01-12 18:11:59

2014-01-12 18:11:59

3D-CE4.h: Cross-check on simplification of inter-view ARP (JCT3V-G0158)

Y.-L. Chang, K. Zhang (MediaTek)




JCT3V-G0232

m32567

2014-01-11 16:26:01

2014-01-11 16:29:16

2014-01-11 16:29:16

Cross-check of Ericsson’s proposal JCT3V-G0174 on MV-HEVC+D encoder parameters

P. Aflaki, M. M. Hannuksela




JCT3V-G0233

m32574

2014-01-11 17:43:28

2014-01-12 07:40:30

2014-01-15 08:01:58

Joint BoG report on High Level Syntax

J. Boyce




JCT3V-G0234

m32579

2014-01-11 18:29:11

2014-01-11 18:40:32

2014-01-11 20:23:10

CE2-related: Crosscheck on Simplification on interview motion prediction for depth coding (JCT3V-G0047)

S. Shimizu, S. Sugimoto (NTT)




JCT3V-G0235

m32591

2014-01-12 02:59:46

2014-01-13 05:32:58

2014-01-13 05:32:58

CE2 related : Cross-check on Disparity derivation for depth coding(JCT3V-G0126)

T. Kim

Withdrawn?

JCT3V-G0236

m32594

2014-01-12 11:48:48

2014-01-12 12:02:12

2014-01-12 12:02:12

MV-HEVC/SHVC HLS: On default target output layer set

Y.-K. Wang (Qualcomm)




JCT3V-G0237

m32605

2014-01-12 20:11:19

2014-01-13 01:39:43

2014-01-13 18:25:16

MV-HEVC/SHVC HLS: Cross-layer POC anchor picture derivation (follow-up of JCTVC-P0056/JCT3V-G0042)

M. M. Hannuksela (Nokia), Y.-K. Wang (Qualcomm)




JCT3V-G0238

m32614

2014-01-13 01:24:35

2014-01-13 20:35:36

2014-01-15 05:59:51

MV-HEVC/SHVC HLS: On alt_output_layer_flag

M. M. Hannuksela (Nokia)




JCT3V-G0239

m32623

2014-01-13 21:01:57

2014-01-13 21:19:25

2014-01-14 18:21:05

JCT3V BoG Report on ATM Software Improvements

D. Tian (MERL)




JCT3V-G0240

m32631

2014-01-14 03:54:29

2014-01-14 18:33:39

2014-01-14 18:33:39

MV-HEVC/SHVC HLS: VPS extension with ue(v) coded syntax elements

A. K. Ramasubramonian (Qualcomm)




JCT3V-G0241

m32632

2014-01-14 15:34:01

2014-01-14 15:36:12

2014-01-14 15:36:12

BoG report on Entropy Coding

J.-L. Lin, P. Merkle




JCT3V-G0242

m32634

2014-01-14 17:50:51

2014-01-14 18:51:02

2014-01-14 18:51:02

MV-HEVC/SHVC HLS: An extension for separation of non-VUI and VUI data in the VPS

Y.-K. Wang (Qualcomm)




JCT3V-G0243

m32635

2014-01-14 18:42:30

2014-01-14 18:44:28

2014-01-14 18:44:28

Viewing Report for Comparison of 3D-HEVC and MV-HEVC with depth coding

Vittorio Baroncini, Gerhard Tech, Karsten Müller




JCT3V-G0244

m32649

2014-01-16 21:59:27

2014-01-17 00:18:32

2014-01-17 00:18:32

BoG report on viewing of deblocking process in CE1 contributions

Y.-L. Chang (MediaTek)




JCT3V-G1000

m32663

2014-01-19 18:38:47







Meeting Report of 7th JCT-3V Meeting

J.-R. Ohm, G. J. Sullivan




JCT3V-G1001

m32662

2014-01-18 20:55:22

2014-02-18 10:14:02

2014-03-10 11:50:02

3D-HEVC Draft Text 3

G. Tech, K. Wegner, Y. Chen, S.Yea




JCT3V-G1003

m32664

2014-01-19 18:40:27







3D-AVC Test Model 9

D. Rusanovskyy, F. C. Chen, L. Zhang, T. Suzuki




JCT3V-G1004

m32661

2014-01-18 20:53:57

2014-01-18 22:31:45

2014-02-28 11:56:12

MV-HEVC Draft Text 7

G. Tech, K. Wegner, Y. Chen, M. Hannuksela, J. Boyce




JCT3V-G1005

m32665

2014-01-19 18:42:51

2014-02-14 21:05:52

2014-02-14 21:05:52

Test Model 7 of 3D-HEVC and MV-HEVC

L. Zhang, G. Tech, K. Wegner, S. Yea




JCT3V-G1006

m32666

2014-01-19 18:45:15

2014-02-18 09:54:17

2014-02-18 09:54:17

Draft 6 of MVC plus Depth Conformance

T. Suzuki, D. Rusanovskyy




JCT3V-G1009

m32667

2014-01-19 18:47:09

2014-02-18 09:52:51

2014-02-18 09:52:51

Draft 4 of 3D-AVC Conformance

D. Rusanovskyy, T. Suzuki, D. Tian, Y. W. Chen




JCT3V-G1011

m32668

2014-01-19 18:48:31







Report of 3D-AVC Subjective Quality Assessment

V. Baroncini, T. Ebrahimi, A. Vetro




JCT3V-G1014

m32669

2014-01-19 18:49:30







Draft 2 of 3D-AVC Reference Software

D. Rusanovskyy, D. Tian




JCT3V-G1100

m32652

2014-01-17 01:55:33

2014-01-17 01:56:19

2014-01-17 01:56:19

Common Test Conditions of 3DV Core Experiments

Karsten Müller, Anthony Vetro




JCT3V-G1101

m32656

2014-01-17 18:23:13

2014-01-17 18:26:11

2014-01-27 10:45:01

Description of Core Experiment 1 (CE1) on Merge List Construction

J.-L. Lin, J. Heo




JCT3V-G1102

m32651

2014-01-17 00:16:55

2014-01-17 00:31:13

2014-01-18 19:30:01

Description of Core Experiment 2 (CE2) on Residual Prediction

L. Zhang, T. Ikai




JCT3V-G1103

m32657

2014-01-17 18:25:42

2014-01-17 18:26:29

2014-01-17 18:26:29

Description of Core Experiment 3 (CE3) on Entropy Coding Simplifications

Y.-L. Chang, H. Liu



Annex B to JCT-3V report:
List of meeting participants


The participants of the fourth meeting of the JCT-3V, according to a sign-in sheet passed around during the meeting (approximately 107 71 in total), were as follows:




  1. José Alvarez (Ovics)

  2. Jun Arai (NHK)

  3. Giovanni Ballocca (Sisvel Tehnology)

  4. Gun Bang (ETRI)

  5. Lazar Bivolarski (LZ Associates)

  6. Jill Boyce (Vidyo)

  7. Benjamin Bross (Fraunhofer HHI)

  8. Eric (Chi W.) Chai (Real Commun.)

  9. Yu-Lin Chang (MediaTek Inc.)

  10. Xu Chen (Huawei Technologies)

  11. Haechul Choi (Hanbat Nat. Univ.)

  12. Takeshi Chujoh (Toshiba)

  13. Zhouye Gu (Santa Clara University)

  14. Jong-Ki Han (Sejong Univ.)

  15. Shinobu Hattori (Sony)

  16. Youngsu Heo (Kyunghee Univ.)

  17. Yu-Wen Huang (MediaTek USA)

  18. Tomohiro Ikai (Sharp Corporation)

  19. Fabian Jäger (RWTH Aachen Univ.)

  20. Joël Jung (Orange Labs)

  21. Kei Kawamura (KDDI)

  22. Hosung Kim (Samsung Electronics)

  23. Miok Kim (Santa Clara University)

  24. Thomas Kunlin (STMicroelectronics)

  25. Philippe Laffont (STMicroelectronics)

  26. Bae-Keun Lee (KT)

  27. Gwo Giun (Chris) Lee (NCKU/ITRI)

  28. Jin Young Lee (Samsung)

  29. Shawmin Lei (MediaTek USA Inc.)

  30. Ming Li (ZTE)

  31. Ching-Chieh Lin (ITRI International)

  32. Jian-Liang Lin (MediaTek Inc.)

  33. Yongbing Lin (Huawei Technologies)

  34. Hongbin Liu (Qualcomm wireless China)

  35. Peng Lu (Zhejiang University)

  36. Taoran Lu (Dolby Labs)

  37. Vinod Kumar Malamal Vadakital (Nokia)

  38. Philipp Merkle (Fraunhofer HHI)

  39. Karsten Müller (Fraunhofer HHI)

  40. Takayuki Nakachi (NTT)

  41. Ohji Nakagami (Sony)

  42. Junghak Nam (LG Electronics)

  43. Tung Nguyen (Fraunhofer HHI)

  44. Takahiro Nishi (Panasonic)




  1. Jens-Rainer Ohm (RWTH Aachen Univ.)

  2. Min-Woo Park (Samsung Electronics)

  3. Mickaël Raulet (IETR/INSA Rennes)

  4. Dmytro Rusanovskyy (LG Electronics US)

  5. Takanori Senoh (NICT)

  6. Shinya Shimizu (NTT)

  7. Shiori Sugimoto (NTT)

  8. Gary Sullivan (Microsoft)

  9. Teruhiko Suzuki (Sony)

  10. Gerhard Tech (Fraunhofer HHI)

  11. Dong Tian (MERL)

  12. Yi-Shin Tung (ITRI USA / MStar Semiconductor)

  13. Kemal Ugur (Nokia)

  14. Sebastiaan van Leuven (Ghent Univ. – iMinds)

  15. Glenn van Wallendael (Ghent Univ. – iMinds)

  16. Anthony Vetro (MERL)

  17. Hitoshi Watanabe (Harmonic)

  18. Mathias Wien (RWTH Aachen Univ.)

  19. Menno Wildeboer (Philips)

  20. Ping Wu (ZTE UK Ltd)

  21. Sehoon Yea (LG Electronics)

  22. Peng Yin (Dolby Labs)

  23. Sunmi Yoo (LG Electronics)

  24. Li Zhang (Qualcomm Technologies)

  25. Yichen Zhang (Zhejiang Univ.)

  26. Jianhua Zheng (Huawei Technologies)

  27. Xiaozhen Zheng (Huawei Technologies)



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