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Annex B to JCT-VC report: List of meeting participants



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Annex B to JCT-VC report:
List of meeting participants


The participants of the third meeting of the JCT-VC, according to a sign-in sheet circulated during the meeting (approximately 244 in total), were as follows:

  1. Alshina, Elena (Samsung)

  2. Amon, Peter (Siemens)

  3. Andersson, Kenneth (Ericsson)

  4. Aoki, Hirofumi (NEC)

  5. Asai, Kohtaro (Mitsubishi Electric)

  6. Au, Jicheng (MediaTek)

  7. Au, Oscar (Hong Kong Univ. Sci. & Tech.)

  8. Auyeung, Cheung (Sony)

  9. Bandoh, Yukihiro (NTT)

  10. Bang, Gun (ETRI)

  11. Barbarien, Joeri (Vrije Univ. Brussels)

  12. Bici, Oguz (Nokia)

  13. Bivolarsky, Lazar (Skype Technologies)

  14. Boitard, Ronan (INRIA)

  15. Bopardikar, Rajendra (Intel)

  16. Bossen, Frank (DoCoMo USA Labs)

  17. Boyce, Jill (Vidyo)

  18. Bross, Benjamin (Fraunhofer HHI)

  19. Brylants, Tim (Vrije Univ. Brussel)

  20. Budagavi, Madhukar (Texas Instruments Inc)

  21. Cao, Xiaoran (Tsinghua Univ.)

  22. Chen, Jianle (Samsung)

  23. Chen, Lulin (Harmonic)

  24. Chen, Sijia (Cisco Systems)

  25. Chien, Wei-Jung (Qualcomm)

  26. Chiu, Yi-Jen (Intel)

  27. Cho, In Joon (KBS)

  28. Cho, Jaehee (Sejong Univ.)

  29. Choi, Haechul (Hanbat Univ.)

  30. Choi, Jin Soo (ETRI)

  31. Choi, Kiho (Hanyang Univ.)

  32. Chong, In Suk (Qualcomm)

  33. Chono, Keiichi (NEC)

  34. Chujoh, Takeshi (Toshiba)

  35. Clare, Gordon (Orange Labs)

  36. Coban, Muhammed (Qualcomm)

  37. Cohen, Robert (Mitsubishi Electric)

  38. Davies, Thomas (BBC R&D)

  39. De Cock, Jan (Ghent Univ. - IBBT)

  40. Ding, Wenping (Beijing Univ. Tech.)

  41. Dong, Jie (Chinese Univ. Hong Kong)

  42. Drugeon, Virginie (Panasonic)

  43. Fan, Xiaopeng (Harbin / HKUST)

  44. Fernandes, Felix (Samsung)

  45. Flynn, David (BBC)

  46. Fogg, Chad (Harmonic)

  47. François, Edouard (Technicolor)

  48. Fujibayashi, Akira (NTT DoCoMo)

  49. Fukushima, Shigeru (JVC Kenwood)

  50. Fuldseth, Arild (Tandberg)

  51. Glantz, Alexander (Tech. Univ. Berlin)

  52. Gu, Chenchen (Tencent)

  53. Guillo, Laurent (INRIA)

  54. Guo, Xun (MediaTek)

  55. Han, Jong-Ki (Sejong Univ.)

  56. Han, Woo-Jim (Samsung)

  57. He, Dake (RIM)

  58. He, Yun (Tsinghua Univ.)

  59. Heo, Youngsu (Kyunghee Univ.)

  60. Ho, Yo-Sung (GIST)

  61. Hoang, Dzung (Zenverge, Inc.)

  62. Hong, Soongi (Yonsei Univ.)

  63. Hong, Sung-Wook (Sejong Univ.)

  64. Hong, Yingjie (ZTE)

  65. Horowitz, Michael (Vidyo, Inc.)

  66. Hsiang, Shih-Ta (Motorola, Inc.)

  67. Hsu, Chih-Wei (MediaTek)

  68. Huang, Yu-Wen (MediaTek)

  69. Huo, Junyan (Xi'dian Univ.)

  70. Ichigaya, Atsuro (NHK)

  71. Ishtiaq, Faisal (Motorola Inc.)

  72. Jacobs, Marc (Vrije Univ. Brussel)

  73. Jang, Euy-Doc (Korea Aerospace Univ.)

  74. Jeon, Byeong Moon (LG)

  75. Jeon, Byeungwoo (Sungkyunkwan Univ.)

  76. Jeon, Yong-Joon (LG Electronics)

  77. Jeong, Seyoon (ETRI)

  78. Jin, Xin (Waseda Univ.)

  79. Jung, Ji Wook (LG)

  80. Jung, Joël (Orange Labs)

  81. Jung, Tae-Young (Hanyang Univ.)

  82. Kang, Jung Won (ETRI)

  83. Karczewicz, Marta (Qualcomm)

  84. Kazui, Kimihiko (Fujitsu)

  85. Kim, Hae Kwang (Sejong Univ.)

  86. Kim, Hui Yong (ETRI)

  87. Kim, Hyun-Dong (Sejong Univ.)

  88. Kim, Il Koo (Samsung)

  89. Kim, In Kwon (Galaxia Commun.)

  90. Kim, Jae-Gon (Korea Aerosp. Univ.)

  91. Kim, Jeong-Pil (Sejong Univ.)

  92. Kim, Jongho (Yonsei Univ.)

  93. Kim, Kibaek (Hanyang Univ.)

  94. Kim, Kyungyong (Kwangwoon Univ.)

  95. Kim, Munchurl (KAIST)

  96. Kim, Seong Hoon (Galaxia Commun.)

  97. Kim, Seongwan (Yonsei Univ.)

  98. Klomp, Sven (Leibniz Univ. Hannover)

  99. Kogure, Takuyo (Panasonic )

  100. Kondo, Kenji (Sony)

  101. Koyama, Jumpei (Fujitsu)

  102. Krutz, Andreas (Tech. Univ. Berlin)

  103. Lai, Polin (Wang) (Samsung)

  104. Lainema, Jani (Nokia)

  105. Lakshman, Haricharan (Fraunhofer HHI)

  106. Laroche, Guillaume (Canon)

  107. Lee, Ju Ock (Sejong Univ.)

  108. Lee, Sangyoun (Yonsei Univ.)

  109. Lee, Shanfu (Huawei)

  110. Lee, Yoomjim (Kyunghee Univ.)

  111. Lee, Yung-Lyul (Sejong Univ.)

  112. Lei, Shawmin (MediaTek)

  113. Li, Guichun (Huawei)

  114. Li, Junlin (Cisco Systems)

  115. Li, Ming (ZTE)

  116. Li, Wei (Xi'dian Univ.)

  117. Li, Zhengguo (I2R)

  118. Lim, Chongsoon (Panasonic Singapore Labs)

  119. Lim, Jaehyun (LG Electronics)

  120. Lim, Jeongyeon (SK Telecom)

  121. Lim, Sung-Chang (ETRI)

  122. Lim, Woong (Kwangwoon Univ.)

  123. Lin, Sixin (Huawei)

  124. Lin, Yongbing (Huawei)

  125. Ling, Nam (Santa Clara Univ.)

  126. Liu, Hui (Cisco Systems)

  127. Liu, Lingzhi (Huawei / Hisilicon)

  128. Liu, Yu (ASTRI)

  129. Lopez, Patrick (Technicolor)

  130. Luthra, Ajay (Motorola)

  131. Ma, Ran (Shanghai Univ.)

  132. Ma, Siwei (Peking Univ.)

  133. Mao, Xunan (Tencent)

  134. Marpe, Detlev (Fraunhofer HHI)

  135. Martin-Cocher, Gaëlle (RIM)

  136. Matsuo, Shohei (NTT)

  137. McCann, Ken (Zetacast / Samsung)

  138. Mochizuki, Seiji (Renesas)

  139. Moon, Joo-Hee (Sejong Univ.)

  140. Mrak, Marta (BBC)

  141. Murakami, Tokumichi (Mitsubishi Electric)

  142. Murakami, Tomokazu (Hitachi)

  143. Narroschke, Matthias (Panasonic R&D Germany)

  144. Nishi, Takahiro (Panasonic)

  145. Oh, Seoung-Jun (Kwangwoon Univ.)

  146. Ohm, Jens-Rainer (RWTH Aachen Univ.)

  147. O'loughlin, Daniel (Research in Motion)

  148. Onno, Patrice (Canon)

  149. Panusopone, Krit (Motorola)

  150. Park, Gwang Hoon (Kyunghee Univ.)

  151. Park, Hyoungmee (Sejong Univ.)

  152. Park, Jeonghoon (Samsung)

  153. Park, Seungwook (LG)

  154. Park, Un-Ki (Korea Aerospace Univ.)

  155. Paschalakis, Stavros (Mitsubishi Electric R&D Europe B.V.)

  156. Peng, Wen-Hsiao (NCTU/ITRI)

  157. Qu, Xiaochao (Korea Univ.)

  158. Raad, Mohamad (RaadTech Consulting)

  159. Ralston, John (Droplet Tech)

  160. Ridge, Justin (Nokia)

  161. Sakaida, Shinichi (NHK)

  162. Sampedro, Jesus (Polycom)

  163. Sasai, Hisao (Panasonic)

  164. Sato, Kazushi (Sony)

  165. Saxena, Ankur (Samsung Telecom. America)

  166. Schelkens, Peter (Vrije Univ. Brussel)

  167. Segall, Andrew (Sharp)

  168. Sekiguchi, Shun-ichi (Mitsubishi Electric)

  169. Senzaki, Kenta (NEC)

  170. Seo, Chan-Won (Sejong Univ.)

  171. Shen, Bazhong (Broadcom)

  172. Shibahara, Youji (Panasonic)

  173. Shima, Masato (Canon)

  174. Shimizu, Shinya (NTT)

  175. Shiodera, Taichiro (Toshiba)

  176. Sim, Donggyu (Kwangwoon Univ.)

  177. Sjöberg, Rickard (Ericsson)

  178. Song, Jin (Huawei)

  179. Sprljan, Nikola (Mitsubishi Electric R&D Centre Europe)

  180. Sühring, Karsten (Fraunhofer HHI)

  181. Sugimoto, Kazuo (Mitsubishi Electric)

  182. Sugio, Toshiyasu (Panasonic)

  183. Suh, Jung Suk (Samsung)

  184. Sullivan, Gary (Microsoft)

  185. Sun, Huifang (Mitsubishi Electric)

  186. Suzuki, Teruhiko (Sony)

  187. Sze, Vivienne (Texas Instruments)

  188. Tabatabai, Ali (Sony Electronics)

  189. Takamura, Seishi (NTT)

  190. Tan, Thiow Keng (NTT DoCoMo)

  191. Tan, Yih Han (I2R)

  192. Tanizawa, Akiyuki (Toshiba)

  193. Temmermom, Frederik (Vrije Univ. Brussel)

  194. Tonomura, Yoshide (NTT)

  195. Topiwala, Pankaj (FastVDO)

  196. Tsukagushi, Ikuo (Sony)

  197. Tung, Yi-Shin (MStar Semiconductor)

  198. Ueda, Motoharu (JVC Kenwood)

  199. Ugur, Kemal (Nokia)

  200. Vermeirsch, Kenneth (Ghent Univ. -- IBBT)

  201. Wahadaniah, Viktor (Panasonic Singapore Labs)

  202. Wan, Wade (Broadcom)

  203. Wang, David (Polycom)

  204. Wang, Pulin (Huawei)

  205. Wang, Xianglin (Qualcomm)

  206. Wang, Ye-Kui (Huawei)

  207. Wedi, Thomas (Panasonic)

  208. Wegner, Krzysztof (Poznań Univ. Tech.)

  209. Wen, Xing (Hong Kong Univ. Sci. & Tech.)

  210. Weng, Ying (BBC)

  211. Wiegand, Thomas (Fraunhofer HHI)

  212. Winken, Martin (Fraunhofer HHI)

  213. Won, Kwanghyun (Sungkyunkwan Univ.)

  214. Wu, Ping (Mitsubishi Electric)

  215. Wu, Zhixiong (OKI)

  216. Xu, Jizheng (Microsoft)

  217. Xu, Lidong (Intel)

  218. Xu, Yian (Cisco Systems)

  219. Yamakage, Tomoo (Toshiba)

  220. Yamamoto, Tomoyuki (Sharp)

  221. Yang, Fuzheng (Xi'dian Univ.)

  222. Yang, Haitao (Huawei)

  223. Yang, Hongzhang (Freescale Semiconductor)

  224. Yang, Jungyoup (Sungkyunkwan Univ.)

  225. Yang, Ming Yuan (Huawei)

  226. Yang, Zhijie (Broadcom)

  227. Ye, Yan (Dolby Labs)

  228. Yea, Sehoon (LG)

  229. Yeo, Chuohao (I2R)

  230. Yoon, Daeil (Sejong Univ.)

  231. Yoshino, Tomonobu (KDDI)

  232. Yu, Haoping (Huawei)

  233. Yu, Lu (Zhejiang Univ.)

  234. Yu, Yong (Broadcom)

  235. Yuan, Yuan (Tsinghua Univ.)

  236. Zhang, Li (Peking Univ.)

  237. Zhang, Louis (AMD)

  238. Zhang, Wen (ZTE)

  239. Zhao, Haiwu (Shanghai Univ.)

  240. Zhao, Qing Yi (Tencent)

  241. Zheng, Jianhua (Huawei)

  242. Zheng, Xiaozhen (Huawei)

  243. Zhou, Minhua (TI)

  244. Zou, Bill (DTS)


  1. Audio report








Source: Schuyler Quackenbush, Chair, Audio Subgroup

Report of 94th meeting 8

1 Opening 8

2 Roll call of participants 8

3 Approval of agenda 8

4 Allocation of contributions 8

5 Communications from Convenor 8

6 Report of previous meeting 8

7 Processing of NB Position Papers 8

8 Work plan management 8

8.1 Media coding 8

8.2 Composition coding 11

8.3 Description coding 12

8.4 Transport and File formats 12

8.5 Multimedia architecture 13

8.6 Application formats 14

8.7 Reference implementation 14

8.8 Conformance 15

8.9 Maintenance 16

9 Organisation of this meeting 16

9.1 Tasks for subgroups 16

9.2 Joint meetings 18

10 WG management 18

10.1 Terms of reference 18

10.2 Liaisons 18

10.3 Ad hoc groups 19

10.4 Asset management 19

10.5 Facilities fees 20

10.6 IPR management 20

10.7 Work plan and time line 20

11 Administrative matters 20

11.1 Schedule of future MPEG meetings 20

11.2 Promotional activities 21

12 Resolutions of this meeting 21

13 A.O.B. 21

14 Closing 21

Annex A – Attendance list 22

Annex B – Agenda 32

Annex C – Input contributions 35

Annex D – Output documents 60

Annex E – Requirements report 64

1 Requirements documents approved at this meeting 64

2 Systems 64

2.1 MPEG Font Formats 64

3 Video 65

3.1 MPEG-7 AVDP 65

3.2 Miscellaneous 65

4 Explorations 65

4.1 Compact Descriptors for Visual Search (CDVS) 65

4.2 MPEG Frame-Compatible Stereo Enhancement for AVC (MFC) 66

4.3 Audio 66

4.4 Leightweight Video Coding 67

4.5 MMT 67

4.6 3D Video Coding 68

4.7 Option-1 Licensable Codecs 68

4.8 User Identification 69

Annex F – Systems report 70

1 Output of the Meeting 70

2 General Input Documents 73

2.1 AHG reports 73

2.2 General technical contributions 73

2.3 Demo 73

2.4 FAQ 73

2.5 AOB 73

3 MPEG-2 Systems (13818-1) 74

3.1 Topics 74

3.2 Contributions 74

3.3 Summary of discussions 74

3.4 Action Points 74

4 MPEG-4 Reference Software (14496-5) 75

4.1 Topics 75

4.2 Contributions 75

4.3 Summary of discussions 75

4.4 Action Points 75

5 MPEG-4 BIFS (14496-11) 75

5.1 Topics 75

5.2 Contributions 75

5.3 Summary of discussions 76

5.4 Action Points 77

6 MPEG-4 ISO Base File Format (14496-12) 77

6.1 Topics 77

6.2 Contributions 77

6.3 Summary of discussions 77

6.4 Action Points 77

7 LASeR & SAF (14496-20) 77

7.1 Topics 77

7.2 Contributions 78

7.3 Summary of discussions 78

7.4 Action Points 78

8 Open Font Format (14496-22) 78

8.1 Topics 78

8.2 Contributions 78

8.3 Summary of discussions 78

8.4 Action Points 78

9 Contract Expression Language (21000-20) 78

9.1 Topics 78

9.2 Contributions 79

9.3 Summary of discussions 79

9.4 Action Points 79

10 Stereoscopic Video AF (23000-11) 79

10.1 Topics 79

10.2 Contributions 79

10.3 Summary of discussions 80

10.4 Action Points 80

11 Interactive Music AF (23000-12) 80

11.1 Topics 80

11.2 Contributions 80

11.3 Summary of discussions 80

11.4 Action Points 81

12 Dynamic Adaptive Streaming over HTTP (23001-6) 81

12.1 Topics 81

12.2 Contributions 81

12.3 Summary of discussions 86

12.4 Action Points 90

13 Multimedia Service Platform Architecture (23006-1) 90

13.1 Topics 90

13.2 Contributions 90

13.3 Summary of discussions 90

13.4 Action Points 91

14 MSP APIs (23006-2) 91

14.1 Topics 91

14.2 Contributions 91

14.3 Summary of discussions 91

14.4 Action Points 91

15 MSP Elementary Service Protocol (23006-4) 91

15.1 Topics 91

15.2 Contributions 91

15.3 Summary of discussions 92

15.4 Action Points 93

16 MSP Service Aggregation (23006-5) 93

16.1 Topics 93

16.2 Contributions 93

16.3 Summary of discussions 93

16.4 Action Points 93

17 Richmedia UI Widgets (23007-1) 93

17.1 Topics 93

17.2 Contributions 93

17.3 Summary of discussions 94

17.4 Action Points 94

18 Advanced User Interaction Interface (23007-2) 94

18.1 Topics 94

18.2 Contributions 94

18.3 Summary of discussions 94

18.4 Action Points 95

19 MPEG-U Conformance and Ref. SW (23007-3) 95

19.1 Topics 95

19.2 Contributions 95

19.3 Summary of discussions 95

19.4 Action Points 95

20 MPEG-V Architecture (23005-1) 95

20.1 Topics 95

20.2 Contributions 96

20.3 Summary of discussions 96

20.4 Action Points 96

21 Control Information (23005-2) 96

21.1 Topics 96

21.2 Contributions 96

21.3 Summary of discussions 96

21.4 Action Points 96

22 Sensory Information (23005-3) 97

22.1 Topics 97

22.2 Contributions 97

22.3 Summary of discussions 97

22.4 Action Points 97

23 Virtual World Object Characteristics (23005-4) 98

23.1 Topics 98

23.2 Contributions 98

23.3 Summary of discussions 98

23.4 Action Points 98

24 Data formats for interaction devices (23005-5) 98

24.1 Topics 98

24.2 Contributions 98

24.3 Summary of discussions 99

24.4 Action Points 99

25 Conformance and reference software (23005-7) 99

25.1 Topics 99

25.2 Contributions 99

25.3 Summary of discussions 99

25.4 Action Points 99

25.5 Summary of discussions 99

25.6 Action Points 100

26 Exploration – MMT 100

26.1 Topics 100

26.2 Contributions 100

26.3 Summary of discussions 100

26.4 Action Points 100

27 Liaison 100

27.1 List of input liaison letters 100

28 References 102

28.1 Timeline of standards under development 102

28.2 Standing Documents 104

28.3 Mailing Lists Reminder 106

28.4 Latest References and Publication Status 107

Annex G – Video report 117

1 MPEG-2 video 117

2 MPEG-4 part 2 Software 117

3 Development of AVC 118

4 MPEG-7 Visual 119

5 Reconfigurable Video Coding (RVC) 119

5.1 RVC-related activity scheduling at the meeting 120

5.2 Review of Input contributions 120

6 Explorations – 3D Video 122

7 Explorations – Scalable resolution enhancement of frame-compatible stereo video 123

Annex H – JCT report 126

1 Administrative topics 126

1.1 Organization 126

1.2 Meeting logistics 127

1.3 Primary goals 127

1.4 Documents 127

1.5 Attendance 128

1.6 Agenda 128

1.7 IPR policy reminder 129

1.8 Communication practices 130

1.9 Terminology 130

1.10 Liaison activity 132

1.11 Contribution topic overview 132

1.12 Video sequence viewing during the meeting 133

2 AHG reports 133

3 TE1: Decoder-side motion vector derivation 141

4 TE2: IBDI and memory compression 144

4.1 Summary 144

4.2 1-D DPCM-based memory compression 145

4.3 Reference frame compression using image coder 145

4.4 TI reference frame compression proposal 146

4.5 Adaptive scaling for bit depth compression on IBDI 146

4.6 Summary conclusions on TE2 147

5 TE3: Inter prediction 147

6 TE4: Variable length coding 151

7 TE5: Simplified TMuC intra prediction 152

8 TE6: Intra prediction 153

8.2 TE6.a.1 Weighted Bidirectional Prediction (WBP) and Adaptive Sub-block Coding Order (ASCO) 154

8.3 TE6.a.2 Short distance intra prediction 155

8.4 TE6.a.3 Overlapped block intra prediction 156

8.5 TE6.a.4 Line-based intra prediction 156

8.6 TE6.b.1 Differential coding of intra modes (DCIM) 157

9 TE7: MDDT Simplification 158

9.2 I2R proposed simplification of MDDT 161

9.3 Huawei proposed simplification of MDDT 162

9.4 Toshiba proposed simplification of MDDT 163

9.5 Beijing Univ. Tech. proposed simplification of MDDT 164

9.6 Peking Univ. proposed simplification of MDDT 164

10 TE8: Parallel entropy coding 165

10.2 Coefficient Sign PCP, Coeff Level BinIdx 0 PCP, and significance map PCP 165

10.3 Coding order for significance map on bin decoding throughput (JCTVC B036 Section 2) and V2V coding tree (JCTVC-B034) 166

11 TE9: Large block structures 168

12 TE10: In-loop filtering 169

13 TE11: Motion vector coding 176

14 TE12 178

14.1 TE12: Overall TE12 summary 178

14.2 TE12 TMuC coding unit definitions 180

14.3 TE12 TMuC prediction units 181

14.4 TE12 TMuC transform units 182

14.5 TE12 Interpolation filters 183

14.6 TE12 TMuC motion representation 187

14.7 TE12 TMuC partition-based illumination compensation 188

14.8 TE12 TMuC filtering 189

14.9 TE12 TMuC intra-frame prediction 190

14.10 TE12 TMuC transforms and coefficient coding 195

14.11 TE12 TMuC entropy coding 199

14.12 TE12 TMuC IBDI and transform precision extension 200

14.13 TE12 TMuC encoder-only aspects 202

15 Project planning and Test Model establishment 203

15.1 Project timeline 203

15.2 Test model design: normative aspects 206

15.3 Test model design: non-normative aspects and test methodology 212

16 TMuC settings and common test conditions 213

17 Application-specific topics 214

18 Non-TE Technical Contributions 215

18.1 Loop filtering 215

18.2 Block structures and partitioning 217

18.3 Motion compensation and interpolation filters 222

18.4 Motion vector coding 225

18.5 B picture reference list redundancy 226

18.6 Quantization control 227

18.7 Entropy coding 227

18.8 Intra prediction 232

18.9 Transforms and residual coding 234

18.10 IBDI and memory compression 238

18.11 Complexity analysis 239

19 Establishment of ad hoc groups 240

20 Core Experiment planning and Common Conditions 244

20.1 General issues for CEs 244

20.2 Common Conditions 245

21 Output documents 245

22 Future meeting plans and closing of the meeting 246

Annex A to JCT-VC report:
List of documents 248

Annex B to JCT-VC report:


List of meeting participants 270

Annex I – Audio report 276

1 Opening Audio Plenary 283

2 Administrative matters 283

2.1 Communications from the Chair 283

2.2 Approval of agenda and allocation of contributions 283

2.3 Creation of Task Groups 283

2.4 Approval of previous meeting report 283

2.5 Review of AHG reports 283

2.6 Joint meetings 283

2.7 Received National Body Comments and Liaison matters 283

2.8 Plenary Discussion 283

3 Record of AhG meetings 283

3.1 AhG Meeting on USAC -- Sunday 1000-1800 283

4 Task group activities 291

4.1 Joint Meeting 291

4.2 Task Group discussions 291

5 Closing Audio Plenary and meeting deliverables 305

5.1 Plenary discussions 305

5.2 Responses to Liaison and NB comments 305

5.3 Recommendations for final plenary 305

5.4 Establishment of Ad-hoc Groups 306

5.5 Approval of output documents 306

5.6 Press statement 306

5.7 Agenda for next meeting 306

5.8 All other business 306

5.9 Closing of the meeting 306

1. Participants 307

2. Audio Contributions and Schedule 308

Task Groups 314

3. Output Documents 315

4. Agenda for the 95th MPEG Audio Meeting 315

Annex J – 3DG report 317

1 Opening of the meeting 317

1.1 Approval of the agenda 317

1.2 Goals for the week 317

1.3 Standards from 3DGC 317

1.4 Room allocation 318

1.5 Allocation of contributions 319

2 General issues 328

2.1 General discussion 328

3 Current Voting 328

4 General 3DG related activities 328

4.1 AhG on 3DG activities 328

4.2 Promotions 329

4.3 Joint activities 329

4.4 Explorations 333

5 Liaison 333

6 Output documents and Resolutions of 3DGC 333

1 Part 4 Conformance 333

2 Part 16 Animation Framework eXtension (AFX) 333

3 Part 25 3DGCM 333

7 Establishment of 3DG Ad-Hoc Groups 334

8 Closing of the Meeting 334





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