Of itu-t sg16 wp3 and iso/iec jtc1/SC29/WG11

5.2TE2: Inter-layer texture prediction

5.2.1TE2 summary and general discussion

JCTVC-L0022 TE2: Inter-layer Texture Prediction Signalling in SHVC [L. Guo, Y. He, D.-K. Kwon, J. Zan, H. Lakshman, J.-W. Kang]

Current SMuC implements both Intra_BL and ref_idx for signalling of base-layer prediction, Intra_BL is “default” of SMuC download, but the TEs define individually what method to use as basis.

Three subtests:

• 
  Intra_BL approach
  
• 
  ref_idx approach
  
• 
  skip enhancement layer slice (extension of ref_idx approach)
  

Main question: Basic signalling Intra_BL vs. ref_idx

If Intra_BL, some additional aspects were investigated:

• 
  DCT vs. DST
  
• 
  CU based vs. PU based signalling
  
• 
  Deblocking BS
  
• 
  Intra_BL skip
  
• 
  cbf_root
  

No substantial difference in compression performance from the signalling method as such (variations of 0.3%).

Criteria for judging benefit:

• 
  Advantage of using the same parser for EL
  
• 
  Ability to have only HL-syntax extension
  
• 
  Flexibility which in combination with other tools may give better compression performance
  
• 
  Latency and memory bandwidth
  
• 
  Re-using of decoder architectures
  

Decision on TE2 depends on the “whole picture”, i.e. whether finally SHVC should only consist of high-level syntax changes or also sub-CU level solutions.

Keep both methods in software model.

For future experiments, a CTC anchor other than simulcast is needed (as the gap from simulcast is too big to compare different tools against each other).

This does not mean that any new experiment has to use the method from CTC as basis

BoG activity (L. Guo) was organized to suggest from the TE2 results which should be the test model configurations of Intra_BL and ref_idx (one for each). See JCTVC-L0437.

5.2.2TE2 primary contributions

JCTVC-L0035 TE2: Results of test 3.1.8 on PU based Intra BL signalling [J. Lainema, K. Ugur (Nokia)]
JCTVC-L0051 TE2: Results of test 3.2.1 on inter-layer reference picture placement [X. Xiu, Y. He, Y. He, Y. Ye (InterDigital)]
JCTVC-L0055 TE2: Results of test 3.3.1 Enhancement layer skipped slice [Y. He, X. Xiu, Y. He, Y. Ye (InterDigital)]
JCTVC-L0060 TE2 : Results of test 3.2.2 on inter-layer reference picture placement [H. Lee, J. W. Kang, J. Lee, J. S. Choi (ETRI)]
JCTVC-L0069 TE2-3.1.7: Inter-layer intra prediction signalling with residual skip flag [T.-D. Chuang, Y.-W. Huang, S. Lei (MediaTek), C. Kim, J. Park, B. Jeon (LG)]
JCTVC-L0110 TE2 Subtest 1: Inter-layer Texture Prediction Signalling (test 3.1.9) [T. Lee, E. Alshina (Samsung)]
JCTVC-L0165 TE2: Results of test 3.1.3 on CU based IntraBL signalling [J. Zan, X. Wei, H. Yang (Huawei)]
JCTVC-L0166 TE2: Results of test 3.1.4 on CU based IntraBL signalling with skip mode [J. Zan, X. Wei, H. Yang (Huawei)]
JCTVC-L0251 Infer Zero motion vector when referencing collocated base layer picture [K. Misra, J. Zhao, A. Segall (Sharp)]
JCTVC-L0284 TE2: Results of Test 3.1.1 on Inter-layer Texture Prediction Signalling [L. Guo, V. Seregin, J. Chen, M. Karczewicz (Qualcomm)]
JCTVC-L0285 TE A2: Signalling of Inter-layer Skip and Direct [W. Zhang, L. Xu, Y. Han, Z. Deng, X. Cai, Y. Chiu (Intel)]

5.2.3TE2 cross checks

JCTVC-L0061 TE2: Cross-check results of test 3.1.1 on CU level IntraBL Mode [H. Lee, J. W. Kang, J. Lee (ETRI)]
JCTVC-L0062 TE2: Cross-check results of test 3.2.1 on inter-layer reference picture placement [H. Lee, J. W. Kang, J. Lee (ETRI)]
JCTVC-L0090 TEA2: Cross-check of refIdx performance (tests 3.2.1) [E.Alshina, A.Alshin, J.H.Park (Samsung)]
JCTVC-L0130 TE2: Cross-check of test 3.1.9 [K. Ugur (Nokia)]
JCTVC-L0201 TE2: Cross-verification of test 3.2.2 on inter-layer reference picture placement [X. Xiu, Y. He (InterDigital)]
JCTVC-L0214 Cross-check results of TE2 3.1.4 Inter-layer texture prediction mode with skip signalling from Huawei [Yong He (InterDigital)]
JCTVC-L0264 TE2: Cross-check report of test 3.2.1 on inter-layer reference picture placemen (JCTVC-L0051) [L. Guo (Qualcomm)] [late]
JCTVC-L0269 TE2: Cross check for test 3.1.5 on signalling of inter-layer skip and direct (JCTVC-L0285) [T. Yamamoto (Sharp)]
JCTVC-L0281 TE2: Cross-check results of test 3.1.8 on PU based Intra BL signalling [C. Kim, B. Jeon (LG)]
JCTVC-L0295 TE2: Cross-check results of test 3.1.1 on CU based IntraBL signalling [Zhuoyi Lyu, Jinwen Zan (Huawei)]
JCTVC-L0296 TE2: Cross-check results of test 3.3.1 on skipped slice in the enhancement layer [Dong Jiang, Jinwen Zan (Huawei)]
JCTVC-L0306 TE A2: Crosscheck for 3.2.2 on inter-layer reference picture placement (JCTVC-L0060) [W. Zhang, L. Xu, Y. Han, Z. Deng, X. Cai, Y. Chiu (Intel)]
JCTVC-L0341 TE2-3.1.9: Crosscheck of inter-layer intra prediction signalling in JCTVC-L0110 proposed by Samsung [T.-D. Chuang, Y.-W. Huang (MediaTek)] [late]
JCTVC-L0353 TE2: Crosscheck for test 3.2.3 [D.-K. Kwon (TI)] [late]
JCTVC-L0382 TE 2: Cross-check results of JCTVC-L0251 on TE2 test 3.2.3 [E. Francois (Canon)] [late]
JCTVC-L0387 TE2: Cross-check of test 3.1.7 on inter-layer intra prediction signalling with residual skip flag (JCTVC-L0069) [K. Kawamura, S. Naito (KDDI)] [late]
JCTVC-L0388 TE2: Cross-check of test 3.1.3 on CU based IntraBL signalling (JCTVC-L0165) [K. Kawamura, S. Naito (KDDI)] [late]