Joint Collaborative Team on Video Coding (jct-vc) Contribution


Output documents (to be updated)



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10Output documents (to be updated)


Planning of HM encoder description – plan to improve this in AHG work toward publishing as part of the RS standard. TBD whether this would be in v.1 of the RS standard or added later.

Issues in conformance: The situation has been improving. profile_idc and level_idc need to be correct, some HM 9 bitstreams not updated, some planned bitstreams missing, many bitstreams need updates for corrections of these issues and others. Coverage still needs improvement. Various combinations of tiles & slices & loop filtering control parameters, SEI messages, "corner cases".

The following documents were agreed to be produced or endorsed as outputs of the meeting. Names recorded below indicate those responsible for document production.

JCTVC-ML1000 Meeting Report of 132th JCT-VC Meeting [G. J. Sullivan, J.-R. Ohm]

JCTVC-H1001 HEVC software guidelines [K. Suehring, D. Flynn, F. Bossen, (software coordinators)]

(Remains valid, although from a prior meeting.)



Disposition of comments report

JCTVC-M1002 High Efficiency Video Coding (HEVC) Test Model 11 (HM 11) Encoder Description [K. McCann (primary), B. Bross, W.-J. Han, I. K. Kim, K. Sugimoto, G. J. Sullivan] (WG 11 N 13574) [2013-07-15]

Remove JCTVC-L1003 High Efficiency Video Coding (HEVC) text specification draft 10 (for FDIS & Consent) [B. Bross (primary), W.-J. Han, J.-R. Ohm, G. J. Sullivan, Y. K. Wang, T. Wiegand] (WG 11 N 13333) [2013-03-01]

JCTVC-M1004 HEVC Conformance Draft 3 [T. Suzuki, W. Wan, G. J. Sullivan] (WG 11 N 13xxx ISO/IEC CD) [2013-05-10]

JCTVC-M1005 HEVC Range Extensions Draft 3 [D. Flynn, J. Sole, T. Suzuki] (WG 11 N 13569, Study of ISO/IEC PDAM) [2013-065-15]

Remains valid – not reissued JCTVC-L1006 Common test conditions and software reference configurations for HEVC range extensions [D. Flynn, K. Sharman] [2013-02-08]

JCTVC-M1007 SHVC Test Model 21 (SHM 21) [J. Chen, J. Boyce, Y. Ye, M. M. Hannuksela] (WG 11 N 135701) [2013-06-15]

Will contain encoder descript and will retain TextureRL.



JCTVC-M1008 SHVC Working Draft 2 [J. Chen, J. Boyce, Y. Ye, M. M. Hannuksela] (WG 11 N 13570) [2013-06-15]qq

Will contain RefIdx and upsampling.


JCTVC-ML1009 Common SHM test conditions and software reference configurations [X. Li, J. Boyce, P. Onno, Y. Ye] [2013-042-2608]

JCTVC-M1010 HEVC HM 11 Reference Software [F. Bossen, D. Flynn, K. Suehring] (WG 11 N 13575 Study of reference software) [2013-053-1022]

Remains valid – not re-issued: JCTVC-L1100 Common HM test conditions and software reference configurations [F. Bossen]

(Remains valid, although from a prior meetingAlignment of the test configurations with the profile names is planned.)


Note that regardless of preliminary CE plans established earlier in the meeting were not considered binding on final CE plans as reviewed in closing plenary.

JCTVC-M1101 HEVC Scalable Extensions Core Experiment SCE1: Support for additional resampling phase shifts [E. Alshina, J. Dong, L. Guo … (CTE Coordinators)]

To test M0425, M0465, M0263. All filters are 8/4 taps for luma/chroma. (Only 1.5 and 2 × cases to be tested.)

JCTVC-M1102 HEVC Scalable Extensions Core Experiment SCE2: Combination of inter-layer syntax prediction and motion data compression [K. Sato, TC. Suzuki Gisquet (CTE Coordinators)]

To test M0112 (BL position rounding), M0141 (BL motion data compresion), and probably M0258. Not testing things that affect the decoding process of the EL below the header level.

JCTVC-M1103 HEVC Scalable Extensions Core Experiment SCE3: Combined inter- and interlayer prediction [X. Li, E. Francois, P. Lai, D. Kwon, A. Saxena, X. Xiu (CTE coordinators)]

It was suggested to test M0155 and M0189. Although roughly consistent with "refIdx plus inter-layer resampling plus ordinary syntax and decoding process" concept, these were relatively high complexity proposed modification. The estimated potential gain for 1.5 and 2.0 LDB cases was 2%.

No CE established.

JCTVC-M11034 HEVC Scalable Extensions Core Experiment SCE34: Inter-layer filtering [J. Chen, A. Segall, E. Alshina, S. Liu, J. Dong, J. Park (CTE coordinators)]

To test M0273 (integer sample position filtering), M0267 (adaptive upsampling filter), M0183/M0089/M0253 (chroma enhancement using luma), M0114 (inter-layer SAO), M0215 (frame-level bilateral filter), M0055 (inter-layer de-ringing), M0224 (inter-layer directional filtering).

Plan to test ordinary scalable CTC plus LDP and SNR scalability.

JCTVC-M1101 through JCTVC-M1104 were pre-reviewed only in BoG activityin non-final form in closing plenary. A two three week finalization period was authorized.



JCTVC-M1121 HEVC Range Extensions Core Experiment 1 (RCE1): Inter-component decorrelation methods [T. Nguyen (primary), J. Sole, J. Kim (CTE coordinators)]

To test M0097 (LM chroma), M0412 (reduced-complexity LM chroma), and M0230 (adaptive in-loop inter-component prediction), including testing some variants and YUV & RGB & screen content as appropriate.



JCTVC-M1122 HEVC Range Extensions Core Experiment 2 (RCE2): Prediction and coding techniques for transform- skip blocks [R. Joshi (primary), P. Amon, R. Cohen, M. Zhou, P. Amon, S. Lee, M. Naccari (CTE coordinators)]

M0304 (Rice parameter modification), M0316 (Rice parameter modification), M0366 (Rice parameter modification)

M0333 (prediction residue rotation)

J0313/J0212/J0202 (horizontal/vertical scan order swap)

K0294 (coefficient order mirroring)

M0288 (extending DPCM mode to additional angular directions)

M0442 (inter DPCM).

M0351 (DPCM with quantization).

M0052 & M0193 modified DC and/or planar modes – possibly modified for some complexity reduction (to test mode changes separately and with combinations).

M0291 DC prediction mode change

Some YUV and some RGB. Some 10 bit and some 8 bits. Some 4:4:4 and some 4:2:2 and some 4:2:0.

Results for YUV and RGB to be reported separately (not averaged together).



JCTVC-M1123 HEVC Range Extensions Core Experiment 3 (RCE3) Intra coding method for screen content [L. Guo (CTE coordinator)]

M0323 (palette mode), M0330 (multi-stage base colour and index map), M0350 (intra "motion compensation").

Both lossless and lossy, RGB and YUV, some non-screen content at 8 and 10 bits.
JCTVC-M1121 through JCTVC-M1123 were reviewed in non-final form in closing plenarypre-reviewed only in BoG activity?. A two three week finalization period was authorized.

11Future meeting plans, expressions of thanks, and closing of the meeting


Future meeting plans were established according to the following guidelines:

  • Meeting under ITU-T SG 16 auspices when it meets (starting meetings on the Monday or Tuesday of the first week and closing it on the Tuesday or Wednesday of the second week of the SG 16 meeting), and

  • Otherwise meeting under ISO/IEC JTC 1/SC 29/WG 11 auspices when it meets (starting meetings on the Wednesday or Thursday prior to such meetings and closing it on the last day of the WG 11 meeting).

Some specific future meeting plans were established as follows:

  • 25 July – 2 Aug. 2013 under WG 11 auspices in Vienna, AT.

  • 23 Oct. – 1 Nov. 2013 under ITU-T auspices in Geneva, CH.

  • 9–17 Jan. 2014 under WG 11 auspices in San Jose, US.

  • 27 Mar. – 4 Apr. 2014 under WG 11 auspices in Valencia, ES.

  • 30 June – 9 July 2014 under ITU-T auspices in Sapporo, JP.

The agreed document deadline for the July 2013 meeting is Monday 15 July. Moreover, it was agreed to start the meeting with SHVC HLS starting on the first day, SHVC CE work and related contributions starting on the second day, and RExt and other topics starting on the third day.
XXX was thanked for the excellent hosting of the 13th meeting of the JCT-VC. LG Electronics was thanked for providing viewing equipment used at the meeting.

The JCT-VC meeting was closed at approximately XXXX 1345 hours on Fri. 26 Apr. 2013.




Annex A to JCT-VC report:
List of documents




Annex B to JCT-VC report:
List of meeting participants


The participants of the thirteenth meeting of the JCT-VC, according to a sign-in sheet circuated during the meeting (approximately XXX 183 in total), were as follows:


  1. Alexander Alshin (Samsung Electronics)

  2. Elena Alshina (Samsung Electronics)

  3. Peter Amon (Siemens AG)

  4. Kenneth Andersson (LM Ericsson)

  5. Kohtaro Asai (Mitsubishi Electric)

  6. Cheung Auyeung (Sony)

  7. Seung-yong Baek (Galaxia Commun.)

  8. Gun Bang (ETRI)

  9. Osnat Bar-Nir (Harmonic)

  10. Lazar Bivolarsky (Skype)

  11. Philippe Bordes (Technicolor)

  12. Frank Bossen (Docomo Innovations)

  13. Jill Boyce (Vidyo)

  14. Benjamin Bross (Fraunhofer HHI)

  15. Madhukar Budagavi (Texas Instruments)

  16. Done Bugdayci (Nokia)

  17. Soo-Ik Chae (Seoul Natl. Univ.)

  18. Chun-Chi Chen (NCTU/ITRI)

  19. Jianle Chen (Qualcomm)

  20. Peisong Chen (Broadcom)

  21. Yongjin Cho (Samsung Electronics Co., Ltd)

  22. Byeongdoo Choi (Samsung Electronics)

  23. Haechul Choi (Hanbat Univ.)

  24. Jangwon Choi (Yonsei University)

  25. Kiho Choi (Hanyang Univ.)

  26. Keiichi Chono (NEC)

  27. Tzu-Der Chuang (MediaTek USA)

  28. Takeshi Chujoh (Toshiba)

  29. Robert Cohen (Mitsubishi Electric Res. Labs)

  30. David Daniels (BSkyB)

  31. Jan De Cock (Ghent Univ. - IBBT)

  32. Zhipin Deng (Intel)

  33. Sachin Deshpande (Sharp)

  34. Marek Domanski (Poznań Univ. Tech.)

  35. Alberto Duenas (NGcodec)

  36. MyungJin Eom (Samsung Electronics)

  37. Christian Feldmann (RWTH Aachen University)

  38. Felix Fernandes (Samsung Telecom. America)

  39. David Flynn (Research In Motion)

  40. Edouard François (Canon CRF)

  41. Alex Giladi (Huawei)

  42. Christophe Gisquet (Canon Research)

  43. Liwei Guo (Qualcomm Technologies)

  44. Dae-hyeok Gwon (Hanbat Univ.)

  45. Woo-Jin Han (Gachon University)

  46. Miska Hannuksela (Nokia)

  47. Yong He (InterDigital Commun.)

  48. Hendry (LG Electronics)

  49. Youngsu Heo (Kyunghee Univ.)

  50. Soongi Hong (Yonsei Univ.)

  51. Sung-Wook Hong (Sejong Univ.)

  52. Yu-Wen Huang (MediaTek USA Inc.)

  53. Walt Husak (Dolby Labs)

  54. Atsuro Ichigaya (Japan Broadcasting Corporation (NHK))

  55. Fabian Jaeger (RWTH Aachen Univ.)

  56. Euee Jang (Hanyang Univ.)

  57. Wonkap Jang (Vidyo)

  58. Byeungwoo Jeon (Sungkyunkwan Univ. (SKKU))

  59. Rajan Joshi (Qualcomm)

  60. Jang-byung Kang (Hanbat Univ.)

  61. Jung Won Kang (ETRI)

  62. Mukta L. Kar (Cable Television Labs)

  63. Marta Karczewicz (Qualcomm Technologies)

  64. Kei Kawamura (KDDI)

  65. Kimihiko Kazui (Fujitsu Labs)

  66. Chanyul Kim (Samsung Electronics)

  67. Chulkeun Kim (LG Electronics)

  68. Hui Yong Kim (ETRI)

  69. Hyunmi Kim (ETRI)

  70. Jae Hoon Kim (Apple, Inc.)

  71. Jungsun Kim (LG Electronics)

  72. Kyeonghye Kim (Kwangwoon University)

  73. Kyung Yong Kim (Kyunghee Univ.)

  74. Seong Hoon Kim (Galaxia Commun.)

  75. Seung Hwan Kim (Sharp)

  76. Taewook Kim (Kyunghee Univ.)

  77. Yong-Hwan Kim (KETI)

  78. Volodymyr Kolesnikov (Canon Information Systems Research Australia Pty Ltd/Canon Inc)

  79. Do-Kyoung Kwon (Texas Instruments)

  80. PoLin (Wang) Lai (Mediatek USA)

  81. Jani Lainema (Nokia)

  82. Thorsten Laude (Institut fuer Informationsverarbeitung, Leibniz Universitaet Hannover)

  83. Bae-Keun Lee (KT)

  84. Chulhee Lee (KCC/Yonsei Univ.)

  85. Hahyun Lee (ETRI)

  86. Hoyoung Lee (Sungkyunkwan Univ. (SKKU))

  87. Jae Yung Lee (Sejong Univ.)

  88. Jaeho Lee (Yonsei Univ.)

  89. Jinho Lee (ETRI)

  90. Minseong Lee (Kyunghee Univ.)

  91. Sangyoun Lee (Yonsei Univ.)

  92. Sunil Lee (Samsung Electronics)

  93. Sunyoung Lee (Pantech)

  94. Yoonjin Lee (Kyunghee Univ.)

  95. Yung-Lyul Lee (Sejong Univ.)

  96. Shawmin Lei (MediaTek USA)

  97. Bin Li (USTC)

  98. Ming Li (ZTE)

  99. Xiang Li (Qualcomm Technologies)

  100. Sung-Chang Lim (Electronics and Telecommunications Research Institute (ETRI))

  101. Sung-won Lim (Sejong Univ.)

  102. Yongbing Lin (Huawei)

  103. Shan Liu (MediaTek USA)

  104. Yiqun Liu (Leibniz Univ. Hannover)

  105. Patrick Lopez (Technicolor)

  106. Zhan Ma (Samsung Telecom. America)

  107. Gaëlle Martin-Cocher (Research in Motion)

  108. Ken McCann (Zetacast / Samsung)

  109. Akira Minezawa (Mitsubishi Electric)

  110. Koohyar Minoo (Motorola Mobility)

  111. Jihye Moon (Sejong Univ.)

  112. Matteo Naccari (BBC R&D)

  113. Ohji Nakagami (Sony)

  114. Hiroya Nakamura (JVC Kenwood)

  115. Sam Narasimhan (Motorola)

  116. Tung Nguyen (Fraunhofer HHI)

  117. Andrey Norkin (Ericsson AB)

  118. Jens-Rainer Ohm (RWTH Aachen Univ.)

  119. Patrice Onno (Canon Research)

  120. Joonyoung Park (LG Electronics)

  121. Wen-Hsiao Peng (NCTU/ITRI)

  122. Erhan Pinhasov (CSR)

  123. Adarsh Krishnan Ramasubramonian (Qualcomm Technologies)

  124. Krishnakanth Rapaka (Qualcomm Technologies)

  125. Mickael Raulet (INSA Rennes)

  126. Shevach Riabtsev (CSR)

  127. Justin Ridge (Nokia)

  128. Christopher Rosewarne (CiSRA / Canon Inc)

  129. Thomas Rusert (Ericsson AB)

  130. Hisao Sasai (Panasonic)

  131. Ankur Saxena (Samsung Telecom. America)

  132. Andrew Segall (Sharp)

  133. Shun-ichi Sekiguchi (Mitsubishi Electric)

  134. Vadim Seregin (Qualcomm)

  135. Seiya Shibata (NEC)

  136. Masato Shima (Canon)

  137. Shinya Shimizu (NTT)

  138. Donggyu Sim (Kwangwoon Univ.)

  139. Rickard Sjöberg (Ericsson)

  140. Joel Sole (Qualcomm Technologies)

  141. Kazuo Sugimoto (Mitsubishi Electric)

  142. Karsten Sühring (Fraunhofer HHI)

  143. Gary Sullivan (Microsoft)

  144. Huifang Sun (Mitsubishi Electric Res. Labs)

  145. Teruhiko Suzuki (Sony)

  146. Yasser Syed (Comcast)

  147. Ali Tabatabai (Sony)

  148. Seishi Takamura (NTT)

  149. Thiow Keng Tan (NTT Docomo)

  150. Yih Han Tan (Inst. Infocomm Res. (I2R))

  151. Pankaj Topiwala (FastVDO)

  152. Alexandros Tourapis (Apple)

  153. Yi-Shin Tung (ITRI USA / MStar Semiconductor)

  154. Kemal Ugur (Nokia)

  155. Sebastiaan Van Leuven (Ghent University - iMinds)

  156. Glenn Van Wallendael (Ghent University - iMinds)

  157. Thijs Vermein (Barco)

  158. Wade Wan (Broadcom)

  159. James Wang (Zoom Video Commun.)

  160. Ye-Kui Wang (Qualcomm Technologies)

  161. Jiangtao Wen (Tsinghua Univ.)

  162. Stephan Wenger (Vidyo)

  163. Mathias Wien (RWTH Aachen Univ.)

  164. Ping Wu (ZTE UK)

  165. Jizheng Xu (Microsoft)

  166. Tomoo Yamakage (Toshiba)

  167. Tomoyuki Yamamoto (Sharp)

  168. Haitao Yang (Huawei)

  169. Jungyeop Yang (Samsung)

  170. Xiaofeng Yang (Huawei)

  171. Yan Ye (InterDigital Commun.)

  172. Chuohao Yeo (Inst. Infocomm Res. (I2R))

  173. Joo Young Yi (KETI)

  174. Peng Yin (Dolby Labs)

  175. Haoping Yu (Huawei USA)

  176. Lu Yu (Zhejiang Univ.)

  177. Yue Yu (Motorola Mobility)

  178. Jinwen Zan (Huawei)

  179. Wenhao Zhang (Intel)

  180. Xiaozhen Zheng (Huawei)

  181. Jianqing Zhu (Fujitsu R&D Center)

  182. Wenjing Zhu (Hong Kong Univ. Sci. & Tech.)

  183. Xuguang Zuo (Zhejiang Univ.)




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