Joint Collaborative Team on d video Coding Extension Development of itu-t sg 16 wp and iso/iec jtc 1/sc 29/wg 11

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• Annex B to JCT-3V report: List of meeting participants

JCT3V-G0167

m32154	2014-01-04 14:18:58	2014-01-06 07:57:16	2014-01-09 20:49:04	3D-CE4: Crosscheck of Results on improved advanced residual prediction (JCT3V-G0064)	T. Ikai (Sharp)
JCT3V-G0168	m32155	2014-01-04 14:19:20	2014-01-06 07:57:41	2014-01-06 07:57:41	3D-AHG5: Crosscheck of On complexity reduction of bi-prediction for advanced residual prediction (JCT3V-G0057)	T. Ikai (Sharp)
JCT3V-G0169	m32156	2014-01-04 14:19:35	2014-01-06 07:58:09	2014-01-09 20:58:50	3D-CE3 related: Crosscheck of Simplification on NBDV derivation in 3D-HEVC (JCT3V-G0050)	T. Ikai (Sharp)
JCT3V-G0170	m32157	2014-01-04 14:19:48	2014-01-06 07:58:31	2014-01-06 07:58:31	3D-CE2 related: Crosscheck of Simplification of DV Derivation for Depth Coding (JCT3V-G0074)	T. Ikai (Sharp)
JCT3V-G0171	m32158	2014-01-04 14:20:14	2014-01-06 07:59:01	2014-01-06 07:59:01	3D-CE3 related: Crosscheck of Adaptive Disabling Temporal Inter-View Candidates (JCT3V-G0078)	T. Ikai (Sharp)
JCT3V-G0172	m32159	2014-01-04 14:20:28	2014-01-06 07:59:24	2014-01-08 07:29:11	3D-CE3 related: Crosscheck of Simplification of 3D Merge list construction (JCT3V-G0099)	T. Ikai (Sharp)
JCT3V-G0173	m32160	2014-01-04 14:20:43	2014-01-06 08:00:20	2014-01-06 08:00:20	3D-CE5 related: Crosscheck of Conditional zero residual for segment-wise depth inter mode coding (JCT3V-G0058)	T. Ikai (Sharp)
JCT3V-G0174	m32169	2014-01-04 22:16:38	2014-01-04 22:26:13	2014-01-04 22:26:13	On MV-HEVC+D encoder parameters	A. Norkin, U. Hakeem, R. Sjöberg (Ericsson)
JCT3V-G0175	m32177	2014-01-05 11:59:08	2014-01-05 12:13:56	2014-01-05 12:13:56	CE5-related: Cross Check of Unification of delta DC coding and signaling for inter SDC and intra SDC in 3D-HEVC (JCT3V-G0130)	F. Jäger (RWTH Aachen University)
JCT3V-G0176	m32178	2014-01-05 12:01:00	2014-01-05 12:19:03	2014-01-05 12:19:03	CE3: Cross Check of AMVP candidate list construction for DCP blocks (JCT3V-G0065)	F. Jäger (RWTH Aachen University)
JCT3V-G0177	m32191	2014-01-06 03:36:46	2014-01-06 03:40:55	2014-01-06 03:40:55	CE3 related: Cross-check results on limitation of the Range of NBDV (JCT3V-G0082)	M. LI, P. WU(ZTE)
JCT3V-G0178	m32192	2014-01-06 03:44:19	2014-01-09 02:57:41	2014-01-09 02:57:41	CE5 related: Crosscheck of Delta DC coding for SDC and DMM modes (JCT3V-G0124)	J. Nam, J. Heo, S. Yea (LGE)
JCT3V-G0179	m32205	2014-01-06 07:51:43	2014-01-08 09:27:09	2014-01-08 09:27:09	Crosscheck on VSP depth access simplification (JCT3V-G0035)	Y.-W. Chen, J.-L. Lin (MediaTek)
JCT3V-G0180	m32206	2014-01-06 07:52:11	2014-01-08 09:27:34	2014-01-08 09:27:34	Crosscheck on Simplified VSP subblock decision (JCT3V-G0036)	Y.-W. Chen, J.-L. Lin (MediaTek)
JCT3V-G0181	m32208	2014-01-06 07:56:07	2014-01-08 09:28:05	2014-01-08 09:28:05	CE5: Crosscheck on simplification on SDC planar coding (JCT3V-G0113)	Y.-W. Chen, J.-L. Lin (MediaTek)
JCT3V-G0182	m32210	2014-01-06 08:00:21	2014-01-08 09:28:31	2014-01-08 09:28:31	3D-CE5 related: Crosscheck on Depth quantization in intra residual domain (JCT3V-G0103)	Y.-W. Chen, J.-L. Lin (MediaTek)
JCT3V-G0183	m32211	2014-01-06 08:01:55	2014-01-11 09:44:10	2014-01-11 09:44:10	Crosscheck of Improvement on Do-NBDV derivation (JCT3V-G0080)	T. Ikai (Sharp)
JCT3V-G0184	m32228	2014-01-06 11:59:46	2014-01-06 12:03:05	2014-01-06 12:03:05	CE5: Cross check of generic SDC for all Intra modes (JCT3V-G0122)	P. Merkle (HHI)
JCT3V-G0185	m32231	2014-01-06 12:48:58	2014-01-09 18:53:42	2014-01-09 18:53:42	3D-CE1 related: Crosscheck on VSP combining inter-view ARP (JCT3V-G0059)	S. Shimizu, S. Sugimoto (NTT)
JCT3V-G0186	m32232	2014-01-06 12:49:24	2014-01-11 18:48:37	2014-01-11 18:48:37	3D-CE3 related: Crosscheck on Simplification on DV-MCP searching process (JCT3V-G0049)	S. Shimizu, S. Sugimoto (NTT)
JCT3V-G0187	m32349	2014-01-07 02:39:23	2014-01-07 03:10:57	2014-01-07 03:10:57	3D-CE4.h related: Crosscheck on an alternative disparity vector derivation method for ARP (JCT3V-G0095)	G. G. Lee, B.-S. Li, C.-F. Chen, Z.-H. Yu, C.-H. Huang (NCKU)
JCT3V-G0188	m32352	2014-01-07 04:30:23	2014-01-09 18:36:33	2014-01-09 18:36:33	CE5 related: Crosscheck on MediaTek's proposal "Removal of neighbouring sample filtering for depth intra prediction (JCT3V-G0052)"	X. Zheng (HiSilicon)
JCT3V-G0189	m32353	2014-01-07 04:31:46	2014-01-09 18:37:02	2014-01-09 18:37:02	CE5 related: Crosscheck on MediaTek's proposal "Simplified Intra Prediction for Depth Coding in 3D-HEVC (JCT3V-G0054)"	X. Zheng (HiSilicon)
JCT3V-G0190	m32354	2014-01-07 04:33:06	2014-01-10 03:46:28	2014-01-10 03:46:28	CE5: Crosscheck on MediaTek's proposal "Results on bin reduction for inter SDC residual coding (JCT3V-G0056)"	X. Zheng (HiSilicon)
JCT3V-G0191	m32355	2014-01-07 04:34:06	2014-01-11 20:56:49	2014-01-11 20:56:49	AHG8: Crosscheck on MediaTek's proposal "Simplification on CABAC contexts for IC and ARP Flags (JCT3V-G0061)"	X. Zheng (HiSilicon)
JCT3V-G0192	m32356	2014-01-07 04:35:42	2014-01-10 23:49:19	2014-01-10 23:49:19	AHG8 related: Crosscheck on MediaTek's proposal "A simplified method on DMM mode coding in 3D-HEVC (JCT3V-G0062)"	X. Zheng (HiSilicon)
JCT3V-G0193	m32357	2014-01-07 04:37:13	2014-01-11 19:21:24	2014-01-11 19:21:24	CE5 related: Crosscheck on Qualcomm and PKU's proposal "Simplification of 64x64 Intra SDC mode in 3D-HEVC (JCT3V-G0123)"	X. Zheng (HiSilicon)
JCT3V-G0194	m32358	2014-01-07 05:34:50	2014-01-09 19:03:29	2014-01-09 19:03:29	CE3 related: Crosscheck on Qualcomm and PKU's proposal "Motion storage optimization in 3D-HEVC (JCT3V-G0128)"	X. Zheng (HiSilicon)
JCT3V-G0195	m32364	2014-01-07 08:11:18	2014-01-07 08:15:53	2014-01-07 08:15:53	3D-CE2: Cross check of additional merging candidates for depth coding (JCT3V-G0063)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0196	m32365	2014-01-07 08:11:33	2014-01-07 08:17:38	2014-01-07 08:17:38	3D-CE2 related: Cross check of simplification on interview motion prediction for depth coding (JCT3V-G0047)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0197	m32366	2014-01-07 08:11:45	2014-01-07 08:19:07	2014-01-07 08:19:07	3D-CE2 related: Cross check of simplification of merge candidate list in depth coding (JCT3V-G0127)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0198	m32367	2014-01-07 08:11:53	2014-01-07 08:20:32	2014-01-07 08:20:32	3D-CE3 related: Cross check of worst case complexity reduction for merge candidate construction (JCT3V-G0034)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0199	m32368	2014-01-07 08:12:01	2014-01-07 08:22:16	2014-01-07 08:22:16	3D-CE5: Cross check of simplification of DMM pattern generation and signaling (JCT3V-G0112)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0200	m32369	2014-01-07 08:12:09	2014-01-07 08:24:10	2014-01-07 08:24:10	3D-CE5 related: Cross check of removal of boundary filters for depth intra prediction (JCT3V-G0051)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0201	m32370	2014-01-07 08:12:19	2014-01-07 08:25:51	2014-01-07 08:25:51	3D-AHG8: Cross check of simplification on CABAC contexts for the syntax related to inter SDC, intra SDC and DMM (JCT3V-G0060)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0202	m32371	2014-01-07 08:12:27	2014-01-07 08:27:40	2014-01-07 08:27:40	Cross check of removal of quad-tree limitation for depth maps (JCT3V-G0071)	J. Y. Lee, C. Kim (Samsung)
JCT3V-G0203	m32376	2014-01-07 08:54:10	2014-01-09 02:45:14	2014-01-09 02:45:14	3D-CE1: Crosschecking for qualcomm's simplification for sub-PU level inter-view motion prediction	J. An, K. Zhang (MediaTek)
JCT3V-G0204	m32377	2014-01-07 08:54:51	2014-01-07 09:42:21	2014-01-07 09:42:21	CE4: Crosscheck for Qualcomm's JCT3V-G0121	K. Zhang, J. An, X. Zhang (MediaTek)
JCT3V-G0205	m32378	2014-01-07 08:55:51	2014-01-09 08:04:25	2014-01-09 08:04:25	CE5 Related:Crosschecking for hisilicon's Implicit split process for intra SDC JCT3V-G0111	X. Zhang, K. Zhang, J. An (MediaTek)
JCT3V-G0206	m32379	2014-01-07 08:56:29	2014-01-09 08:05:32	2014-01-09 08:05:32	CE5 related: Crosschecking for hisilicon's neighbouring reference pixel selection for depth intra coding, JCT3V-G0143	X. Zhang, K. Zhang, J. An (MediaTek)
JCT3V-G0207	m32380	2014-01-07 08:57:06	2014-01-07 09:42:55	2014-01-07 09:42:55	Crosscheck for HiSilicon's JCT3V-G0079	K. Zhang, J. An, X. Zhang (MediaTek)
JCT3V-G0208	m32383	2014-01-07 09:14:24	2014-01-07 09:33:26	2014-01-13 22:15:48	AHG10: Complexity assessment of motion compensation process	T. Ikai (Sharp)
JCT3V-G0209	m32389	2014-01-07 10:37:27	2014-01-09 19:08:51	2014-01-09 19:08:51	CE5: Crosscheck for Qualcomm's JCT3V-G0122 (3)	X. Chen (HiSilicon)
JCT3V-G0210	m32393	2014-01-07 11:17:26	2014-01-09 19:16:00	2014-01-09 19:16:00	3D-CE2 related: Cross-check of JCT3V-G0055: a texture-partition-dependent depth partition for 3D-HEVC	J. Jung (Orange Labs)
JCT3V-G0211	m32398	2014-01-07 16:27:22	2014-01-11 03:27:05	2014-01-11 03:27:05	Crosschecking for hisilicon's VSD bugfix and improvement, JCT3V-G0163	X. Zhang, K. Zhang, J. An (MediaTek)
JCT3V-G0212	m32403	2014-01-07 17:31:03	2014-01-07 17:34:50	2014-01-07 17:34:50	Cross check of: CE2: Sub-PU based MPI (JCT3V-G0119)	G. Tech(HHI)
JCT3V-G0213	m32430	2014-01-08 02:33:36	2014-01-08 06:09:04	2014-01-08 06:09:04	CE5 related: Crosscheck on DMM1 signaling based on intra direction (JCT3V-G0108)	H. Liu (Qualcomm)
JCT3V-G0214	m32431	2014-01-08 02:35:38	2014-01-08 06:11:07	2014-01-08 06:11:07	CE1 related: Crosscheck on Modifications to motion hole filling in sub-PU level inter-view motion prediction (JCT3V-G0084)	H. Liu (Qualcomm)
JCT3V-G0215	m32432	2014-01-08 02:36:47	2014-01-08 06:13:06	2014-01-08 06:13:06	Crosscheck on Improvement on NBDV derivation (JCT3V-G0081)	H. Liu (Qualcomm)
JCT3V-G0216	m32433	2014-01-08 02:37:37	2014-01-08 06:14:50	2014-01-08 06:14:50	CE5: Crosscheck on Segment-wise depth inter mode coding (JCT3V-G0101)	H. Liu (Qualcomm)
JCT3V-G0217	m32434	2014-01-08 02:38:34	2014-01-08 06:17:16	2014-01-08 06:17:16	CE5 related: Crosscheck on Segment-wise depth intra mode coding (JCT3V-G0102)	H. Liu (Qualcomm)
JCT3V-G0218	m32435	2014-01-08 02:39:29	2014-01-08 06:18:53	2014-01-08 06:18:53	CE1: Crosscheck on Motion parameters stored for VSP-coded blocks (JCT3V-G0148)	H. Liu (Qualcomm)
JCT3V-G0219	m32436	2014-01-08 02:42:13	2014-01-08 06:20:04	2014-01-08 06:20:04	CE1 related: Crosscheck on Simplification of sub-PU level temporal interview motion prediction (JCT3V-G0147)	H. Liu (Qualcomm)
JCT3V-G0220	m32437	2014-01-08 03:05:50	2014-01-08 03:08:17	2014-01-08 03:08:17	3D-CE4: Cross check of Further improvements on advanced residual prediction (JCT3V-G0121)	M. W. Park, C. Kim (Samsung)
JCT3V-G0221	m32442	2014-01-08 04:26:10	2014-01-08 04:31:38	2014-01-08 04:31:38	3D-CE3: Cross-check on additional depth-based DV candidate (JCT3V-G0100)	J.-L. Lin, Y.-W. Chen (MediaTek)
JCT3V-G0222	m32444	2014-01-08 05:54:11	2014-01-09 07:52:35	2014-01-09 07:52:35	3D-CE4: Cross check of Improved advanced residual prediction (JCT3V-G0064)	L. Zhang(Qualcomm)
JCT3V-G0223	m32446	2014-01-08 06:28:27	2014-01-11 09:11:34	2014-01-18 19:19:47	3D-CE4: Cross check of Simplification of inter-view ARP (JCT3V-G0158)	L. Zhang(Qualcomm)
JCT3V-G0224	m32479	2014-01-08 22:52:10	2014-01-18 03:40:43	2014-01-18 03:40:43	MV-HEVC/SHVC HLS: Additional information on the POC design in JCTVC-P0041/JCT3V-G0031	A. K. Ramasubramonian, Hendry, Y.-K. Wang (Qualcomm)
JCT3V-G0225	m32481	2014-01-09 00:01:44	2014-01-09 00:04:10	2014-01-09 00:04:10	Crosscheck results on clean ups of VSP merging candidates (Method 1 & 2 in JCT3V-G0104)	M. LI, P. WU(ZTE)
JCT3V-G0226	m32483	2014-01-09 00:58:53	2014-01-09 01:03:30	2014-01-09 01:03:30	CE4: Crosscheck for Qualcomm's JCT3V-G0121	J. Heo, J. Nam (LGE)
JCT3V-G0227	m32527	2014-01-09 18:34:43	2014-01-09 18:40:24	2014-01-09 18:40:24	3D-CE2 related: Cross-check on performance evaluation on depth Merge mode candidate (JCT3V-G0098)	Y.-L. Chang (MediaTek)
JCT3V-G0228	m32528	2014-01-09 18:35:15	2014-01-09 18:40:56	2014-01-09 18:40:56	3D-CE3 related: Cross-check of Simplification of DV Derivation and Default DV Improvement (JCT3V-G0073)	Y.-L. Chang (MediaTek)
JCT3V-G0229	m32531	2014-01-09 18:51:24	2014-01-14 15:59:51	2014-01-14 15:59:51	CE5 related: Crosscheck on Advanced boundary chain (ABC) coding for depth intra coding (JCT3V-G0094)	S. Shimizu, S. Sugimoto (NTT)
JCT3V-G0230	m32534	2014-01-09 20:32:17	2014-01-11 20:11:13	2014-01-11 20:11:13	CE3 related: Crosscheck on ZJU's proposal	X. Zheng, Xu Chen (HiSilicon)
JCT3V-G0231	m32554	2014-01-11 03:43:43	2014-01-12 18:11:59	2014-01-12 18:11:59	3D-CE4.h: Cross-check on simplification of inter-view ARP (JCT3V-G0158)	Y.-L. Chang, K. Zhang (MediaTek)
JCT3V-G0232	m32567	2014-01-11 16:26:01	2014-01-11 16:29:16	2014-01-11 16:29:16	Cross-check of Ericsson’s proposal JCT3V-G0174 on MV-HEVC+D encoder parameters	P. Aflaki, M. M. Hannuksela
JCT3V-G0233	m32574	2014-01-11 17:43:28	2014-01-12 07:40:30	2014-01-15 08:01:58	Joint BoG report on High Level Syntax	J. Boyce
JCT3V-G0234	m32579	2014-01-11 18:29:11	2014-01-11 18:40:32	2014-01-11 20:23:10	CE2-related: Crosscheck on Simplification on interview motion prediction for depth coding (JCT3V-G0047)	S. Shimizu, S. Sugimoto (NTT)
JCT3V-G0235	m32591	2014-01-12 02:59:46	2014-01-13 05:32:58	2014-01-13 05:32:58	CE2 related : Cross-check on Disparity derivation for depth coding(JCT3V-G0126)	T. Kim	Withdrawn?
JCT3V-G0236	m32594	2014-01-12 11:48:48	2014-01-12 12:02:12	2014-01-12 12:02:12	MV-HEVC/SHVC HLS: On default target output layer set	Y.-K. Wang (Qualcomm)
JCT3V-G0237	m32605	2014-01-12 20:11:19	2014-01-13 01:39:43	2014-01-13 18:25:16	MV-HEVC/SHVC HLS: Cross-layer POC anchor picture derivation (follow-up of JCTVC-P0056/JCT3V-G0042)	M. M. Hannuksela (Nokia), Y.-K. Wang (Qualcomm)
JCT3V-G0238	m32614	2014-01-13 01:24:35	2014-01-13 20:35:36	2014-01-15 05:59:51	MV-HEVC/SHVC HLS: On alt_output_layer_flag	M. M. Hannuksela (Nokia)
JCT3V-G0239	m32623	2014-01-13 21:01:57	2014-01-13 21:19:25	2014-01-14 18:21:05	JCT3V BoG Report on ATM Software Improvements	D. Tian (MERL)
JCT3V-G0240	m32631	2014-01-14 03:54:29	2014-01-14 18:33:39	2014-01-14 18:33:39	MV-HEVC/SHVC HLS: VPS extension with ue(v) coded syntax elements	A. K. Ramasubramonian (Qualcomm)
JCT3V-G0241	m32632	2014-01-14 15:34:01	2014-01-14 15:36:12	2014-01-14 15:36:12	BoG report on Entropy Coding	J.-L. Lin, P. Merkle
JCT3V-G0242	m32634	2014-01-14 17:50:51	2014-01-14 18:51:02	2014-01-14 18:51:02	MV-HEVC/SHVC HLS: An extension for separation of non-VUI and VUI data in the VPS	Y.-K. Wang (Qualcomm)
JCT3V-G0243	m32635	2014-01-14 18:42:30	2014-01-14 18:44:28	2014-01-14 18:44:28	Viewing Report for Comparison of 3D-HEVC and MV-HEVC with depth coding	Vittorio Baroncini, Gerhard Tech, Karsten Müller
JCT3V-G0244	m32649	2014-01-16 21:59:27	2014-01-17 00:18:32	2014-01-17 00:18:32	BoG report on viewing of deblocking process in CE1 contributions	Y.-L. Chang (MediaTek)
JCT3V-G1000	m32663	2014-01-19 18:38:47			Meeting Report of 7th JCT-3V Meeting	J.-R. Ohm, G. J. Sullivan
JCT3V-G1001	m32662	2014-01-18 20:55:22	2014-02-18 10:14:02	2014-03-10 11:50:02	3D-HEVC Draft Text 3	G. Tech, K. Wegner, Y. Chen, S.Yea
JCT3V-G1003	m32664	2014-01-19 18:40:27			3D-AVC Test Model 9	D. Rusanovskyy, F. C. Chen, L. Zhang, T. Suzuki
JCT3V-G1004	m32661	2014-01-18 20:53:57	2014-01-18 22:31:45	2014-02-28 11:56:12	MV-HEVC Draft Text 7	G. Tech, K. Wegner, Y. Chen, M. Hannuksela, J. Boyce
JCT3V-G1005	m32665	2014-01-19 18:42:51	2014-02-14 21:05:52	2014-02-14 21:05:52	Test Model 7 of 3D-HEVC and MV-HEVC	L. Zhang, G. Tech, K. Wegner, S. Yea
JCT3V-G1006	m32666	2014-01-19 18:45:15	2014-02-18 09:54:17	2014-02-18 09:54:17	Draft 6 of MVC plus Depth Conformance	T. Suzuki, D. Rusanovskyy
JCT3V-G1009	m32667	2014-01-19 18:47:09	2014-02-18 09:52:51	2014-02-18 09:52:51	Draft 4 of 3D-AVC Conformance	D. Rusanovskyy, T. Suzuki, D. Tian, Y. W. Chen
JCT3V-G1011	m32668	2014-01-19 18:48:31			Report of 3D-AVC Subjective Quality Assessment	V. Baroncini, T. Ebrahimi, A. Vetro
JCT3V-G1014	m32669	2014-01-19 18:49:30			Draft 2 of 3D-AVC Reference Software	D. Rusanovskyy, D. Tian
JCT3V-G1100	m32652	2014-01-17 01:55:33	2014-01-17 01:56:19	2014-01-17 01:56:19	Common Test Conditions of 3DV Core Experiments	Karsten Müller, Anthony Vetro
JCT3V-G1101	m32656	2014-01-17 18:23:13	2014-01-17 18:26:11	2014-01-27 10:45:01	Description of Core Experiment 1 (CE1) on Merge List Construction	J.-L. Lin, J. Heo
JCT3V-G1102	m32651	2014-01-17 00:16:55	2014-01-17 00:31:13	2014-01-18 19:30:01	Description of Core Experiment 2 (CE2) on Residual Prediction	L. Zhang, T. Ikai
JCT3V-G1103	m32657	2014-01-17 18:25:42	2014-01-17 18:26:29	2014-01-17 18:26:29	Description of Core Experiment 3 (CE3) on Entropy Coding Simplifications	Y.-L. Chang, H. Liu

Annex B to JCT-3V report:
List of meeting participants

The participants of the fourth meeting of the JCT-3V, according to a sign-in sheet passed around during the meeting (approximately 107 71 in total), were as follows:

1. 
   José Alvarez (Ovics)
   
2. 
   Jun Arai (NHK)
   
3. 
   Giovanni Ballocca (Sisvel Tehnology)
   
4. 
   Gun Bang (ETRI)
   
5. 
   Lazar Bivolarski (LZ Associates)
   
6. 
   Jill Boyce (Vidyo)
   
7. 
   Benjamin Bross (Fraunhofer HHI)
   
8. 
   Eric (Chi W.) Chai (Real Commun.)
   
9. 
   Yu-Lin Chang (MediaTek Inc.)
   
10. 
    Xu Chen (Huawei Technologies)
    
11. 
    Haechul Choi (Hanbat Nat. Univ.)
    
12. 
    Takeshi Chujoh (Toshiba)
    
13. 
    Zhouye Gu (Santa Clara University)
    
14. 
    Jong-Ki Han (Sejong Univ.)
    
15. 
    Shinobu Hattori (Sony)
    
16. 
    Youngsu Heo (Kyunghee Univ.)
    
17. 
    Yu-Wen Huang (MediaTek USA)
    
18. 
    Tomohiro Ikai (Sharp Corporation)
    
19. 
    Fabian Jäger (RWTH Aachen Univ.)
    
20. 
    Joël Jung (Orange Labs)
    
21. 
    Kei Kawamura (KDDI)
    
22. 
    Hosung Kim (Samsung Electronics)
    
23. 
    Miok Kim (Santa Clara University)
    
24. 
    Thomas Kunlin (STMicroelectronics)
    
25. 
    Philippe Laffont (STMicroelectronics)
    
26. 
    Bae-Keun Lee (KT)
    
27. 
    Gwo Giun (Chris) Lee (NCKU/ITRI)
    
28. 
    Jin Young Lee (Samsung)
    
29. 
    Shawmin Lei (MediaTek USA Inc.)
    
30. 
    Ming Li (ZTE)
    
31. 
    Ching-Chieh Lin (ITRI International)
    
32. 
    Jian-Liang Lin (MediaTek Inc.)
    
33. 
    Yongbing Lin (Huawei Technologies)
    
34. 
    Hongbin Liu (Qualcomm wireless China)
    
35. 
    Peng Lu (Zhejiang University)
    
36. 
    Taoran Lu (Dolby Labs)
    
37. 
    Vinod Kumar Malamal Vadakital (Nokia)
    
38. 
    Philipp Merkle (Fraunhofer HHI)
    
39. 
    Karsten Müller (Fraunhofer HHI)
    
40. 
    Takayuki Nakachi (NTT)
    
41. 
    Ohji Nakagami (Sony)
    
42. 
    Junghak Nam (LG Electronics)
    
43. 
    Tung Nguyen (Fraunhofer HHI)
    
44. 
    Takahiro Nishi (Panasonic)
    

45. 
    Jens-Rainer Ohm (RWTH Aachen Univ.)
    
46. 
    Min-Woo Park (Samsung Electronics)
    
47. 
    Mickaël Raulet (IETR/INSA Rennes)
    
48. 
    Dmytro Rusanovskyy (LG Electronics US)
    
49. 
    Takanori Senoh (NICT)
    
50. 
    Shinya Shimizu (NTT)
    
51. 
    Shiori Sugimoto (NTT)
    
52. 
    Gary Sullivan (Microsoft)
    
53. 
    Teruhiko Suzuki (Sony)
    
54. 
    Gerhard Tech (Fraunhofer HHI)
    
55. 
    Dong Tian (MERL)
    
56. 
    Yi-Shin Tung (ITRI USA / MStar Semiconductor)
    
57. 
    Kemal Ugur (Nokia)
    
58. 
    Sebastiaan van Leuven (Ghent Univ. – iMinds)
    
59. 
    Glenn van Wallendael (Ghent Univ. – iMinds)
    
60. 
    Anthony Vetro (MERL)
    
61. 
    Hitoshi Watanabe (Harmonic)
    
62. 
    Mathias Wien (RWTH Aachen Univ.)
    
63. 
    Menno Wildeboer (Philips)
    
64. 
    Ping Wu (ZTE UK Ltd)
    
65. 
    Sehoon Yea (LG Electronics)
    
66. 
    Peng Yin (Dolby Labs)
    
67. 
    Sunmi Yoo (LG Electronics)
    
68. 
    Li Zhang (Qualcomm Technologies)
    
69. 
    Yichen Zhang (Zhejiang Univ.)
    
70. 
    Jianhua Zheng (Huawei Technologies)
    
71. 
    Xiaozhen Zheng (Huawei Technologies)
    

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