Submissions are invited in, but not limited to, the following areas

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The 2015 IEEE International Symposium on Power Line Communications and its Applications (ISPLC) is organized by the IEEE Technical Committee on Power Line Communications ( http://committees.comsoc.org/plc). The conference will be held March 29 to April 1, 2015, in downtown Austin in the Blanton Museum of Art Complex of The University of Texas at Austin campus.  Downtown Austin has a dynamic live music scene, hike & bike trails along the river, museums, and The University of Texas at Austin campus.

ISPLC 2015 will focus on key aspects of communications theory, algorithms, standards, measurements, and implementations pertaining to communications via power lines. Acceptance of submissions will be based on quality, relevance and originality. Accepted papers will be published in the ISPLC 2015 proceedings and IEEE Xplore. Proposals for special sessions are invited. The conference will also include keynote and plenary talks as well as an industry forum and exhibition.

Submissions are invited in, but not limited to, the following areas:

• PLC for smart grids

• Cognitive, cooperative, and autonomous approaches

• Modulation, coding and signal processing for PLC

• Electromagnetic compatibility, interference and coupling issues

• Multiple access techniques and protocols for PLC networks

• Cross-layer optimization and service integration

• System architectures and security issues

• PLC standardization

• Channel characterization, modeling, experimental systems, field trials

• Emerging PLC-related technologies

Important dates:

Proposals for special sessions October 27, 2014

Submission of full papers November 10, 2014

Notification of acceptance January 5, 2015

Camera-ready papers due February 2, 2015

To be published in the IEEE ISPLC 2015 Conference Proceedings and to be eligible for publication in IEEE Xplore, at least one of the authors of an accepted paper is required to register for the conference at the full (member or non-member) rate and the paper must be presented by an author of that paper at the conference unless a TPC Co-Chair grants permission for a substitute presenter arranged in advance of the event and who is qualified both to present and answer questions. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper. For authors with multiple accepted papers, one full registration is valid for up to 3 papers. Accepted and presented papers will be published in the IEEE ISPLC 2015 Conference Proceedings and submitted to IEEE Xplore. Please see http://www.ieee-isplc.org.

http://www.ieee-isplc.org/

Organizing Committee

General Co-Chairs

Brian Evans, Univ. of Texas at Austin, USA

Alexis Kwasinski, Univ. of Pittsburg, Pittsburg, PA USA

Technical Program Co-Chairs

Naofal Al-Dhahir, Univ. of Texas at Dallas, USA

Anand Dabak, Texas Inst., Dallas, Texas USA

Haniph Latchman, Univ. of Florida, Gainesville, FL USA



IEEE Liaison – Publicity, Registration, Management

Bridget Erlikh, USA



TPC Members

Kaywan Afkhamie, Qualcomm, Ocala, Florida USA

José Antonio Arrabal, Univ. of Málaga, Spain

Anuj Batra, Texas Inst., Dallas, Texas USA

Mauro Biagi, Sapienza Univ. of Rome, Italy

Gerd Bumiller, Hochschule Ruhr West, Germany

Francisco Canete, Univ. of Málaga, Spain

Marco Chiani, Univ. di Bologna, Bologna, Italy

Sangho Choe, Catholic Univ. Korea, Bucheon, Korea

Virginie Degardin, Univ. of Lille, Lille, France

Klaus Dostert, Karlsruhe Inst. of Tech., Germany

Gianluigi Ferrari, Univ. of Parma, Parma, Italy

Cecilia Galarza, Univ. of Buenos Aires, Argentina







Stefano Galli, ASSIA Inc., Redwood City, CA USA

Vincent Guillet, Landis + Gyr, France

Jean-Francois Helard, INSA, Rennes, France

Halid Hrasnica, Eurescom, Heidelberg, Germany

Salvador Iranzo, Marvell Hispania, Paterna, Spain

Makoto Itami, Tokyo Univ. of Science, Tokyo, Japan

Masaaki Katayama, Nagoya Univ., Japan

Cornelis Kikkert, James Cook Univ., Australia

Seong-Cheol Kim, Seoul Nat. Univ., Seoul, Korea

Michael Koch, DeVolo, Aachen, Germany

Lutz Lampe, Univ. British Columbia, Canada

Jae-Jo Lee, Korea Electrotechnology Research Institute

Ralf Lehnert, Tech. Univ. of Dresden, Germany

Victor Loginov, Maxim Int. Prod., Irvine, CA USA

Josemaria Malgosa-Sanahuja, UPCT, Cartagena, Spain

Anil Mengi, DeVolo, Aachen, Germany

Fabienne Nouvel, INSA, Rennes, France

Riccardo Pighi, Selta, Milan, Italy

Pedro Jose Pinero, Atmel, Zaragoza, Spain

Srinivasa Prasanna, Indian Inst. Tech., Bombay, India

Riccardo Raheli, Univ. of Parma, Parma, Italy

Marco Raugi, Univ. of Pisa, Pisa, Italy

Moises Ribeiro, Univ. Fed. de Juiz de Fora, Brazil

Mehmet Safak, Hacettepe Univ., Ankara, Turkey

Alfredo Sanz, Univ. of Zaragoza, Zaragoza, Spain

Pierre Siohan, Orange Labs, Cesson Sévigné, France

Driton Statovci, FTW, Vienna, Austria

Hongjian Sun, Durham Univ., Durham, UK

Yuhao Sun, Univ. of Cambridge, Cambridge, UK

Theo Swart, Univ. of Johannesburg, South Africa

Andrea Tonello, Univ. of Udine, Udine, Italy

Shinji Tsuzuki, Ehime Univ., Matsuyama, Japan

Daisuke Umehara, Kyoto Inst. of Tech., Japan

Petrus Janse van Rensburg, WSU, South Africa

Fabio Versolatto, Univ. of Udine, Udine, Italy

Han Vinck, Univ. of Duisburg-Essen, Germany

Khurram Waheed, Freescale, Austin, Texas USA

Stephan Weiss, Univ. of Strathclyde, Scotland

Fang Yang, Tsinghua Univ., Beijing, P.R. China

Li Zhang, Univ. of Leeds, Leeds, UK



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Call for Papers

March 29-April 1, 2015

Austin, Texas USA




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