International organisation for standardisation


WG management 10.1Terms of reference



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10WG management

10.1Terms of reference


The following document was approved


11900

Terms of reference



10.2Liaisons

10.2.1Liaison statementss


The following liaison statements were approved


12049

Liaison Statement to WG 1 on Visual Search

12051

Response to the liaison from COST IC1003 (QUALINET)

11972

Liaison statement to 3GPP on Dynamic Adapative Streaming over HTTP

11973

Liaison statement template on DASH Profiles under consideration

11974

Liaison statement template on Multimedia Service Platform Technology

11976

Liaison statement to SC 6 on MPEG Media Transport

11977

Liaison statement to ISO/TC 223 on Video surveillance

11978

Liaison statement to IEC TC 100 on RII

11980

Liaison statement to W3C on DASH

11986

Liaison Statement to ITU-T SG9 (3D Video Quality Assessment and Scalable View-range Representation)

12019

Response to m19533, TC100/TA6

12020

Response to m19534, TC100

12021

Response to m19538, TC100/TA4



10.2.2New liaisons


The following document was approved


12050

Statement of benefits from establishing a Category C liaison with Qualinet



10.2.3List of active liaisons


The following document was approved


11911

List of Organisations with which MPEG entertains liaisons



10.3Responses to National Bodies


The following document was approved


12025

Response to US NB



10.4Ad hoc groups


The following ad hoc groups were established


#

Title

12052

AHG on 3D Video Coding

12005

AHG on 3DG documents, software maintenance and core experiments

11965

AHG on Application Format

12026

AHG on Audio Visual Description Profile

12032

AHG on Compact Descriptors for Visual Search

11897

AHG on Contract Expression Language

11898

AHG on Dynamic Adaptive Streaming over HTTP

11975

AHG on Font Format Representation

12007

AHG on Graphics Tool Library

12030

AHG on Internet Video Coding Technologies

12033

AHG on Low Complexity Video Coding

11918

AHG on MPEG File Formats

12031

AHG on MPEG Frame Compatible (MFC) Stereo Coding

11990

AHG on MPEG Media Transport

11989

AHG on MPEG-7 Visual

12029

AHG on MPEG-H Vision

11979

AHG on MPEG-M

11896

AHG on MPEG-V

12027

AHG on Multimedia Preservation

12006

AHG on Multi-Resolution 3D mesh Coding

11988

AHG on Reconfigurable Video Coding

12028

AHG on Study of HEVC Extension

11991

AHG on Systems’ vision on new MPEG standard

12023

AHG on USAC



10.5Asset management


The following documents were approved


11905

Schema assets

11906

Software assets

11907

Conformance assets

11908

Content assets

11909

URI assets



10.6IPR management


The following document was approved


11910

Standards under development for which a call for patent statements is issued



10.7Work plan and time line


The following documents were approved


11901

MPEG Standards

11902

Table of unpublished FDISs

11903

Work plan and time line



11Administrative matters

11.1Schedule of future MPEG meetings


The following meeting schedule was approved


#

City

Country

yy

mm

dd-dd

96

Geneva

CH

11

03

21-25

97

Torino

IT

11

07

18-22

98

Geneva

CH

11

11-12

28-02

99

San Jose

US

12

02

06-10

100

Geneva

CH

12

04-05

30-04

101

Stockholm

SE

12

07

16-20

102

Suzhou

CN

12

10

15-19

103

Geneva

CH

13

01

21-25

104

Incheon

KR

13

04

22-26

105

?

?

13

07

??-??

106

Geneva

CH

13

10-11

28-01



11.2Promotional activities

11.2.1Promotional documents


The following documents were approved


12041

Introduction to MPEG Compact Descriptors for Visual Search

12053

Short description of the Audio Visual Description Profile

11955

List of Youtube video demonstrating MPEG technologies

11956

Short descriptions

11957

1-pager on Composite Font

11958

1-pager on BIFS for digital radio

11959

1-pager on Presentation and Modification of Structured Information

11960

1-pager on Scene adaptation

11961

1-pager on Contract Expression Language

11962

1-pager on Media Value Chain Ontology

11963

1-pager on Digital Item Presentation

11964

1-pager on Dynamic Adaptive Streaming over HTTP

11965

1-pager on MVC File Format

11966

1-pager on Sub-track selection & switching

11967

1-pager on Advanced User Interaction Interface

11968

1-pager on MPEG-M Architecture

11987

1-pager on MXM APIs

11969

1-pager on Elementary Services

11970

1-pager on Service Aggregation

11971

1-pager on Open Access AF

12022

Unified Speech and Audio Coder Common Encoder Reference Software

11994

Overview of MPEG-V Part 1 Architecture

11995

Overview of MPEG-V Part 2 Control information

11996

Overview of MPEG-V Part 4 Virtual world object characteristics

11997

Overview of MPEG-V Part 5 Data formats for interaction devices

11998

Overview of MPEG-V Part 6 Common types and tools

11999

Overview of MPEG-V Part 7 Conformance and reference software



11.2.2Press release


The following document was approved


11893

Geneva press release



12Resolutions of this meeting


These were approved

13A.O.B.


There was no other business

14Closing


The meeting closed at 2011/03/25T19:55


  1. Attendance list




givenname

familyname

Affiliatiom




Country

Kouadio

Adi

EBU - European Broadcasting Union




Switzerland

Minsu

Ahn

Samsung Electronics




Korea

Fujibayashi

Akira

NTT DOCOMO,Inc.




Japan

Daniele

Alfonso

STMicroelectronics




Italy

Walter

Allasia

EURIX




Italy

Ping

An

Shanghai University




China

Shuichi

Aoki

NHK




Japan

Kohtaro

Asai

Mitsubishi Electric Corporation




Japan

Cheung

Auyeung

Sony Electronics Inc




USA

Gun

Bang

ETRI




Korea

Joeri

Barbarien

IBBT - VUB/ETRO




Belgium

Vittorio

Baroncini

Fondazione Ugo Bordoni




Italy

Gero

Bäse

Siemens




Germany

Ali

Begen

Cisco




Canada

Abdellatif

Benjelloun Touimi

Huawei Technologies Co., Ltd.




USA

Bruno

Bessette

VoiceAge




Canada

Lazar

Bivolarsky

Skype Technologies SA




USA

Miroslaw

Bober

Mitsubishi Electric R&D Center Europe




USA

Ronan

Boitard

INRIA RENNES




France

Philippe

Bordes

Technicolor




France

Fons

Bruls

Philips




Netherlands

Madhukar

Budagavi

Texas Instruments Inc.




USA

Pablo

Carballeira

Universidad Politecnica de Madrid




Spain

Jihun

Cha

ETRI




Korea

Mary-Luc

Champel

Technicolor




France

Ti Eu

Chan

Institute For Infocomm Research




Singapore

Vijay

Chandrasekhar

Stanford University




USA

Wo

Chang

NIST




USA

Guangliang

Chen

ZTE CORPORATION




China

Weizhong

Chen

Huawei technologies CO.,LTD




China

Chun-Fu

Chen

NCKU/ITRI




USA

Ying

Chen

Qualcomm




USA

Won-Sik

Cheong

ETRI




Korea

Leonardo

Chiariglione

CEDEO




Italy

Toru

Chinen

Sony Corporation




Japan

Yongju

Cho

ETRI




Korea

Miran

Choi

ETRI




Korea

Kiho

Choi

Hanyang University




Korea

Bum Suk

Choi

ETRI




Korea

Kyoungho

Choi

Mokpo National University




Korea

Byeong-Doo

Choi

Samsung Electronics




Korea

Keiichi

Chono

NEC




Japan

Takeshi

Chujoh

Toshiba Corporation




Japan

Sungmoon

Chun

Planning




Korea

Gordon

Clare

orange labs france telecom




France

Robert

Cohen

Mitsubishi Electric




USA

Cyril

Concolato

Telecom ParisTech




France

Giovanni

Cordara

Telecom Italia




Italy

Jingjing

Dai

HKUST




China

Thomas

Davies

Cisco Systems




USA

Jan

De Cock

Ghent University - IBBT




Belgium

Christophe

Dehais

FittingBox




France

Jaime

Delgado

DMAG - UPC




Spain

Wenpeng

Ding

Beijing University Of Technology




China

Marek

Domanski

Poznan University of Technology




Poland

Virginie

Drugeon

Panasonic R&D Center Germany




Germany

Lingyu

Duan

Peking University




China

Jean-Claude

Dufourd

Telecom ParisTech




France

Touradj

Ebrahimi

EPFL




Switzerland

Erhan

Ekmekcioglu

University of Surrey




USA

Eyal

Farkash

NDS




Israel

Felix

Fernandes

Samsung




USA

Gerard

Fernando

ZTE Corporation




USA

Chad

Fogg

Harmonic Inc.




USA

Gianluca

Francini

Telecom Italia




Italy

Per

Fröjdh

Ericsson AB




Sweden

Deliang

Fu

Zhejiang University




China

Shigeru

Fukushima

JVC KENWOOD Holdings, Inc.




Japan

Francesco

Gallo

EURIX




Italy

Ludovico

Gardenghi

Institut Télécom, Télécom SudParis




France

Eric

Gautier

TECHNICOLOR




France

Alexander

Giladi

Avail-TVN




USA

Vittorio

Giovara

Sisvel Spa




Italy

Lutz

Goldmann

EPFL/STI/IEL/GR-EB




Switzerland

Philippe

Gournay

VoiceAge Corporation




Canada

Michael

Grafl

Klagenfurt University




Austria

Marco

Grangetto

Politecnico di Torino




Italy

John

Grant

Nine Tiles Networks Ltd




USA

Bernhard

Grill

Fraunhofer IIC




Germany

Marc

Guez Vucher

SCPP/IFPI




France

Christine

Guillemot

IRISA




France

Laurent

Guillo

INRIA




France

Jae Joon

Han

Samsung Electronics AIT




Korea

Seungju

Han

Samsung Electronics




Korea

Miska

Hannuksela

Nokia




Finland

Munsi

Haque

Sony Electronics Inc.




USA

Ryoji

Hashimoto

Renesas Electronics Corporation




Japan

Shinobu

Hattori

Sony Corp




Japan

Simon

Hawe

TU München




Germany

Yun

He

MIIT of P.R. China




China

Juergen

Herre

Fraunhofer Institut IIS




Germany

Mitsuhiro

Hirabayashi

SONY Corporation




Japan

Dzung

Hoang

Zenverge, Inc.




USA

Ingo

Hofmann

Fraunhofer Institut IIS




Germany

Sung-Wook

Hong

Sejong University




Korea

Soongi

Hong

Yonsei University




Korea

Hotaek

Hong

LG Electronics




Korea

Yingjie

Hong

ZTE Corporation




China

Gary

Hughes

Motorola Mobility




USA

Kilroy

Hughes

Microsoft Corporation




USA

Sung oh

Hwang

Samsung Electronics




Korea

Atsuro

Ichigaya

NHK




Japan

Kota

Iwamoto

NEC




Japan

Marc

Jacobs

IBBT - VUB/ETRO




Belgium

Fabian

Jaeger

RWTH Aachen University




Germany

Euee S.

Jang

Hanyang University




Korea

Jong Hyun

Jang

ETRI




Korea

Byeongmoon

Jeon

LG Electronics




Korea

Byeungwoo

Jeon

Sungkyunkwan University




Korea

Dong-Seok

Jeong

INHA UNIVERSITY




Korea

Jong Hoon

Jeong

Samsung Electronics




Korea

Seo

Jeongil

ETRI




Korea

Song

Jeongook

Yonsei Univ.




Korea

Ali

Jerbi

Cisco




Canada

Sanghyun

Joo

ETRI




Korea

Bojan

Joveski

Institut Telecom, Telecom SudParis




France

Tae-Young

Jung

Chips & Media




Korea

Itaru

Kaneko

Tokyo Polytechnic University




Japan

Jung Won

Kang

ETRI




Korea

Kyeongok

Kang

ETRI




Korea

Mukta

Kar

Cable Television Laboratories




USA

Kei

Kawamura

KDDI Corp.




Japan

Kimihiko

Kazui

FUJITSU LABORATORIES LTD.




Japan

Christian

Keimel

Technische Universität Mnchen




Germany

Joachim

Keinert

Fraunhofer IIS




Germany

Thomas

Kernen

Cisco Systems




USA

Sylvain

Kervadec

Orange Labs




France

Kei

Kikuiri

NTT DOCOMO, INC.




Japan

Sang-Kyun

Kim

Myongji University




Korea

Chang-Yul

Kim

Feelingk




Korea

Gun Woo

Kim

Kyung Hee Univercity




Korea

Kyung Ho

Kim

LG Electronics




Korea

Yong Han

Kim

University of Seoul




Korea

Kyuheon

Kim

Kyung Hee University




Korea

Hae Kwang

Kim

Sejong University




Korea

Junoh

Kim

Kyung Hee Univercity




Korea

Seongwan

Kim

Yonsei University




Korea

Kyung Won

Kim

Korea Electronics Technology Institute




Korea

Kristofer

Kjörling

Dolby Sweden AB




Sweden

Masaaki

Kobayashi

Canon Inc.




Japan

Tomoya

Kodama

Toshiba Corporation




Japan

Takuyo

Kogure

Panasonic Corporation




Japan

Kenji

Kondo

Sony corporation




Japan

Jumpei

Koyama

FUJITSU LABORATORIES LTD.




Japan

Ferenc

Kraemer

Dolby Germany GmbH




Germany

Panos

Kudumakis

Queen Mary University of London




USA

Jae Keun

Kwak

Korea Electronics Association




Korea

Won

Kwanghyun

SungKyunKwan University




Korea

Sangyoun

Lee

Yonsei university




Korea

Jongwon

Lee

Samsung Electronics




Korea

Taejin

Lee

ETRI




Korea

Jaejoon

Lee

Samsung Electronics




Korea

Seung Wook

Lee

ETRI




Korea

Namsuk

Lee

Samsung Electronics Co.




Korea

Jaeho

Lee

Yonsei university




Korea

Ju Ock

Lee

Sejong University




Korea

Jun-Woo

Lee

INHA University




Korea

Jin

Lee

ETRI




Korea

Gwo Giun (chris)

Lee

National Cheng Kung Univ.




USA

Eun Seo

Lee

ETRI




Korea

Chulhee

Lee

KCC




Korea

Roch

Lefebvre

Universite de Sherbrooke




Canada

Athanasios

Leontaris

Dolby Laboratories, Inc.




USA

Vladimir

Levantovsky

Monotype Imaging Inc.




USA

Zhu

Li

Huawei Technology USA




USA

Ming

Li

ZTE Corporation




China

Cui

Li

Hanyang university




Korea

Seong Yong

Lim

ETRI




Korea

Youngkwon

Lim

net&tv Inc.




Korea

Chong Soon

Lim

Panasonic Singapore Laboratories




Singapore

Yu

Liu

ASTRI




China

Patrick

Lopez

Technicolor




France

Zhe

Lou

Alcatel-Lucent




Belgium

Ajay

Luthra

Motorola Mobility




USA

Siwei

Ma

Peking University




China

Khaled

Mammou

FittingBox




France

Iain James

Marshall

Prologue




France

Gaëlle

Martin-Cocher

Research in Motion




Canada

Ikeda

Masaru

Sony Corporation




Japan

Shohei

Matsuo

NTT Corporation




Japan

Marco

Mattavelli







Switzerland

Ken

Mccann

ZetaCast / Samsung




USA

Philipp

Merkle

Fraunhofer HHI




Germany

Alberto

Messina

RAI




Italy

Akira

Minezawa

Mitsubishi Electric Corporation




Japan

Koohyar

Minoo

Motorola Mobility Inc.




USA

Mihai

Mitrea

Institut Télécom ; Télécom SudParis




France

Francisco

Morán Burgos

Universidad Politécnica de Madrid




Spain

Takehiro

Moriya

NTT




Japan

Alessandra

Mosca

CSP




Italy

Karsten

Müller

Fraunhofer HHI




Germany

Markus

Multrus

Fraunhofer IIS




Germany

Tomokazu

Murakami

Hitachi, Ltd.




Japan

Tokumichi

Murakami

Mitsubishi Electric Corporation




Japan

Sang-Il

Na

ETRI




Korea

Takayuki

Nakachi

NTT




Japan

Sam

Narasimhan

Motorola Mobility




USA

Panos

Nasiopoulos

University of British Columbia




Canada

Patrick

Ndjiki-Nya

Fraunhofer Heinrich-Hertz-Institut




Germany

Max

Neuendorf

Fraunhofer IIS




Germany

Jean Francois

Nezan

INSA of Rennes




France

Nhut

Nguyen

Samsung Electronics




USA

Takahiro

Nishi

Panasonic




Japan

Masayuki

Nishiguchi

Sony Corporation




Japan

Takeshi

Norimatsu

Panasonic Corporation




Japan

Andrey

Norkin

Ericsson




Sweden

Weon Geun

Oh

ETRI




Korea

Eunbin

Oh

Korean Standards Association




Korea

Jens-Rainer

Ohm

RWTH Aachen University




Germany

Werner

Oomen

Philips Research




Netherlands

Joern

Ostermann

Leibniz University Hannover




Germany

Peshala

Pahalawatta

Dolby Laboratories Inc




USA

Gregory

Pallone

France Telecom




France

Dong-Jin

Park

Chips&Media,Inc.




Korea

Kyungmo

Park

Samsung Electronics Co., Ltd.




Korea

Stavros

Paschalakis

Mitsubishi Electric R&D Centre Europe BV




USA

Danilo

Pau

STMicroelectronics Srl




Italy

Anand

Paul

Hanyang University




Korea

Wen-Hsiao

Peng

ITRI International/NCTU




USA

David

Pope

Aptina Imaging




USA

Mahsa

Pourazad

University of Toronto




Canada

Marius

Preda

Institut TELECOM




France

Francoise

Preteux

MINES ParisTech




France

Hyeoncheol

Pu

Samsung Electronics




Korea

Heiko

Purnhagen

Dolby Sweden AB




Sweden

Schuyler

Quackenbush

Audio Research Labs




USA

Mohamad

Raad

RaadTech Consulting




Australia

John

Ralston

Droplet Technology, Inc.




USA

Clifford

Reader







China

Yuriy

Reznik

Qualcomm Inc.




USA

Sungryeul

Rhyu

Samsung Electronics Co. Ltd




Korea

Jean-Francois

Ridel

Sensio




Canada

Justin

Ridge

Nokia




Finland

Julien

Robilliard

Fraunhofer IIS




Germany

Arturo

Rodriguez

Cisco Systems




USA

Victor

Rodriguez-Doncel

Universitat Politècnica de Catalunya




Spain

Dmytro

Rusanovskyy

Nokia




Finland

Thomas

Rusert

Ericsson AB




Sweden

Shinichi

Sakaida

NHK




Japan

Yago

Sánchez de la fuente

Germany




Germany

Aritz

Sánchez De La Fuente

Technische Universitaet Berlin




Germany

Hisao

Sasai

Panasonic




Japan

Kazushi

Sato

Sony Corp.




Japan

Ankur

Saxena

Samsung Telecommunications America




USA

Thomas

Schierl

Fraunhofer HHI




Germany

Ethan

Schur

TDVision Systems Inc




USA

Istvan

Sebestyen

Ecma International




Switzerland

Shun-Ichi

Sekiguchi

Mitsubishi Electric Corporation




Japan

Chanwon

Seo

Sejong University




Korea

Jeong-Hoon

Seo

Feelingk




Korea

Bae

Seong-Jun

ETRI




Korea

Suman

Sharma

Intel Corporation




USA

Qiu

Shen

Huawei Technologies Co., Ltd




China

Youji

Shibahara

Panasonic Corporation




Japan

Masato

Shima

Canon Inc.




Japan

Shinya

Shimizu

NTT Corporation




Japan

Avraham

Shimor

SanDisk Corporation / SII




Israel

Thomas

Sikora

TU Berlin, FG Nachrichtenübertragung




Germany

Donggyu

Sim

Kwangwoon University




Korea

David

Singer

Apple Inc.




USA

Rickard

Sjoberg

Ericsson




Sweden

Aljosa

Smolic

Disney Research Zurich




Switzerland

Iraj

Sodagar

Microsoft




USA

Eunyong

Son

LG Electronics




Korea

jae yeon

Song

Samsung Electronics




Korea

Jacek

Stachurski

Texas Instruments




USA

Nikolce

Stefanoski

Disney Research, Zurich




Switzerland

Thomas

Stockhammer

Qualcomm Incorporated




Germany

Kazuo

Sugimoto

Mitsubishi Electric Corporation




Japan

Toshiyasu

Sugio

Panasonic Corporation




Japan

Gary

Sullivan

Microsoft Corp.




USA

Huifang

Sun

Mitsibishi Electric Research Labs




USA

Jaewon

Sung

LG Electronics




Korea

Yoshinori

Suzuki

NTT DOCOMO, Inc.




Japan

Teruhiko

Suzuki

Sony Corp.




Japan

Jonas

Svedberg

Ericsson AB




Sweden

Vivienne

Sze

Texas Instruments




USA

Ali

Tabatabai

Sony Electornics Inc.




USA

Lim

Taehee

Hanyang University




Korea

Seishi

Takamura

NTT Cyber Space Laboratories




Japan

Joop

Talstra

Philips Intellectual Property & Standards




Netherlands

Wa James

Tam

Communicatioins Research Centre Canada




Canada

Thiow Keng

Tan

NTT DOCOMO, Inc




Japan

Masayuki

Tanimoto

Nagoya University




Japan

Gerhard

Tech

Fraunhofer Heinrich Hertz Institute




Germany

Shi

Teng

huawei




China

Leonid

Terentiev

Fraunhofer Institut IIS




Germany

Andrew

Tescher

Microsoft Corporation




USA

Herbert

Thoma

Fraunhofer IIS




Germany

Yvonne

Thomas

European Broadcasting Union




Switzerland

Dong

Tian

Mitsubishi Electric Research Laboratories




USA

Huang

Tiejun

Peking University




China

Christian

Timmerer

Alpen-Adria Universität Klagenfurt




Austria

Yasuaki

Tokumo

Sharp Corporation




Japan

Ikai

Tomohiro

Sharp Corporation




Japan

Pankaj

Topiwala

FastVDO LLC




USA

Alexandros

Tourapis

Dolby Laboratories / Magnum Semiconductor




USA

Cong Thang

Truong

ETRI




Korea

Christian

Tulvan

Institut Telecom




France

Tadashi

Uchiumi

Sharp corporation




Japan

Motoharu

Ueda

JVC KENWOOD Holdings, Inc.




Japan

Stéphane

Valente

ST Ericsson




France

Glenn

Van Wallendael

Ghent University - IBBT - Multimedia Lab




Belgium

Sanjeev

Verma

Samsung Electronics




USA

Anthony

Vetro

Mitsubishi Electric




USA

David

Virette

Huawei Technologies Co., Ltd.




Germany

Viktor

Wahadaniah

Panasonic Corporation




Singapore

Husak

Walt

US/SMPTE




USA

Wade

Wan

Broadcom Corporation




USA

Lu

Wang

ASTRI




China

Xin

Wang

Huawei Technologies, USA




USA

Ye-Kui

Wang

Huawei Technologies




USA

Dong

Wang

ZTE Corporation




China

Shuichi

Watanabe

Sharp Corporation




Japan

Krzysztof

Wegner

Poznan University of Technology




Poland

Xing

Wen

HKUST




China

Thomas

Wiegand

Fraunhofer HHI




Germany

Mathias

Wien

RWTH Aachen University




Germany

Menno

Wildeboer

Nagoya University




Japan

Michael

Winkelmann

Fraunhofer HHI - Heinrich Hertz Institute




Germany

Matthieu

Wipliez

IETR/INSA




France

Jing

Wu

Cisco system




China

Oliver

Wuebbolt

Technicolor




Germany

Ji

Xiangyang

Tsinghua University




China

Wei

Xiao

Huawei Technologies Co., Ltd.




China

Tomoo

Yamakage

Toshiba Corporation




Japan

Tomoyuki

Yamamoto

SHARP Corporation




Japan

Mingyuan

Yang

Huawei Technologies CO., LTD




China

Yanzi

Yang

ZTE Corporation




China

Sehoon

Yea

LG Electronics




Korea

Chuohao

Yeo

Institute for Infocomm Research




Singapore

Sunmi

Yoo

Kwangwoon University




Korea

Kyoungro

Yoon

Konkuk University




Korea

Tomonobu

Yoshino

KDDI




Japan

Junyong

You

NUST




Norway

Lu

Yu

Zhejiang University




China

Peiyu

Yue

Huawei Technologies




China

Kugjin

Yun

ETRI




Korea

Yongbing

Zhang

Tsinghua University




China

Renzhou

Zhang

Huawei




China

Li

Zhang

Peking University




China

Xin

Zhao

Peking University




China

Zhijie

Zhao

Leibniz Universitaet Hannover




Germany

Haishan

Zhong

Panasonic Singapore Laboratories




Singapore

Xiaosong

Zhou

Apple Inc.




USA

Minhua

Zhou

Texas Instruments Inc




USA

Yongwei

Zhu

Institute for Infocomm Research




Singapore

Waqar

Zia

LG Electronics




Germany




  1. Agenda





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