14.1.1.1.1.1.1.1.50JCT3V-G0056 3D-CE5: Results on bin reduction for inter SDC residual coding [Y.-W. Chen, J.-L. Lin, Y.-W. Huang, S. Lei (MediaTek)]
14.1.1.1.1.1.1.1.51JCT3V-G0190 CE5: Crosscheck on MediaTek's proposal "Results on bin reduction for inter SDC residual coding (JCT3V-G0056)" [X. Zheng (HiSilicon)] [late]
14.1.1.1.1.1.1.1.52JCT3V-G0101 3D-CE5: Segment-wise depth inter mode coding [J. Y. Lee, M. W. Park, C. Kim (Samsung)]
14.1.1.1.1.1.1.1.53JCT3V-G0216 CE5: Crosscheck on Segment-wise depth inter mode coding (JCT3V-G0101) [H. Liu (Qualcomm)] [late]
14.1.1.1.1.1.1.1.54JCT3V-G0112 CE5: Test result on simplification of DMM pattern generation and signalling [W. Li (Tsinghua Univ.), X. Zheng, J. Zheng (Hisilicon), Y. He (Tsinghua Univ.)]
14.1.1.1.1.1.1.1.55JCT3V-G0199 3D-CE5: Cross check of simplification of DMM pattern generation and signalling (JCT3V-G0112) [J. Y. Lee, C. Kim (Samsung)] [late]
14.1.1.1.1.1.1.1.56JCT3V-G0113 CE5: Test results on simplification on SDC planar coding [X. Zheng, Y. Lin, X. Chen, J. Zheng (Hisilicon)]
14.1.1.1.1.1.1.1.57JCT3V-G0181 CE5: Crosscheck on simplification on SDC planar coding (JCT3V-G0113) [Y.-W. Chen, J.-L. Lin (MediaTek)] [late]
14.1.1.1.1.1.1.1.58JCT3V-G0122 CE5: Generic SDC for all Intra modes in 3D-HEVC [H. Liu, Y. Chen (Qualcomm)]
14.1.1.1.1.1.1.1.59JCT3V-G0184 CE5: Cross check of generic SDC for all Intra modes (JCT3V-G0122) [P. Merkle (HHI)] [late]
14.1.1.1.1.1.1.1.60JCT3V-G0209 CE5: Crosscheck for Qualcomm's JCT3V-G0122 [X. Chen (HiSilicon)] [late]
